MA29314B1 - Procede de fabrication d'un dispositif micro-electronique a fonctionnement sans contact, notamment pour passeport electronique - Google Patents

Procede de fabrication d'un dispositif micro-electronique a fonctionnement sans contact, notamment pour passeport electronique

Info

Publication number
MA29314B1
MA29314B1 MA30189A MA30189A MA29314B1 MA 29314 B1 MA29314 B1 MA 29314B1 MA 30189 A MA30189 A MA 30189A MA 30189 A MA30189 A MA 30189A MA 29314 B1 MA29314 B1 MA 29314B1
Authority
MA
Morocco
Prior art keywords
thickness
perforated sheet
cavity
microelectronic chip
micro
Prior art date
Application number
MA30189A
Other languages
English (en)
French (fr)
Inventor
Olivier Brunet
Jean-Francois Salvo
Ivan Peytavin
Original Assignee
Smart Packaging Solutions Sps
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Smart Packaging Solutions Sps filed Critical Smart Packaging Solutions Sps
Publication of MA29314B1 publication Critical patent/MA29314B1/fr

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07758—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for adhering the record carrier to further objects or living beings, functioning as an identification tag
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01057—Lanthanum [La]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01058—Cerium [Ce]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Power Engineering (AREA)
  • Credit Cards Or The Like (AREA)
  • Devices For Checking Fares Or Tickets At Control Points (AREA)
MA30189A 2005-02-11 2007-08-31 Procede de fabrication d'un dispositif micro-electronique a fonctionnement sans contact, notamment pour passeport electronique MA29314B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0501378A FR2882174B1 (fr) 2005-02-11 2005-02-11 Procede de fabrication d'un dispositif microelectronique a fonctionnement sans contact notamment pour passeport electronique

Publications (1)

Publication Number Publication Date
MA29314B1 true MA29314B1 (fr) 2008-03-03

Family

ID=34980170

Family Applications (1)

Application Number Title Priority Date Filing Date
MA30189A MA29314B1 (fr) 2005-02-11 2007-08-31 Procede de fabrication d'un dispositif micro-electronique a fonctionnement sans contact, notamment pour passeport electronique

Country Status (7)

Country Link
US (1) US7992790B2 (de)
EP (1) EP1846875A1 (de)
CN (1) CN101203869B (de)
FR (1) FR2882174B1 (de)
MA (1) MA29314B1 (de)
RU (1) RU2464635C2 (de)
WO (1) WO2006084984A1 (de)

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2919409B1 (fr) 2007-07-26 2009-09-04 Smart Packaging Solutions Sps Document securise a puce sans contact avec protection des donnees contre les lectures non autorisees.
MX2010002872A (es) 2007-09-14 2010-04-09 Toppan Printing Co Ltd Hoja de antena, transpondedor y cuaderno.
FR2941316A1 (fr) * 2009-01-16 2010-07-23 Smart Packaging Solutions Sps Procede de fabrication d'un module electronique, notamment pour dispositif d'identification a puce electronique
US20100295286A1 (en) * 2009-05-13 2010-11-25 Goldstein Keith E Cover and method of manufacturing the same
JP2013505851A (ja) * 2009-08-10 2013-02-21 サン−ゴバン パフォーマンス プラスティックス コーポレイション フルオロポリマー／微粒子充填保護シート
US8474726B2 (en) 2010-08-12 2013-07-02 Feinics Amatech Teoranta RFID antenna modules and increasing coupling
US8366009B2 (en) 2010-08-12 2013-02-05 Féinics Amatech Teoranta Coupling in and to RFID smart cards
EP2369616A1 (de) * 2010-03-22 2011-09-28 Gemalto SA Herstellungsverfahren eines elektronischen Moduls mit einem elektronischen Chip montiert auf einem Substrat mit einer Antenne
WO2013020971A1 (en) 2011-08-08 2013-02-14 Féinics Amatech Teoranta Improving coupling in and to rfid smart cards
US8991712B2 (en) 2010-08-12 2015-03-31 Féinics Amatech Teoranta Coupling in and to RFID smart cards
US8870080B2 (en) 2010-08-12 2014-10-28 Féinics Amatech Teoranta RFID antenna modules and methods
EP2603883A2 (de) 2010-08-12 2013-06-19 Féinics Amatech Teoranta Limited Rfid-antennenmodule und erhöhte kopplung
US9033250B2 (en) 2010-08-12 2015-05-19 Féinics Amatech Teoranta Dual interface smart cards, and methods of manufacturing
US9195932B2 (en) 2010-08-12 2015-11-24 Féinics Amatech Teoranta Booster antenna configurations and methods
US8789762B2 (en) 2010-08-12 2014-07-29 Feinics Amatech Teoranta RFID antenna modules and methods of making
US9112272B2 (en) 2010-08-12 2015-08-18 Feinics Amatech Teoranta Antenna modules for dual interface smart cards, booster antenna configurations, and methods
CN102622639B (zh) * 2011-01-28 2014-09-17 中国机动车辆安全鉴定检测中心 电子护照元件层制作方法
DE102011001722A1 (de) * 2011-04-01 2012-10-04 Bundesdruckerei Gmbh Halbzeug zur Herstellung eines Chipkartenmoduls, Verfahren zur Herstellung des Halbzeuges sowie Verfahren zur Herstellung einer Chipkarte
US9390364B2 (en) 2011-08-08 2016-07-12 Féinics Amatech Teoranta Transponder chip module with coupling frame on a common substrate for secure and non-secure smartcards and tags
AU2011374571A1 (en) 2011-08-08 2014-02-20 Feinics Amatech Teoranta Improving coupling in and to RFID smart cards
BR112014005507A2 (pt) 2011-09-11 2017-06-13 Féinics Amatech Teoranta módulos de antena rfid e métodos de fabricação
JP2015511353A (ja) 2012-02-05 2015-04-16 フェイニクス アマテック テオランタ Ｒｆｉｄアンテナ・モジュールおよび方法
EP2811427A1 (de) 2013-06-07 2014-12-10 Gemalto SA Herstellungsverfahren einer reißfesten elektronischen Vorrichtung
WO2017040973A1 (en) * 2015-09-04 2017-03-09 The Trustees Of Columbia University In The City Of New York Micron-scale ultrasound identification sensing tags
DE102016106698A1 (de) * 2016-04-12 2017-10-12 Infineon Technologies Ag Chipkarte und Verfahren zum Herstellen einer Chipkarte
CN108235792B (zh) * 2016-10-21 2021-01-26 京瓷株式会社 标签用基板、rfid标签以及rfid系统
DE102017103411A1 (de) * 2017-02-20 2018-08-23 Bundesdruckerei Gmbh Verfahren zur Herstellung eines Inlays für einen Folienverbund eines Sicherheits- und/oder Wertdokumentes sowie Inlay
US10282654B2 (en) * 2017-07-09 2019-05-07 Interlake Research, Llc Tag assembly methods

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5528222A (en) * 1994-09-09 1996-06-18 International Business Machines Corporation Radio frequency circuit and memory in thin flexible package
FR2743649B1 (fr) * 1996-01-17 1998-04-03 Gemplus Card Int Module electronique sans contact, carte etiquette electronique l'incorporant, et leurs procedes de fabrication
FR2761497B1 (fr) * 1997-03-27 1999-06-18 Gemplus Card Int Procede de fabrication d'une carte a puce ou analogue
US6404643B1 (en) * 1998-10-15 2002-06-11 Amerasia International Technology, Inc. Article having an embedded electronic device, and method of making same
US6100804A (en) * 1998-10-29 2000-08-08 Intecmec Ip Corp. Radio frequency identification system
AU6270599A (en) * 1999-07-01 2001-01-22 Intermec Ip Corp. Integrated circuit attachment process and apparatus
RU2257614C2 (ru) * 1999-12-23 2005-07-27 Награид Са Электронная этикетка (варианты)
FR2824018B1 (fr) * 2001-04-26 2003-07-04 Arjo Wiggins Sa Couverture incorporant un dispositif d'identification radiofrequence
US20040062016A1 (en) * 2002-09-27 2004-04-01 Eastman Kodak Company Medium having data storage and communication capabilites and method for forming same
US7233498B2 (en) * 2002-09-27 2007-06-19 Eastman Kodak Company Medium having data storage and communication capabilities and method for forming same
US8286332B2 (en) * 2006-09-26 2012-10-16 Hid Global Gmbh Method and apparatus for making a radio frequency inlay
CN104899080A (zh) 2014-03-05 2015-09-09 腾讯科技（深圳）有限公司 即时通讯切换实时画面的方法和装置

Also Published As

Publication number Publication date
CN101203869B (zh) 2016-03-30
FR2882174B1 (fr) 2007-09-07
RU2007133794A (ru) 2009-03-20
CN101203869A (zh) 2008-06-18
US20090057414A1 (en) 2009-03-05
RU2464635C2 (ru) 2012-10-20
EP1846875A1 (de) 2007-10-24
WO2006084984A1 (fr) 2006-08-17
FR2882174A1 (fr) 2006-08-18
US7992790B2 (en) 2011-08-09

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