CN101203869B - 用于电子护照等的非接触微电子装置的制造方法 - Google Patents
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Abstract
制造主要用于电子护照的无触点微电子装置(20)的方法,按照该方法:-在薄而柔性的衬底(21)上形成天线(27);-在所述衬底(21)上放置穿孔薄片(22),后者在其厚度上包括至少一个空腔(23);-将微电子芯片(24)放入该穿孔薄片(22)的各空腔(23)内,并将该微电子芯片的引出接点(24)连接到该天线(27)相应的端子(26);-密封空腔(23)封闭该芯片,保护这样连线后的微电子芯片(24);该方法的特征在于,薄而柔性的衬底(21)和穿孔薄片(22)均具有薄的厚度,且经过校准,大致均匀且平整,其总厚度小于约350微米,穿孔薄片(22)厚度恒定且略大于该微电子芯片(24)的厚度,从而获得平整、无隆起的完美制品。
Description
技术领域
本发明涉及制造射频识别装置的方法和通过使用该方法而获得的识别装置结构。本发明还涉及利用该识别装置来制造可靠且不能伪造的身份证件,例如电子护照。
背景技术
在现有技术中已知制造射频识别装置的方法,按照该方法将由连接到天线的微电子芯片构成射频电子装置放置在绝缘衬底上。然后,在装有由该芯片和该天线组成的电子装置的衬底上面层叠在一层或几层准备用来保护和集成该电子电路的可或多或少缩减的材料。
这些已知的方法和所得的装置有几个缺点。因而,这些已知的制造过程大部分往往导致该装置相当厚,约0.6毫米或更大,或比较不均匀,当这些装置须被用来制造诸如电子护照等电子身份证件时尤为不利。新的电子护照在其机械强度和使用寿命方面有非常严格的规格,使用寿命必须是几年,特别是在欧洲要长达10年。
另一方面,今天要求这些射频识别装置须允许以不过大的厚度集成在诸如护照等身份证件的页面中,而且要具有尺寸和机械特性,特别是柔性,且必须与这些证件的规格相符。
发明内容
因而,本发明的一个目标是提出一种可以制造使用时非常可靠的射频识别装置的方法。本发明的另一目标是,该方法允许制造可适应各种用途的射频识别装置,得益于大量制造,因而单元成本低。事实上,考虑到要提供给安全机构(诸如某些国家的安全机构)大量的识别装置,重要的是掌握这样一种制造射频识别装置的技术,该技术要非常简单,就所考虑的用途而言制造成本低,同时具有足以保证所要求的使用寿命的可靠性。
本发明的另一目标是提出一种制造射频识别装置的方法,它允许可靠且重复地获得相当平整、厚度薄且非常均匀的识别装置,厚度约几百微米,例如,小于400微米。
为此,本发明旨在提供一种制造射频识别装置方法,包括以下步骤:
-在一个薄而柔性的衬底上面实现天线;
-在所述衬底上面放置一个在其厚度上包括至少一个空腔的穿孔薄片;
-在所述薄片的每一个空腔中放置一个微电子芯片,并在电气上将微电子芯片的引出接点连接到天线的相应端子上;
-封闭该空腔,封住芯片,以便保护微电子芯片和连线,
按照本发明的方法的特征在于,该薄而柔性的衬底和穿孔薄片各具小的厚度并经校准,大体上均匀且平整,其厚度总和小于约350微米,穿孔薄片的厚度一定,略微大于该微电子芯片的厚度。
这样,可获得一种相当平坦的没有隆起的识别装置,特别适合于方便地集成在电子护照的纸页中,而不会造成超厚度,和明显的不规则。
该方法用的柔性衬底和穿孔薄片最好是连续的卷材,通过连续的叠层装配多个电子识别装置,接着通过在两个连续的电子装置之间实现横向切割,使这样形成的电子装置单片化,
其优点是,形成卷材的穿孔薄片可在衬底的覆盖了粘接膜的一面上,叠层在该衬底上面。
按照本方法的一个变体,为了在电气上将微电子芯片的引出接点连接到天线端子,将芯片的与有引出接点的面相反的一面粘合在衬底上,使引出接点向空腔上方,所述空腔是横向的,在芯片的各引出接点和天线的相应端子之间用微丝进行连接。
按照该方法另一个变体,为了在电气上将微电子芯片的引出接点连接到天线的端子,将与有芯片引出接点的一面相反的芯片面粘合到衬底上,使其引出接点呈现朝向空腔的高度,并用淀积低粘度导电物质在芯片的每一个引出接点和天线相应端子之间进行连接。
按照该方法的又一变体,为了电连接微电子芯片的引出接点和天线的端子,将芯片有引出接点的一面粘合到衬底的连接到天线各个端子的导电凸起上。
按照该方法,为了封闭空腔以隐藏芯片,在空腔内,在微电子芯片和与天线端子连接的上面,灌入液体封装树脂,大致填充空腔的自由容积,接着使树脂聚合。这样,便获得一个相当平坦,不超厚度,特别是与空腔齐平的识别装置。
在该方法的另一变体中,穿孔薄片的空腔不是横向的,在芯片的引出接点和天线的端子之间进行连接之后,将穿孔薄片叠层在该衬底上,以封装每个空腔并保护微电子芯片。
本发明还涉及射频识别电子装置,其特征在于,它是用以上描述的制造方法获得的。
按照本发明,射频识别电子装置最好具有约14mm和约25mm之间的长度,约13mm和约19mm之间的宽度和小于约350微米的厚度。
其优点是,本发明的射频识别装置包括:
-薄衬底,带有一个具有引出接点的微电子芯片;以及
-天线,在该衬底实现,该天线的端子通过互连部分连接到微电子芯片相应的引出接点,
该识别装置的特征在于,它包括平整且穿孔的薄片,其厚度薄并经过校准,这个穿孔薄片机械上连接到衬底的一面,并包括一个空腔,其中放置芯片和互连部分,
-通过堆叠衬底和穿孔薄片而形成的整体,厚度小于约350微米。
本发明还旨在保护和利用前面描述的电子装置,用以制造一个包括一个或多个页面的电子护照,包含其携带者的识别信息,护照页中的一页包括一个能够接纳本发明的电子装置的空腔。
本发明最后涉及电子护照,其特征在于,护照中的至少一页包含凹进部分,其中插入并固化本发明的射频识别电子装置。
附图说明
参照附图阅读详细说明后,本发明的其它特性和优点将变得显而易见,其中:
-图1表示按照现有技术制造射频识别装置的方法;
-图2表示本发明制造方法的第一实施方式;
-图3表示图2中制造方法的一个变体;而
-图4表示按照本发明连续制造射频识别装置的方法。
具体实施方式
以下参照图1。
该图中,表示利用已知的技术制造的护照等产品用的电子装置10的一个剖面图。为了制造该装置,一个微电子模块1放置在支持薄片5上的薄片2的空腔3中。该微模块1备有天线(未示出)和连接到该天线的硅芯片4。为了填充该空腔3中和芯片4周围的空间,使用整平树脂来填充该空腔,然后利用具有与包含空腔的薄片2相同的性质的薄片6覆盖该空腔3。覆盖之后,电子模块10需要在炉内熟化(cuire),以便使整平树脂形成网状结构。但是,该操作有若干缺点。首先,它需要非常长的时间(数小时)并要求相当大的设备,诸如炉。另外,形成网状结构引起变形,由于整平树脂膨胀和随后的收缩,当目的在于获得非常薄的产品,诸如想要包括在护照中的产品时,这是不利的。另外,护照薄片制造商和他们的打印机用户,一般具有层叠诸如制造护照用的薄片所要求的技术诀窍,但是用树脂填充并熟化填充操作,护照等证件的制造商是完全不懂的,这使得制造护照用的电子模块的已知方法的实现复杂化。
以下参照图2,它是表示按本发明的制造方法以第一实施方式制造的射频识别装置20的剖面图。
每一射频识别装置20都包括一个衬底21,其上放置一个厚度小并校准过的薄片22,它以隔离片的方式对射频识别装置20经校准的精细厚度作出贡献。该薄片22在其厚度上包括一个或几个穿孔,穿透和不穿透的,并在要接纳源自经锯割而切断的小片(plaquette)的微电子芯片24的位置上形成预留位置即空腔23。为了便于描述,由于它所包含的穿孔,该薄片将称作“穿孔薄片”。在图2中的制造方法中,该穿孔薄片22的每个空腔23都是穿透的,使得该穿孔薄片22放置在衬底21上之后,微电子芯片24的引出接点仍旧可被接近,以建立与天线端子26的连接。
按照本发明,该衬底是较柔软的。它最好是,尽管不只是由聚酰亚胺或聚环氧化物制成,它最好是连续的并成卷包装,并至少在其一个面上用非常薄的粘接膜覆盖(未示出)。类似地,穿孔薄片22最好(但不仅仅)由聚对苯二甲酸已二酯或聚酰亚胺制成。更具体地说,它可以主要由属于聚醚酰亚胺(PEI)、聚酰亚胺或聚酯(聚乙烯苯二甲酸或PEN;聚对苯二甲酸已二酯或PET)族材料制成。之所以要选择这些材料是因为它们具有约2到4京帕(Gpa)的拉伸模量。
薄片22成卷包装,通过层叠在该衬底的正面而放置在衬底21上,该衬底被覆盖通过整理而获得的粘接膜,或“热熔”型(英语术语“hotmelt”)粘接膜,或压敏粘接剂。因而,通过例如,环氧树脂型的粘接剂提供两层21和22之间的粘附力。该粘接材料层的厚度取决于具体的要求,在5到70微米的范围内。
但是,不利用粘接剂,而利用材料本身,诸如PET自身的粘接特性也可以获得粘接。
为了保证减少这样装配的装配件的校准厚度,重要的是柔性衬底21和穿孔薄片22各自具有基本均匀的厚度,其厚度总和小于约350微米。穿孔薄片22的厚度一定且经校准。它比微电子芯片24略厚一些。
放入空腔23的芯片24,在衬底21和穿孔薄片22之间的界面层上,用胶水粘到衬底21,胶水可为电导体或电绝缘体(英语术语中称为“dieattach:芯片粘接”的工艺)。该芯片的有效面放置得使引出接点25朝向空腔23的开口。
该芯片的引出接点25利用已知的丝焊技术电连接到对应于天线27的端子26上,该丝焊技术乃是利用导线28和焊接剂将芯片24的引出接点25与印刷电路板的接触端子26连接。
应该指出,该芯片24和该天线27还可用另一种称为“FlipChip:倒装芯片”的技术在电气上互连,按照该技术使用带有金属或聚合物制的导电凸起的芯片粘接到衬底上,使得该芯片的包含该芯片引出接点的有效面向下(按照图2所示的方向)。电气上的互连由该衬底上的连接到该天线各端子的导电凸起保证。
又一种连接的可能性是利用“wiredeposition:导线淀积”技术,其中该芯片的与带有该引出接点的面相反的面粘接到衬底,使该引出接点朝向该空腔的顶部。然后,通过在该芯片的各引出接点和该天线相应的端子之间淀积低粘度导电物质,实现连接。
当完成电连接28时,在该体内连好线的芯片上涂保护层(英语术语称之为“potting:滴装”),就是保护该芯片24和焊好的连接导线28或导电凸起,当施加时,通过利用液体封装树脂,例如,具有硅氧烷环氧树脂或聚氨酯基的树脂填充空腔23的余下部分,随后使树脂聚合,使之固化。这样,该空腔23便被填充和隔断,获得一个特别薄的射频识别装置,具有经特别校准的厚度。
另外,其柔性可完美地适应不同的最终用途,因为本领域技术人员容易知道如何按照柔性和耐久性的要求特性,选择衬底材料21和该穿孔薄片22的柔性,以及封装树脂29的粘度。
该封装树脂29将从例如单组分、无溶剂、电绝缘的树脂选取,主要从环氧树脂或丙烯酸酯族选取。它们的聚合通过加热形成网状结构或紫外辐射或这两者来获得。它们在粘度方面的特性(25℃时的锥体平面粘度)范围400mPa.s(毫帕秒)到45000mPa.s,形成网状结构之后硬度特性等于60到90肖氏硬度D。
在本发明的射频识别装置20的尺寸方面,它们可以取决于最终用途,主要取决于由该天线的尺寸决定的要求(距离)范围。在实践中,用来进行短距离通信的包括在护照或其它类似的支持物内的识别装置20,尺寸上可特别小,例如,长度在约14毫米和约25毫米之间,宽度在约13毫米和约19毫米之间,厚度小于约350微米。
为获得一个厚度相对恒定的经校准的堆叠,该穿孔薄片22和该衬底的厚度允差须小于或等于20微米。
为了在衬底21上实现天线,将在绝缘基材,特别是聚酰亚胺或环氧树脂制的绝缘基材上,使用诸如蚀刻等减法过程、加入金属(特别是铜或铝)的过程或导电材料(导电的胶水或墨水)丝网印刷过程。按照具体的需要和使用的技术,该天线的厚度在2到70微米的数量级。
以下参照图3。在本发明的射频识别装置30的这个实施方案中,穿孔薄片22中的空腔即预留部分23不穿透。
在该实施方案中,开始先在衬底21上放置天线27。然后,将微电子芯片24粘接到衬底21上,与天线27的同一侧,利用以上描述的一种互连技术将该芯片24的接点25电连接到该天线的端子26。
在芯片24的引出接点25和该天线的端子26之间建立连接之后,将穿孔薄片22层叠在衬底21上,将空腔23封装并保护该微电子芯片。
以下参照图4。
该图表示衬底薄片21呈带条卷材配置,例如,长度为35毫米,超过亦为带条状的穿孔薄片22。该衬底带条21两侧有一系列驱动孔32,用来与层叠机(未示出)的齿配合,以驱动衬底带条21。该穿孔薄片的材料带条上设有一系列空腔23,彼此相隔规定的距离,其中每个都可以插入上述微电子芯片24和树脂29。在每一个空腔的底部可见到各天线的端子26,它们可通过已知技术中的一种,例如通过淀积导电材料,做在衬底带条21上。
按照本发明,衬底带条21上涂有粘接材料,而且穿孔薄片带条22由已知的层叠机层叠在一起。整个层叠过程,每一个空腔23都各自装上微电子芯片,它们电连接到该天线的端子,然后用封装树脂29填充每一个空腔23。然后,通过在该层叠带条(21,22)行走方向进行横向切割这样形成的电子装置,在连续的两个电子装置之间切割分离。
因此,该制造方法能够以每小时4000件以上的高速,以优异的可靠性,连续地制造本发明的电子装置(20,30)。
用本发明的方法获得的电子装置(20;30)是尺寸小、厚度薄且经校准的小片。然后主要用粘接、层叠或其它的已知的技术,可以将这些小片转移到准备用来制造护照或任何其它身份证件的诸如薄片等基材上。
Claims (13)
1.一种制造射频识别电子装置(20,30)的制造方法,包括以下步骤:
-在薄而柔性的衬底(21)上形成天线(27);
-在所述衬底(21)上设置在其厚度内包含至少一个空腔(23)的穿孔薄片(22);
-将一微电子芯片(24)放入所述穿孔薄片(22)的各空腔(23)中,并将该微电子芯片的引出接点(25)电连接到天线(27)的相应端子(26)上;
-密封装入该微电子芯片的空腔(23),保护已如此接线的微电子芯片(24);
其特征在于:所述薄而柔性的衬底(21)和穿孔薄片(22)各具有薄的厚度并经校准,均匀而平整,其总厚度小于350微米,所述穿孔薄片(22)的厚度恒定且略大于微电子芯片(24),所述射频识别电子装置没有超过空腔的额外厚度。
2.权利要求1所述的制造方法,其特征在于:所述柔性衬底(21)和所述穿孔薄片(22)连续并包装成卷材,多个射频识别电子装置(20,30)连续层叠地进行装配,然后在两个连续的射频识别电子装置(30)之间横向切开(33),以将如此形成的射频识别电子装置分割为单件。
3.以上权利要求中任一项所述的制造方法,其特征在于:所述穿孔薄片(22)包装成卷材,以层叠在衬底的有粘接膜覆盖的面上的方式设置在所述衬底(21)上。
4.权利要求1或2所述的制造方法,其特征在于:为将所述微电子芯片(24)的引出接点(25)电连接到所述天线的端子(26),将该微电子芯片的与包含该微电子芯片引出接点(25)的面相反的一面粘接到该衬底(21)上,并使引出接点(25)朝向该空腔(23)的顶部,所述空腔是穿透的,在所述微电子芯片(24)的各引出接点(25)和所述天线的相应端子(26)之间进行丝焊,实现连接(28)。
5.权利要求1或2所述的制造方法,其特征在于:为将所述微电子芯片(24)的引出接点(25)电连接到所述天线的端子(26),将所述微电子芯片的与包含该微电子芯片(24)引出接点(25)的面相反的一面粘接到衬底(21)上,以使其引出接点(25)朝向所述空腔(23)的顶部,通过在所述微电子芯片(24)的各引出接点(25)和所述天线的相应端子(26)之间淀积低粘度导电物质来建立连接。
6.权利要求1或2所述的制造方法,其特征在于:为将所述微电子芯片(24)的引出接点(25)电连接到所述天线的端子(26),将所述微电子芯片的包含该微电子芯片的引出接点的一面粘接到衬底的导电凸起上,该凸起连接到所述天线的各端子上。
7.权利要求1或2所述的制造方法,其特征在于:为了封闭包含所述微电子芯片(24)的空腔(23),在所述空腔(23)内对微电子芯片(24)和所述天线端子的连接部分(28)上设置液体封装树脂(29),以填满所述空腔(23)的自由容积,然后使树脂(29)聚合。
8.权利要求1或2所述的制造方法,其特征在于:所述穿孔薄片(22)的空腔(23)不穿透,在所述微电子芯片的引出接点和所述天线的端子之间建立连接后,将所述穿孔薄片(22)层叠在衬底(21)上,以将各空腔(23)封装并保护微电子芯片(24)。
9.一种射频识别电子装置(20,30),其特征在于:它凭借如以上权利要求中任一项所述的制造方法而获得。
10.权利要求9所述的射频识别电子装置(20,30),其特征在于:其长度在14毫米和25毫米之间,其宽度在13毫米和19毫米之间,其厚度小于350微米。
11.一种射频识别电子装置(20,30),包括:
-薄衬底(21),支承带有引出接点(25)的微电子芯片(24);以及
-天线(27),在所述衬底(21)上形成,其端子(26)通过互连部分(28)连接到所述微电子芯片(24)的相应引出接点(25);
-其特征在于:它包括平坦的穿孔薄片(22),其厚度薄且经校准,所述穿孔薄片(22)用机械方法固定在衬底(21)的一个面上,并包含空腔(23),其中设有微电子芯片(24)和互连部分(28),
-通过堆叠衬底(21)和穿孔薄片(22)而形成的装配件具有小于350微米的厚度,所述穿孔薄片(22)的厚度略大于微电子芯片(24),所述射频识别电子装置没有超过空腔的额外厚度。
12.使用权利要求10或11所述的射频识别电子装置(20,30)来制造护照的方法,所述护照包含一个或几个具有其携带者的识别信息的页面,该护照的页面之一包含适于装入所述射频识别电子装置(20,30)的空腔。
13.一种电子护照,其特征在于:其页面中的至少一页含有凹进部分,其中插入并固化如权利要求9至11中任一项所述的射频识别电子装置(20,30)。
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FR2941316A1 (fr) | 2009-01-16 | 2010-07-23 | Smart Packaging Solutions Sps | Procede de fabrication d'un module electronique, notamment pour dispositif d'identification a puce electronique |
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CA2860936A1 (en) | 2012-02-05 | 2013-08-08 | Feinics Amatech Teoranta | Rfid antenna modules and methods |
EP2811427A1 (fr) | 2013-06-07 | 2014-12-10 | Gemalto SA | Procédé de fabrication d'un dispositif électronique anti-fissuration |
WO2017040973A1 (en) * | 2015-09-04 | 2017-03-09 | The Trustees Of Columbia University In The City Of New York | Micron-scale ultrasound identification sensing tags |
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- 2005-02-11 FR FR0501378A patent/FR2882174B1/fr not_active Expired - Fee Related
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- 2006-02-03 US US11/884,123 patent/US7992790B2/en not_active Expired - Fee Related
- 2006-02-03 EP EP06709260A patent/EP1846875A1/fr not_active Withdrawn
- 2006-02-03 WO PCT/FR2006/000271 patent/WO2006084984A1/fr active Application Filing
- 2006-02-03 RU RU2007133794/08A patent/RU2464635C2/ru not_active IP Right Cessation
- 2006-02-03 CN CN200680011238.8A patent/CN101203869B/zh not_active Expired - Fee Related
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2007
- 2007-08-31 MA MA30189A patent/MA29314B1/fr unknown
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US6100804A (en) * | 1998-10-29 | 2000-08-08 | Intecmec Ip Corp. | Radio frequency identification system |
EP1406209A2 (en) * | 2002-09-27 | 2004-04-07 | Eastman Kodak Company | Non-contact card with transponder placed in cavity of the card |
Also Published As
Publication number | Publication date |
---|---|
CN101203869A (zh) | 2008-06-18 |
EP1846875A1 (fr) | 2007-10-24 |
FR2882174B1 (fr) | 2007-09-07 |
RU2464635C2 (ru) | 2012-10-20 |
US7992790B2 (en) | 2011-08-09 |
US20090057414A1 (en) | 2009-03-05 |
RU2007133794A (ru) | 2009-03-20 |
WO2006084984A1 (fr) | 2006-08-17 |
FR2882174A1 (fr) | 2006-08-18 |
MA29314B1 (fr) | 2008-03-03 |
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