MX147594A - Aparato semiconductor mejorado - Google Patents
Aparato semiconductor mejoradoInfo
- Publication number
- MX147594A MX147594A MX17927279A MX17927279A MX147594A MX 147594 A MX147594 A MX 147594A MX 17927279 A MX17927279 A MX 17927279A MX 17927279 A MX17927279 A MX 17927279A MX 147594 A MX147594 A MX 147594A
- Authority
- MX
- Mexico
- Prior art keywords
- semiconductor device
- improved semiconductor
- improved
- semiconductor
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP53117100A JPS5846061B2 (ja) | 1978-09-22 | 1978-09-22 | 半導体装置 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| MX147594A true MX147594A (es) | 1982-12-16 |
Family
ID=14703391
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| MX17927279A MX147594A (es) | 1978-09-22 | 1979-09-13 | Aparato semiconductor mejorado |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPS5846061B2 (es) |
| MX (1) | MX147594A (es) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59952A (ja) * | 1982-06-25 | 1984-01-06 | Hitachi Ltd | 車両用半導体装置 |
-
1978
- 1978-09-22 JP JP53117100A patent/JPS5846061B2/ja not_active Expired
-
1979
- 1979-09-13 MX MX17927279A patent/MX147594A/es unknown
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5543877A (en) | 1980-03-27 |
| JPS5846061B2 (ja) | 1983-10-14 |
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