CN105428268A - Pedestal inspection device and method for wafer transfer box - Google Patents
Pedestal inspection device and method for wafer transfer box Download PDFInfo
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- CN105428268A CN105428268A CN201410513730.1A CN201410513730A CN105428268A CN 105428268 A CN105428268 A CN 105428268A CN 201410513730 A CN201410513730 A CN 201410513730A CN 105428268 A CN105428268 A CN 105428268A
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- 238000012546 transfer Methods 0.000 title claims abstract description 118
- 238000000034 method Methods 0.000 title claims abstract description 26
- 238000007689 inspection Methods 0.000 title claims abstract description 24
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 title claims abstract description 10
- 238000012545 processing Methods 0.000 claims abstract description 74
- 238000012360 testing method Methods 0.000 claims description 42
- 239000000428 dust Substances 0.000 claims description 23
- 230000004308 accommodation Effects 0.000 claims description 18
- 230000003028 elevating effect Effects 0.000 claims description 10
- 230000007246 mechanism Effects 0.000 claims description 10
- 230000005540 biological transmission Effects 0.000 abstract 1
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 6
- 238000010586 diagram Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 229910052757 nitrogen Inorganic materials 0.000 description 3
- 241001269238 Data Species 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 238000012790 confirmation Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
The invention provides a pedestal inspection device and method for a wafer transfer box. The pedestal inspection device of the wafer transmission box comprises an image acquisition unit, a locking component and a processing unit, wherein the processing unit is electrically connected with the image acquisition unit and the locking component. The image acquisition unit is movably arranged below the base to acquire an opening image of at least one opening. The image acquisition unit acquires the images of the open holes under the control of the processing unit and judges whether a screw is arranged in each open hole. The locking assembly is adjacent to the image acquisition unit and movably arranged below the base. When the threaded pieces are arranged in the openings, the locking assembly checks whether each threaded piece is locked or not through the control of the processing unit.
Description
Technical field
The present invention, about a kind of base testing fixture of wafer transfer box (FrontOpeningUnifiedPod, FOUP) and method, refers in particular to and a kind ofly checks that the locked condition of multiple screw elements of wafer transfer box base carries out the device and method checked.
Background technology
In manufacture of semiconductor, usually wafer can be put into wafer transfer box (FOUP), to carry out carrying or taking care of.Wafer transfer box has chamber and base, and its middle chamber is used for isolating the environmental exposure of wafer and wafer frame peripheral, to avoid wafer to be polluted, and is fixedly arranged on by base on the microscope carrier of wafer loader (LoadPortUnit, LPU).Base is typically provided with multiple screwed hole, makes to utilize multiple screw element to interfix between base and chamber.
In the prior art, when utilize screw element that base is fixed on cavity bottom, employing manual work is still.Establish a capital identical because the screw element length that is threaded mutually with these screwed holes and kind differ, therefore operating personnel must utilize different spanners, different types of screw element could be locked in corresponding screwed hole.If operating personnel misapplies spanner, screw element is likely made to be locked.Be handled upside down process at wafer transfer box, the screw element be not locked likely loosens, and causes haulage equipment fault.
In addition, operating personnel can only with visual or whether each screw element of manual confirmation is locked really.But, because the quantity of screwed hole is many, therefore for operating personnel, to confirm that the program whether each screw element has been locked is quite loaded down with trivial details one by one, also comparatively inconvenience.
Summary of the invention
In order to reduce the probability that screw element loosens because not having to lock, the invention provides a kind of wafer transfer box base testing fixture and method, can check wafer transfer box base.
The embodiment of the present invention provides a kind of wafer transfer box base testing fixture, in order to check the fastening situation of multiple screw elements of wafer transfer box base.Wafer transfer box base testing fixture comprises image capturing unit, locked assembly and processing unit, and wherein processing unit is electrically connected with image capturing unit and locked assembly.Image capturing unit is arranged at below base movably, to obtain the perforate image of at least one perforate.Image capturing unit to obtain the image of described perforate, and judges whether there is a screw element in perforate described in each by the control of processing unit.Locked assembly is adjacent with image capturing unit and be arranged at movably below described base.When there being described screw element in each perforate, locked assembly by the control of processing unit, to check whether each screw element locks.
Another embodiment of the present invention provides a kind of inspection method of wafer transfer box base, and wherein multiple basal surface positions of the base of wafer transfer box are respectively equipped with multiple perforate.Wafer transfer box base inspection method comprises the wafer transfer box base testing fixture providing above-mentioned; Wafer transfer box is positioned on wafer transfer box base testing fixture; The base of wafer transfer box is obtained to the perforate image of at least one perforate, to judge whether there is a screw element in each perforate; And when there being screw element in each perforate, check whether screw element described in each locks.
In sum, the wafer transfer box base testing fixture that the embodiment of the present invention provides and method, can check automatically to multiple screw elements of wafer transfer box base.Image capturing unit in wafer transfer box base testing fixture, can take multiple perforate images of base one by one, to be confirmed whether the situations such as scarce screw element or screw element loosen.When finding that perforate has scarce screw element or screw element not to lock, can directly utilize locking tool that screw element is secured to criterion of acceptability.Accordingly, the time that operating personnel checks the screw element of wafer transfer box base can be saved, and the artificial probability checking error can be reduced.
In order to further understand technology of the present invention, refer to the following detailed description and the accompanying drawings.But appended accompanying drawing and annex only provide reference and explanation use, are not used for being limited the present invention.
Accompanying drawing explanation
Fig. 1 shows the perspective exploded view of the wafer transfer box base testing fixture of one embodiment of the invention.
Fig. 2 shows the upper schematic diagram of wafer transfer box base.
Fig. 3 shows the enlarged drawing of the locked assembly of the embodiment of the present invention.
Fig. 4 shows the functional block diagram of the wafer transfer box base testing fixture of the embodiment of the present invention.
The schematic side view that the base of image capturing unit to wafer transfer box that Fig. 5 shows the embodiment of the present invention checks.
The schematic side view that the screw element of locked assembly to the base of wafer transfer box that Fig. 6 A shows the embodiment of the present invention checks.
Fig. 6 B shows the schematic side view of the screw element of the base of the locked assembly locking wafer transfer box of the embodiment of the present invention.
Fig. 7 shows the flow chart of the wafer transfer box inspection method of the embodiment of the present invention.
Symbol description:
1: wafer transfer box base testing fixture
2: wafer transfer box
20: base
200: perforate
21: screw element
10: carrier
100: shaped as frame supporting part
10a: loading end
101: spatial accommodation
102: frame mouth
103: shield
11: image capturing unit
12: locked assembly
120: assembling pedestal
121: locking tool
121a: CD-ROM drive motor
121b: tool bar
121c: torsion torque sensor
122: elevating mechanism
13: processing unit
14: positioning component
140: the first fixtures
141: the second fixtures
A ~ K: basal surface position
15: moving assembly
150:X shaft mechanical arm
151:Y shaft mechanical arm
152:Z shaft mechanical arm
16: micronic dust disposable box
160: through hole
17: micronic dust guide element
18: suction element
S100 ~ S108: process step
Embodiment
Below in conjunction with accompanying drawing and embodiment, the present invention is described in further detail.Hereinafter, will illustrate that embodiments of the invention describe the present invention in detail by accompanying drawing, and the same reference numbers in accompanying drawing can in order to element like representation class.Aforesaid and other technology contents, feature and effect for the present invention, in the following detailed description coordinated with reference to each embodiment of accompanying drawing, can clearly present.
The direction term mentioned in following examples, such as: " on ", D score, "front", "rear", "left", "right" etc., be only the direction with reference to attached drawings.Therefore, the direction term of use is used to illustrate, and is not used for limiting the present invention.Further, in following each embodiment, adopt identical label to represent identical or approximate element.
Please refer to Fig. 1 and Fig. 2.Fig. 1 shows the perspective exploded view of the wafer transfer box base testing fixture of one embodiment of the invention.Fig. 2 shows the upper schematic diagram of wafer transfer box base.Must first illustrate, the wafer transfer box 2 of the present embodiment comprises placing the container (non-label) of multiple wafer and base 20.Multiple basal surface positions of base 20 are provided with multiple perforate 200.Perforate 200 such as comprises screwed hole or places the consent of nitrogen valve, and wherein screwed hole can make base 20 be fixed on the bottom of container by multiple screw element 21.In the present embodiment, be so that technical characteristic of the present invention to be described for screwed hole.The wafer transfer box base testing fixture 1 of the embodiment of the present invention can be used for checking whether screw element 21 loosens by screwed hole, or in order to check whether the nitrogen valve in consent is inverted.
The wafer transfer box base testing fixture 1 of the embodiment of the present invention comprises carrier 10, image capturing unit 11, locked assembly 12 and processing unit 13, and wherein processing unit 13 is electrically connected image capturing unit 11 and locked assembly 12.
Carrier 10 is in order to place wafer transfer box 2.In the present embodiment, carrier 10 has shaped as frame supporting part 100, and has one and be positioned at spatial accommodation 101 below shaped as frame supporting part 100.Shaped as frame supporting part 100 in order to carry wafer transfer box 2 to be detected, and has a loading end 10a and the lower surface contrary with loading end 10a (non-label).Shaped as frame supporting part 100 is provided with a frame mouth 102, and frame mouth 102 extends to lower surface by loading end 10a.
In embodiments of the present invention, carrier 10 also comprises a shield 103, is arranged at movably on shaped as frame supporting part 100.When carrier 10 not being placed wafer transfer box 2, shield 103 is covering frame mouth 102 completely, and when wafer transfer box 2 to be detected is positioned on loading end 10a, frame mouth 102 can be covered completely.Now, shield 103 just can be removed by frame mouth 102, the base 20 of wafer transfer box 2 is exposed from frame mouth 102, thus exposes the multiple perforates 200 being opened in base 20, so that image capturing unit 11 and locked assembly 12 pairs of perforates 200 check.Accordingly, no matter whether carrier 10 places wafer transfer box 2, spatial accommodation 101 all can be made to keep airtight.
Referring again to Fig. 1, in embodiments of the present invention, wafer transfer box base testing fixture 1 also comprises a positioning component 14.Positioning component 14 is arranged on carrier 10, to position wafer transfer box 2.In one embodiment, positioning component 14 comprises a pair first fixtures 140 and a pair second fixtures 141 that are arranged on loading end 10a around frame mouth 102.For example, the first fixture 140 can carry out the location of X-direction to wafer transfer box 2, and the second fixture 141 can carry out the location of Y-direction to wafer transfer box.When wafer transfer box 2 is by location, each perforate 200 being positioned at base 20 also can be fixed relative to the position at frame mouth 102 edge.
The spatial accommodation 101 of carrier 10 in order to the subelement of accommodating wafer transfer box base testing fixture 1, such as: image capturing unit 11 and locked assembly 12, to check with the screw element 21 being positioned at perforate 200 multiple perforates 200 of base 20.
In addition, the wafer transfer box base testing fixture 1 of the embodiment of the present invention also can comprise the micronic dust guide element 17 being communicated in spatial accommodation 101, in order to bleed to spatial accommodation 101, spatial accommodation 101 is made to remain on the state of negative pressure, and the micronic dust removed in spatial accommodation 101, to avoid the micronic dust in spatial accommodation 101, wafer is polluted.
Image capturing unit 11 is arranged at below base 20 movably, is namely positioned at spatial accommodation 101, to obtain a perforate image of at least one described perforate 200.That is, when wafer transfer box 2 is positioned on shaped as frame supporting part 100, the base 20 that image capturing unit 11 can pass through frame mouth 102 pairs of wafer transfer boxes 2 is taken.
Because perforate 200 is the upper different basal surface positions being opened in base 20 respectively, image capturing unit 11 must sequentially move to different basal surface positions, to obtain the perforate image of these perforates 200.Please refer to Fig. 2, in the present embodiment, these perforates 200 are the basal surface position A ~ K being opened in base 20 respectively, and image capturing unit 11, by the control of processing unit 13, to obtain perforate image, and judges whether have screw element in perforate 200.Specifically, image capturing unit 11 sequentially can be moved into the below of basal surface position A ~ K, to take perforate 200.Perforate image accessed by image capturing unit 11, after processing unit 13 carries out image processing, can be used as the foundation judging whether to lack screw element 21 in perforate 200.
In addition, perforate 200, except comprising screwed hole, also comprises consent (non-label), and therefore in another embodiment, multiple perforate images that image capturing unit 11 obtains also can comprise consent image.Processing unit 13 also according to consent image, can judge whether the nitrogen valve being positioned over consent is inverted.Image capturing unit 11 can be CMOS (Complementary Metal Oxide Semiconductor) sensing element (ComplementaryMetal-Oxide-SemiconductorSensor, or charge coupled cell (Charge-CoupledDevice, CCD) CMOSSensor).
Locked assembly 12 is by the control of processing unit 13, and whether the screw element 21 being positioned at perforate 200 in order to inspection locks.Specifically, check in the 11 pairs of perforates 200 of image capturing unit, and after confirming there is screw element 21 in perforate 200, locked assembly 12 further double thread part 21 checks.Further, when screw element 21 is not locked, by locked assembly 12, screw element 21 is carried out fastening.
Locked assembly 12 is arranged at below base 20 movably, and adjacent with image capturing unit 11.In the present embodiment, locked assembly 12 is the spatial accommodations 101 being positioned at carrier 10.
Please refer to Fig. 1 and Fig. 3.Fig. 3 shows the enlarged drawing of the locked assembly of the embodiment of the present invention.In the present embodiment, locked assembly 12 comprises an assembling pedestal 120 and at least one locking tool 121, and wherein locking tool 121 is installed on assembling pedestal 120.
In the present embodiment, the number of locking tool 121 is two, can carry out terminal operation for the screw element 21 of identical or different kind, but the not special restriction in the present invention of the quantity of locking tool 121.In the present embodiment, each locking tool 121 has a CD-ROM drive motor 121a, a tool bar 121b and a torsion torque sensor 121c, and wherein the output shaft of CD-ROM drive motor 121a is connected to tool bar 121b, and torsion torque sensor 121c is then arranged on tool bar 121b.Rotate when CD-ROM drive motor 121a orders about tool bar 121b, when carrying out fastening with double thread part 21, the torque value that torsion torque sensor 121c produces in order to measuring tool bar 121b.In the present embodiment, torsion torque sensor 121c is electrically connected with processing unit 13, is sent to processing unit 13 with the torque value produced by locking tool 121.Locking tool 121 can be torque spanner or torsion screwdriver.
In addition, locked assembly 12 also can comprise two elevating mechanisms 122.Further, elevating mechanism 122 is arranged on assembling pedestal 120.Each locking tool 121 is arranged on an elevating mechanism 122 respectively, to be individually elevated.That is, when wherein a locking tool 121 is by when wherein an elevating mechanism 122 rises, another locking tool 121 still rests on height and position originally.Accordingly, can avoid when the screw element 21 that a wherein locking tool 121 rises to contact base 20 is to carry out locking operation, the also rising simultaneously and mutually interfering with base 20 of another locking tool 121.Elevating mechanism 122 is all electrically connected on processing unit 13, to accept the control of processing unit 13.
In addition, in the present embodiment, wafer transfer box base testing fixture 1 also comprises a micronic dust disposable box 16, is arranged between locking tool 121 and base 20, to collect the micronic dust that locking tool 121 carries out producing when locking operation.In the embodiments of figure 3, the bottom of micronic dust disposable box 16 has at least one through hole 160, arranges corresponding to the position of locking tool 121.When the non-double thread part 21 of locking tool 121 carries out locking operation, be positioned at below micronic dust disposable box 16.When locking tool 121 needs double thread part 21 to carry out locking operation, elevating mechanism 122 drives a wherein locking tool 121 to rise through through hole 160, carries out locking operation with double thread part 21.
In addition, the wafer transfer box base testing fixture 1 of the embodiment of the present invention also comprises a suction element 18, is communicated in micronic dust disposable box 16, to get rid of micronic dust collected in micronic dust disposable box 16.Because wafer transfer box 2 usually in order to carry wafer in dust free room, but when locking tool 121 double thread part 21 carries out locking operation, likely produce micronic dust, and wafer is polluted, therefore, utilize micronic dust disposable box 16 to arrange in pairs or groups suction element 18 in the present embodiment, the base 20 that can be reduced in wafer transfer box 2 is examined in process, the contaminated probability of wafer.
Be noted that in addition and make image capturing unit 11 and locked assembly 12 be arranged at technological means below wafer transfer box 2 movably, can pass through any existing technological means and realize, the present invention is not as limit.For example, in embodiments of the present invention, be utilize moving assembly 15 to reach above-mentioned purpose.
Moving assembly 15 can be arranged in spatial accommodation 101, and image capturing unit 11 and locked assembly 12 are co-located on moving assembly 15.Further, moving assembly 15 is electrically connected on processing unit 13, to accept the control of processing unit 13, image capturing unit 11 and described locked assembly 12 is moved to below at least one described perforate 200.Specifically, moving assembly 15 comprises X-axis mechanical arm 150, Y-axis mechanical arm 151 and Z axis mechanical arm 152, moves to multiple basal surface position A ~ K in order to make image capturing unit 11 and locked assembly 12.
Continue referring to Fig. 4.Fig. 4 shows the functional block diagram of the wafer transfer box base testing fixture of the embodiment of the present invention.Processing unit 13 is electrically connected with above-mentioned positioning component 14, image capturing unit 11, locked assembly 12, moving assembly 15 and micronic dust guide element 17, to manipulate the start of each element.
When wafer transfer box 2 is placed on carrier 10, the controlled positioning component 14 processed of processing unit 13 first positions wafer transfer box 2.In addition, store the coordinate data of image capturing unit 11 and the coordinate data of locked assembly 12 in processing unit 13, these coordinate datas correspond respectively to the position of perforate 200.Processing unit 13 according to aforesaid coordinate data, can control moving assembly 15 and image capturing unit 11 and locked assembly 12 is sequentially moved to below the perforate 200 of examine.Processing unit 13 also can control micronic dust guide element 17 continued operation, to be taken away by the micronic dust in spatial accommodation 101, and makes spatial accommodation 101 maintain negative pressure state.In other embodiments, processing unit 13 also can control above-mentioned shield 103 and whether close frame mouth 102, or whether control suction element 18 is unlocked.
Processing unit 13 can comprise one or more processor, controller, microprocessor, microcontroller, application-specific integrated circuit (ASIC), digital signal processor, programmable logic device, field-programmable lock array and memory etc. or its any combination.But the present invention does not limit the type of processing unit 13.
Please refer to Fig. 4 and Fig. 5.The schematic side view that the base of image capturing unit to wafer transfer box that Fig. 5 shows the embodiment of the present invention checks.
In Figure 5, processing unit 13 controls after image capturing unit 11 moves to the below of corresponding basal surface position A and basal surface position B, then controls image capturing unit 11 and obtain perforate image.Subsequently, processing unit 13 receives and analyzes perforate image, and carries out image processing for perforate image.In addition, processing unit 13 also can judge whether lack screw element 21 in perforate 200 according to perforate image.
When processing unit 13 judges to lack screw element 21 in perforate 200, alarm unit (not shown) can be controlled and send alarm signal, remind operating personnel to carry out subsequent treatment.In addition, processing unit 13 can record the basal surface position of perforate 200 on base 20 lacking screw element.After the multiple wafer transfer box 2 of inspection, processing unit 13 can add up the number of times lacking screw element 21 in each perforate 200, to calculate the probability lacking screw element 21 at the basal surface position at each perforate 200 place.For example, operating personnel can collect objective data according to the record of processing unit 13, lack whether screw element 21 is regular situation with the perforate 200 judging to be positioned at basal surface position A, and be conducive to operating personnel and find out the reason causing screw element to drop, thus improve.
When not lacking screw element 21 in perforate 200, processing unit 13 controls locked assembly 12 double thread part 21 more further and checks.Please refer to Fig. 6 A, the screw element of the base of the locked assembly locking wafer transfer box of the display embodiment of the present invention carries out the schematic side view checked.
In the present embodiment, the wherein locking tool 121 in the controlled locked assembly 12 processed of processing unit 13 sequentially move to be positioned at basal surface position C and basal surface position D perforate 200 below, to check the screw element 21 in perforate 200.Specifically, processing unit 13 can control a wherein elevating mechanism 122, drives locking tool 121 to rise, to check whether screw element 21 is secured to qualified standard.
In addition, the CD-ROM drive motor 121a of locking tool 121 and torsion torque sensor 121c is all coupled to processing unit 13.When after tool bar 121b tip contact screw element 21, processing unit 13 controls CD-ROM drive motor 121a further and drives tool bar 121b to rotate, and according to the torque value that torsion torque sensor 121c detects, judges whether screw element 21 is secured to criterion of acceptability.
Please refer to the schematic side view that Fig. 6 A and Fig. 6 B, Fig. 6 B shows the screw element of the base of the locked assembly locking wafer transfer box of the embodiment of the present invention.For example, when the screw element 21 of the perforate 200 being positioned at basal surface position C is not locked, the tool bar 121b of locking tool 121 can rotate by the drive of CD-ROM drive motor 121a, until screw element 21 is turned tight.Now, the perforate 200 being positioned at basal surface position C also can be recorded, using the foundation analyzed as operating personnel by processing unit 13.When processing unit 13 detects that screw element 21 is turned tight, then control image capturing unit 11 and continue to check the screw element 21 of the perforate 200 being positioned at another basal surface position D with locked assembly 12.
Another embodiment of the present invention provides a kind of wafer transfer box base inspection method.Please refer to Fig. 7, the flow chart of the wafer transfer box base inspection method of its display embodiment of the present invention.As previously mentioned, multiple basal surface positions of the base of wafer transfer box are respectively equipped with multiple perforate, to be threaded with multiple screw element respectively.Furthermore, the some in these perforates is screwed hole, make the container of wafer transfer box and base fastening by multiple screw element.
First, in the step s 100, providing the base testing fixture of wafer transfer box, such as, is the wafer transfer box base testing fixture shown by Fig. 1.
In step S101, wafer transfer box is positioned on the base testing fixture of wafer transfer box.Specifically, in this step, wafer transfer box to be detected will be placed on plummer, and be positioned wafer transfer box by processing unit control positioning component.
In step S102, perforate image is obtained to the base of wafer transfer box.Specifically, be the perforate image utilizing the base of image capturing unit to wafer transfer box to obtain at least one perforate, to judge whether there is a screw element in perforate.In one embodiment, in processing unit, stored the coordinate data of multiple image capturing unit, and these coordinate datas correspond to the basal surface position of different perforates.Accordingly, processing unit can control below image capturing cell moving to each perforate, to obtain perforate image according to coordinate data.
In step s 103, whether screw element is had according in the perforate of perforate scope interpretation.In the present embodiment, image capturing unit is sent to processing unit after obtaining perforate image.Processing unit will carry out image processing to perforate image, to judge whether lack screw element in corresponding perforate.When processing unit judges do not have screw element in perforate, wafer transfer box base inspection method then carries out step S104.When processing unit judges there is screw element in perforate, wafer transfer box base inspection method then carries out step S105.
In step S104, determine and record the basal surface position of the perforate without screw element, and sending alarm signal.Specifically, when processing unit judges do not have screw element in perforate, to determine according to the coordinate data of image capturing unit and the perforate of recording without screw element is positioned at the basal surface position of base.After the multiple wafer transfer box of inspection, processing unit can add up position lacks screw element number of times in the perforate of each basal surface position, and obtains a statistical form.According to statistical form, processing unit can calculate the probability lacking screw element in the perforate of each basal surface position.Accordingly, operating personnel can find out the perforate being positioned at which basal surface position and be easier to scarce screw element, thus finds out related causes and improve.
In addition, processing unit can send alarm signal, to remind operating personnel that the perforate to scarce screw element processes.The mode that processing unit sends alarm signal such as controls screen display alarm signal through another, or through alarm unit, as: buzzer or indicator light, sound or light, remind operating personnel.
In step S105, check whether the screw element in perforate locks.Specifically, when processing unit is not according to when lacking screw element in the perforate of perforate scope interpretation, be control locked assembly to move to below perforate, check with double thread part.Further, when locked assembly rotation screw element checks, torque value can be fed back to processing unit.After processing unit receives torque value, then judge whether the screw element in perforate is secured to criterion of acceptability according to torque value.
When the screw element that processing unit judges in perforate is not locked, wafer transfer box base inspection method then carries out step S106.When judging the screw element locking in screwed hole when processing unit, wafer transfer box base inspection method then carries out step S107.
In step s 106, locking screw part also records the basal surface position that the corresponding perforate of the screw element of not locking is positioned at base.Furthermore, when the screw element that processing unit judges in perforate is not locked, except controlling locking tool, screw element being secured to except criterion of acceptability, also can being positioned at the basal surface position of base to record perforate, using the foundation improved as later analysis.
In step s 107, be confirmed whether that all perforates are all examined.When all perforates on base are all examined, wafer transfer box base inspection method then carries out step S108.When also having perforate not examined, repeat step S102 ~ S108.
In the present embodiment, be, after completing and whether have the inspection of screw element to same perforate and complete inspection that whether screw element be locked, just repeat to check to the perforate of another position.But in another embodiment, after also whether can lacking screw element in all perforates of inspection, more sequentially check whether the screw element in perforate is locked.
In step S108, unloading wafer transfer box.In the present embodiment, after completing the inspection of all perforates, processing unit can control positioning component and unclamp wafer transfer box, makes wafer transfer box can by unloaded on plummer, to proceed another wafer transfer box to check.
In sum, the wafer transfer box base testing fixture that the embodiment of the present invention provides and method, can check automatically to multiple screw elements of wafer transfer box base.Image capturing unit in wafer transfer box base testing fixture, can take multiple perforate images of base one by one, to be confirmed whether that scarce screw element or screw element such as not to lock at the situation.When finding that perforate has scarce screw element or screw element not to be locked, locking tool can be directly utilized to carry out locking operation to the screw element of not locking.Accordingly, the time that operating personnel checks the screw element of wafer transfer box base can be saved, and the artificial probability checking error can be reduced.
In addition, when the wafer transfer box base testing fixture of the embodiment of the present invention be checked through perforate lack screw element or screw element do not turn tight time, the basal surface position be positioned on base not turning tight perforate without the perforate of screw element or screw element can be recorded, to analyze the foundation of improvement as operating personnel in the future, reduce board because whorl of base part loosens the probability of fault.
The foregoing is only preferred embodiment of the present invention, not in order to limit the present invention, all within spirit of the present invention and principle, any amendment made, equivalent replacement, improvement etc., all should be included within the scope of protection of the invention.
Claims (15)
1. a base testing fixture for wafer transfer box, wherein said wafer transfer box has a base, and multiple basal surface position places of described base are provided with multiple perforate, it is characterized in that the base testing fixture of described wafer transfer box comprises:
One image capturing unit, can be arranged at below described base movably, to obtain a perforate image of at least one described perforate;
One locked assembly is adjacent with described image capturing unit and can be arranged at below described base movably; And
One processing unit, is electrically connected with described image capturing unit and described locked assembly, and wherein, described image capturing unit obtains described perforate image by the control of described processing unit, and judges whether there is a screw element in perforate described in each;
Wherein, when there being described screw element in perforate described in each, by the control of described processing unit, described locked assembly checks whether screw element described in each locks.
2. the base testing fixture of wafer transfer box according to claim 1, when described screw element is not locked, is locked described screw element by described locked assembly.
3. the base testing fixture of wafer transfer box according to claim 1, at least one locking tool that wherein said locked assembly comprises an assembling pedestal and is installed on described assembling pedestal, wherein said locking tool has a torsion torque sensor, described torsion torque sensor is electrically connected with described processing unit, is sent to described processing unit with the torque value produced by described locking tool.
4. the base testing fixture of wafer transfer box according to claim 3, also comprise a micronic dust disposable box, described micronic dust disposable box is arranged between described locking tool and described base, in order to collect the micronic dust that described locking tool carries out producing when locking operation.
5. the base testing fixture of wafer transfer box according to claim 3, wherein said locked assembly comprises two described locking tools, and locking tool described in each is all arranged on described assembling pedestal.
6. the base testing fixture of wafer transfer box according to claim 5, locking tool described in each all comprises a CD-ROM drive motor and a tool bar, described CD-ROM drive motor is respectively in order to drive corresponding described tool bar to rotate, to carry out locking operation to described screw element.
7. the base testing fixture of wafer transfer box according to claim 5, locking tool described in each is all arranged on an elevating mechanism, to be elevated respectively, wherein said elevating mechanism is electrically connected on described processing unit, to accept the control of described processing unit.
8. the base testing fixture of wafer transfer box according to claim 1, also comprise a moving assembly, described image capturing unit and described locked assembly are arranged on described moving assembly jointly, wherein said moving assembly is electrically connected on described processing unit, described image capturing unit and described locked assembly is moved to below at least one described perforate to accept the control of described processing unit.
9. the base testing fixture of wafer transfer box according to claim 8, wherein said moving assembly comprises an X-axis mechanical arm, a Y-axis mechanical arm and a Z axis mechanical arm, moves to multiple described basal surface position to make described image capturing unit and described locked assembly.
10. the base testing fixture of wafer transfer box according to claim 1, also comprise a carrier, the spatial accommodation that described carrier has a shaped as frame supporting part and is positioned at below described shaped as frame supporting part, wherein said shaped as frame supporting part is in order to carry described wafer transfer box and to have a frame mouth, when described wafer transfer box is positioned over described shaped as frame supporting part, multiple described perforate is exposed, so that described image capturing unit and described locked assembly check multiple described perforate by described frame mouth.
The base testing fixture of 11. wafer transfer boxes according to claim 10, also comprises the micronic dust guide element being communicated in described spatial accommodation, in order to bleed to described spatial accommodation, to remove the micronic dust in described spatial accommodation.
The base testing fixture of 12. wafer transfer boxes according to claim 10, also comprises a positioning component, and described positioning component is arranged on described carrier, to position described wafer transfer box.
The base inspection method of 13. 1 kinds of wafer transfer boxes, multiple basal surface position places of the base of wherein said wafer transfer box are respectively equipped with multiple perforate, it is characterized in that the base inspection method of described wafer transfer box comprises:
The base testing fixture of the wafer transfer box according to any one of claim 1 to 12 is provided;
Described wafer transfer box is positioned on the base testing fixture of described wafer transfer box;
The described base of described wafer transfer box is obtained to a perforate image of at least one perforate, to judge whether there is a screw element in perforate described in each; And
When there being described screw element in perforate described in each, check whether screw element described in each locks.
The base inspection method of 14. wafer transfer boxes according to claim 13, also comprises when not having described screw element in described perforate, determines and records the described basal surface position of described perforate on described base without described screw element.
The base inspection method of 15. wafer transfer boxes according to claim 14, also comprise when described screw element is not locked, described screw element is locked, and records the corresponding described basal surface position of described perforate on described base of the described screw element of not locking.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW103132090 | 2014-09-17 | ||
| TW103132090A TWI571951B (en) | 2014-09-17 | 2014-09-17 | An apparatus and method for checking foup bottom plate |
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| Publication Number | Publication Date |
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| CN105428268A true CN105428268A (en) | 2016-03-23 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201410513730.1A Pending CN105428268A (en) | 2014-09-17 | 2014-09-29 | Pedestal inspection device and method for wafer transfer box |
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| Country | Link |
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| CN (1) | CN105428268A (en) |
| TW (1) | TWI571951B (en) |
Cited By (3)
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| CN108807245A (en) * | 2017-04-26 | 2018-11-13 | 台湾积体电路制造股份有限公司 | Feeder and manufacture of semiconductor element transmission system |
| CN109273384A (en) * | 2018-09-07 | 2019-01-25 | 上海华岭集成电路技术股份有限公司 | Suitable for detecting the regulating device for loading wafer magazine |
| TWI821968B (en) * | 2022-04-06 | 2023-11-11 | 致茂電子股份有限公司 | Wafer carrier and wafer inspection method |
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| KR101987895B1 (en) * | 2017-02-02 | 2019-06-12 | 주식회사 투윈테크 | Test dummy for precision transfer position measurement using the semiconductor system or display system and precision transfer position measurement method using the test dummy |
| TWI764620B (en) * | 2021-03-12 | 2022-05-11 | 旭東機械工業股份有限公司 | Apparatus and method for inspecting the bottom surface of wafer box |
| US11752582B1 (en) | 2022-02-15 | 2023-09-12 | Taiwan Semiconductor Manufacturing Company, Ltd. | Methods for removing a fastener from a wafer carrier |
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Also Published As
| Publication number | Publication date |
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| TW201613008A (en) | 2016-04-01 |
| TWI571951B (en) | 2017-02-21 |
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