TW201613008A - An apparatus and method for checking FOUP bottom plate - Google Patents
An apparatus and method for checking FOUP bottom plateInfo
- Publication number
- TW201613008A TW201613008A TW103132090A TW103132090A TW201613008A TW 201613008 A TW201613008 A TW 201613008A TW 103132090 A TW103132090 A TW 103132090A TW 103132090 A TW103132090 A TW 103132090A TW 201613008 A TW201613008 A TW 201613008A
- Authority
- TW
- Taiwan
- Prior art keywords
- image
- bottom plate
- checking
- screw
- processing unit
- Prior art date
Links
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
An apparatus and method for checking FOUP bottom plate are provided. The apparatus includes an image-capturing unit, a screw assembly and a processing unit, and the processing unit is electrically connected to the image-capture unit and the screw assembly. The image-capturing unit is movably disposed under the bottom plate of the FOUP and controlled by the processing unit for capturing a screw-hole image to determine whether each of screw holes has a screw. The screw assembly is disposed immediately adjacent to the image-capturing unit and controlled by the processing unit for checking whether each of the screws is fastened.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW103132090A TWI571951B (en) | 2014-09-17 | 2014-09-17 | An apparatus and method for checking foup bottom plate |
CN201410513730.1A CN105428268A (en) | 2014-09-17 | 2014-09-29 | Pedestal inspection device and method for wafer transfer box |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW103132090A TWI571951B (en) | 2014-09-17 | 2014-09-17 | An apparatus and method for checking foup bottom plate |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201613008A true TW201613008A (en) | 2016-04-01 |
TWI571951B TWI571951B (en) | 2017-02-21 |
Family
ID=55506379
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW103132090A TWI571951B (en) | 2014-09-17 | 2014-09-17 | An apparatus and method for checking foup bottom plate |
Country Status (2)
Country | Link |
---|---|
CN (1) | CN105428268A (en) |
TW (1) | TWI571951B (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI665749B (en) * | 2017-02-02 | 2019-07-11 | 南韓商相生技術有限公司 | Test dummy for precision transfer position measurement using the semiconductor system or disply system and precision transfer positon measurement method using the test dummy |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108807245B (en) * | 2017-04-26 | 2021-03-26 | 台湾积体电路制造股份有限公司 | Transport box and semiconductor process element transmission system |
CN109273384B (en) * | 2018-09-07 | 2021-08-06 | 上海华岭集成电路技术股份有限公司 | Adjusting device suitable for detect wafer magazine that loads |
TWI764620B (en) * | 2021-03-12 | 2022-05-11 | 旭東機械工業股份有限公司 | Apparatus and method for inspecting the bottom surface of wafer box |
US11752582B1 (en) | 2022-02-15 | 2023-09-12 | Taiwan Semiconductor Manufacturing Company, Ltd. | Methods for removing a fastener from a wafer carrier |
TWI821968B (en) * | 2022-04-06 | 2023-11-11 | 致茂電子股份有限公司 | Wafer carrier and wafer inspection method |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3679690B2 (en) * | 2000-07-12 | 2005-08-03 | 東京エレクトロン株式会社 | Substrate processing equipment |
KR100568869B1 (en) * | 2004-05-17 | 2006-04-10 | 삼성전자주식회사 | Methog and device for controlling cassette position of semiconductor production device |
CN101622525A (en) * | 2007-02-28 | 2010-01-06 | 株式会社尼康 | Observation device, inspection device and inspection method |
JP4966693B2 (en) * | 2007-02-28 | 2012-07-04 | 株式会社日立ハイテクノロジーズ | Sample conveying apparatus and method |
CN201488952U (en) * | 2009-07-09 | 2010-05-26 | 精湛机械有限公司 | Detection device |
EP2693461B1 (en) * | 2011-04-15 | 2015-11-25 | Wuxi Huaying Microelectronics Technology Co., Ltd. | Semiconductor processing device |
TWM442897U (en) * | 2012-05-24 | 2012-12-11 | Tera Automation Corp Ltd | Auto-locking screw-locking mechanism |
TWM447987U (en) * | 2012-10-23 | 2013-03-01 | San Shing Fastech Corp | Pin unit of detection device |
-
2014
- 2014-09-17 TW TW103132090A patent/TWI571951B/en active
- 2014-09-29 CN CN201410513730.1A patent/CN105428268A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI665749B (en) * | 2017-02-02 | 2019-07-11 | 南韓商相生技術有限公司 | Test dummy for precision transfer position measurement using the semiconductor system or disply system and precision transfer positon measurement method using the test dummy |
Also Published As
Publication number | Publication date |
---|---|
TWI571951B (en) | 2017-02-21 |
CN105428268A (en) | 2016-03-23 |
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