TW201613008A - An apparatus and method for checking FOUP bottom plate - Google Patents

An apparatus and method for checking FOUP bottom plate

Info

Publication number
TW201613008A
TW201613008A TW103132090A TW103132090A TW201613008A TW 201613008 A TW201613008 A TW 201613008A TW 103132090 A TW103132090 A TW 103132090A TW 103132090 A TW103132090 A TW 103132090A TW 201613008 A TW201613008 A TW 201613008A
Authority
TW
Taiwan
Prior art keywords
image
bottom plate
checking
screw
processing unit
Prior art date
Application number
TW103132090A
Other languages
Chinese (zh)
Other versions
TWI571951B (en
Inventor
Chih-Cheng Liang
yuan-jun Huang
Original Assignee
Inotera Memories Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Inotera Memories Inc filed Critical Inotera Memories Inc
Priority to TW103132090A priority Critical patent/TWI571951B/en
Priority to CN201410513730.1A priority patent/CN105428268A/en
Publication of TW201613008A publication Critical patent/TW201613008A/en
Application granted granted Critical
Publication of TWI571951B publication Critical patent/TWI571951B/en

Links

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

An apparatus and method for checking FOUP bottom plate are provided. The apparatus includes an image-capturing unit, a screw assembly and a processing unit, and the processing unit is electrically connected to the image-capture unit and the screw assembly. The image-capturing unit is movably disposed under the bottom plate of the FOUP and controlled by the processing unit for capturing a screw-hole image to determine whether each of screw holes has a screw. The screw assembly is disposed immediately adjacent to the image-capturing unit and controlled by the processing unit for checking whether each of the screws is fastened.
TW103132090A 2014-09-17 2014-09-17 An apparatus and method for checking foup bottom plate TWI571951B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW103132090A TWI571951B (en) 2014-09-17 2014-09-17 An apparatus and method for checking foup bottom plate
CN201410513730.1A CN105428268A (en) 2014-09-17 2014-09-29 Pedestal inspection device and method for wafer transfer box

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW103132090A TWI571951B (en) 2014-09-17 2014-09-17 An apparatus and method for checking foup bottom plate

Publications (2)

Publication Number Publication Date
TW201613008A true TW201613008A (en) 2016-04-01
TWI571951B TWI571951B (en) 2017-02-21

Family

ID=55506379

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103132090A TWI571951B (en) 2014-09-17 2014-09-17 An apparatus and method for checking foup bottom plate

Country Status (2)

Country Link
CN (1) CN105428268A (en)
TW (1) TWI571951B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI665749B (en) * 2017-02-02 2019-07-11 南韓商相生技術有限公司 Test dummy for precision transfer position measurement using the semiconductor system or disply system and precision transfer positon measurement method using the test dummy

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108807245B (en) * 2017-04-26 2021-03-26 台湾积体电路制造股份有限公司 Transport box and semiconductor process element transmission system
CN109273384B (en) * 2018-09-07 2021-08-06 上海华岭集成电路技术股份有限公司 Adjusting device suitable for detect wafer magazine that loads
TWI764620B (en) * 2021-03-12 2022-05-11 旭東機械工業股份有限公司 Apparatus and method for inspecting the bottom surface of wafer box
US11752582B1 (en) 2022-02-15 2023-09-12 Taiwan Semiconductor Manufacturing Company, Ltd. Methods for removing a fastener from a wafer carrier
TWI821968B (en) * 2022-04-06 2023-11-11 致茂電子股份有限公司 Wafer carrier and wafer inspection method

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3679690B2 (en) * 2000-07-12 2005-08-03 東京エレクトロン株式会社 Substrate processing equipment
KR100568869B1 (en) * 2004-05-17 2006-04-10 삼성전자주식회사 Methog and device for controlling cassette position of semiconductor production device
CN101622525A (en) * 2007-02-28 2010-01-06 株式会社尼康 Observation device, inspection device and inspection method
JP4966693B2 (en) * 2007-02-28 2012-07-04 株式会社日立ハイテクノロジーズ Sample conveying apparatus and method
CN201488952U (en) * 2009-07-09 2010-05-26 精湛机械有限公司 Detection device
EP2693461B1 (en) * 2011-04-15 2015-11-25 Wuxi Huaying Microelectronics Technology Co., Ltd. Semiconductor processing device
TWM442897U (en) * 2012-05-24 2012-12-11 Tera Automation Corp Ltd Auto-locking screw-locking mechanism
TWM447987U (en) * 2012-10-23 2013-03-01 San Shing Fastech Corp Pin unit of detection device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI665749B (en) * 2017-02-02 2019-07-11 南韓商相生技術有限公司 Test dummy for precision transfer position measurement using the semiconductor system or disply system and precision transfer positon measurement method using the test dummy

Also Published As

Publication number Publication date
TWI571951B (en) 2017-02-21
CN105428268A (en) 2016-03-23

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