MX165505B - Mejoras en metodo para crear un diseño en relieve en un substrato duro y liso, y aparato para ser usado en el metodo - Google Patents

Mejoras en metodo para crear un diseño en relieve en un substrato duro y liso, y aparato para ser usado en el metodo

Info

Publication number
MX165505B
MX165505B MX003755A MX375586A MX165505B MX 165505 B MX165505 B MX 165505B MX 003755 A MX003755 A MX 003755A MX 375586 A MX375586 A MX 375586A MX 165505 B MX165505 B MX 165505B
Authority
MX
Mexico
Prior art keywords
dry film
smooth surface
photopolymer layer
negative
photoresist material
Prior art date
Application number
MX003755A
Other languages
English (en)
Inventor
William F Pentak
Dewey L Burkes
Original Assignee
Vacuum Applied Coatings Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Vacuum Applied Coatings Corp filed Critical Vacuum Applied Coatings Corp
Publication of MX165505B publication Critical patent/MX165505B/es

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/161—Coating processes; Apparatus therefor using a previously coated surface, e.g. by stamping or by transfer lamination
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/12—Production of screen printing forms or similar printing forms, e.g. stencils
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/34—Imagewise removal by selective transfer, e.g. peeling away
    • G03F7/343—Lamination or delamination methods or apparatus for photolitographic photosensitive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0079—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the method of application or removal of the mask
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0082—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the exposure method of radiation-sensitive masks

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Laminated Bodies (AREA)
  • Surface Treatment Of Glass (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)

Abstract

La presente invención se refiere a un método para formar un diseño en relieve en la superficie lisa de un substrato duro, caracterizado porque comprende los pasos de: (a) separar la capa de desprendimiento de polietileno de una hoja laminada de material fotorresistente de película seca; (b) aplicar las capas restantes del material fotorresistente de película seca, a la temperatura ambiente, a la superficie lisa del substrato duro, con la capa de fotopolímero del material fotorresistente de película seca directamente en contacto con la superficie lisa; (c) colocar un negativo del diseño encima de la superficie lisa, revestida con el material fotorresistente de película seca; teniendo el negativo áreas oscuras y transparentes, (d) exponer el material fotorresistente de película seca a través de las áreas transparentes del negativo, a una intensidad de luz ultravioleta durante un tiempo sólo suficiente para colocar el diseño sobre el material fotorresistente de película seca, polimerizando solamente la superficie de la capa de fotopolímero; (e) retirar la capa protectora de poliéster del material fotorresistente de película seca, dejando la capa de fotopolímero sobre el substrato; (f) eliminar de la superficie lisa una porción de la capa de fotopolímero en la forma del diseño, rociando la capa de fotopolímero con una solución reveladora para eliminar las porciones de la capa de fotopolímero que estaban detrás de las áreas oscuras del negativo, durante la exposición; (g) eliminar la superficie lisa del substrato duro, a una profundidad deseada, sobre el área de la superficie lisa en donde se ha quitado la capa de fotopolímero; y (h) retirar la porción restante de la capa de fotopolímero.
MX003755A 1985-09-18 1986-09-18 Mejoras en metodo para crear un diseño en relieve en un substrato duro y liso, y aparato para ser usado en el metodo MX165505B (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/777,243 US4652513A (en) 1985-09-18 1985-09-18 Method for creating a design in relief in a hard smooth substrate and apparatus for use in the method

Publications (1)

Publication Number Publication Date
MX165505B true MX165505B (es) 1992-11-17

Family

ID=25109698

Family Applications (1)

Application Number Title Priority Date Filing Date
MX003755A MX165505B (es) 1985-09-18 1986-09-18 Mejoras en metodo para crear un diseño en relieve en un substrato duro y liso, y aparato para ser usado en el metodo

Country Status (7)

Country Link
US (1) US4652513A (es)
EP (1) EP0236483A1 (es)
JP (1) JPS63500965A (es)
AU (1) AU592119B2 (es)
CA (1) CA1260266A (es)
MX (1) MX165505B (es)
WO (1) WO1987001827A2 (es)

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US5236542A (en) * 1990-11-15 1993-08-17 E. I. Du Pont De Nemours And Company Off-press laminating apparatus
WO1993015442A1 (en) * 1992-01-29 1993-08-05 The Chromaline Corporation Rolled, pre-imaged sandblast masks
US5415971A (en) * 1993-04-02 1995-05-16 The Chromaline Corporation Photoresist laminate including photoimageable adhesive layer
US5688366A (en) * 1994-04-28 1997-11-18 Canon Kabushiki Kaisha Etching method, method of producing a semiconductor device, and etchant therefor
US6350558B1 (en) 1999-10-05 2002-02-26 Rainer Gocksch Method of making decorative panels
US6291260B1 (en) * 2000-01-13 2001-09-18 Siliconware Precision Industries Co., Ltd. Crack-preventive substrate and process for fabricating solder mask
US6379749B2 (en) 2000-01-20 2002-04-30 General Electric Company Method of removing ceramic coatings
US6238743B1 (en) * 2000-01-20 2001-05-29 General Electric Company Method of removing a thermal barrier coating
KR20010035391A (ko) * 2001-02-09 2001-05-07 윤계춘 석판상에 사진 또는 그림을 가공하는 방법
KR20020096120A (ko) * 2001-06-18 2002-12-31 전귀동 비석용 사진조각판 및 그 제조방법
DE10260235B4 (de) * 2002-12-20 2010-10-28 Infineon Technologies Ag Verfahren zum Strukturieren einer Resistschicht und Negativ-Resistschicht
US20050144821A1 (en) * 2003-11-06 2005-07-07 Griesemer Daniel A. Printing surface preparation methods and apparatus incorporating same
US20060226202A1 (en) * 2005-04-11 2006-10-12 Ho-Ching Yang PCB solder masking process
US20080277972A1 (en) * 2007-05-10 2008-11-13 Bonofiglio Jr Ronald William Roller Skid Plate with Quick Disconnect Isolation Mounts
KR101295251B1 (ko) * 2012-12-04 2013-08-09 주식회사 라온이노텍 투명 디스플레이부 이미지 멀티 증착 방법

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US2129460A (en) * 1937-02-05 1938-09-06 Bluem Frederick Limestone slab and method of coloring same
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Also Published As

Publication number Publication date
JPS63500965A (ja) 1988-04-07
WO1987001827A3 (en) 1987-07-16
WO1987001827A2 (en) 1987-03-26
EP0236483A1 (en) 1987-09-16
US4652513A (en) 1987-03-24
CA1260266A (en) 1989-09-26
AU592119B2 (en) 1990-01-04
AU6377286A (en) 1987-04-07

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