WO2006084984A1 - Procede de fabrication d’un dispositif micro-electronique a fonctionnement sans contact, notamment pour passeport electronique - Google Patents
Procede de fabrication d’un dispositif micro-electronique a fonctionnement sans contact, notamment pour passeport electronique Download PDFInfo
- Publication number
- WO2006084984A1 WO2006084984A1 PCT/FR2006/000271 FR2006000271W WO2006084984A1 WO 2006084984 A1 WO2006084984 A1 WO 2006084984A1 FR 2006000271 W FR2006000271 W FR 2006000271W WO 2006084984 A1 WO2006084984 A1 WO 2006084984A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- chip
- antenna
- substrate
- cavity
- perforated sheet
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07758—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for adhering the record carrier to further objects or living beings, functioning as an identification tag
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/93—Batch processes
- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01013—Aluminum [Al]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01057—Lanthanum [La]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01058—Cerium [Ce]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/102—Material of the semiconductor or solid state bodies
- H01L2924/1025—Semiconducting materials
- H01L2924/10251—Elemental semiconductors, i.e. Group IV
- H01L2924/10253—Silicon [Si]
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Power Engineering (AREA)
- Credit Cards Or The Like (AREA)
- Devices For Checking Fares Or Tickets At Control Points (AREA)
Abstract
Description
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200680011238.8A CN101203869B (zh) | 2005-02-11 | 2006-02-03 | 用于电子护照等的非接触微电子装置的制造方法 |
EP06709260A EP1846875A1 (fr) | 2005-02-11 | 2006-02-03 | Procede de fabrication d'un dispositif micro-electronique a fonctionnement sans contact, notamment pour passeport electronique |
US11/884,123 US7992790B2 (en) | 2005-02-11 | 2006-02-03 | Method of producing a contactless microelectronic device, such as for an electronic passport |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0501378 | 2005-02-11 | ||
FR0501378A FR2882174B1 (fr) | 2005-02-11 | 2005-02-11 | Procede de fabrication d'un dispositif microelectronique a fonctionnement sans contact notamment pour passeport electronique |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2006084984A1 true WO2006084984A1 (fr) | 2006-08-17 |
Family
ID=34980170
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/FR2006/000271 WO2006084984A1 (fr) | 2005-02-11 | 2006-02-03 | Procede de fabrication d’un dispositif micro-electronique a fonctionnement sans contact, notamment pour passeport electronique |
Country Status (7)
Country | Link |
---|---|
US (1) | US7992790B2 (fr) |
EP (1) | EP1846875A1 (fr) |
CN (1) | CN101203869B (fr) |
FR (1) | FR2882174B1 (fr) |
MA (1) | MA29314B1 (fr) |
RU (1) | RU2464635C2 (fr) |
WO (1) | WO2006084984A1 (fr) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
RU2471232C2 (ru) * | 2007-09-14 | 2012-12-27 | Топпан Принтинг Ко., Лтд. | Антенный лист, ретранслятор и буклет |
Families Citing this family (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2919409B1 (fr) | 2007-07-26 | 2009-09-04 | Smart Packaging Solutions Sps | Document securise a puce sans contact avec protection des donnees contre les lectures non autorisees. |
FR2941316A1 (fr) * | 2009-01-16 | 2010-07-23 | Smart Packaging Solutions Sps | Procede de fabrication d'un module electronique, notamment pour dispositif d'identification a puce electronique |
WO2010132117A1 (fr) * | 2009-05-13 | 2010-11-18 | American Bank Note Company | Couverture et procédé de fabrication de cette couverture |
RU2508202C2 (ru) * | 2009-08-10 | 2014-02-27 | Сэнт-Гобен Перформанс Пластикс Корпорейшн | Фторполимерный содержащий порошковый наполнитель защитный лист |
US8474726B2 (en) | 2010-08-12 | 2013-07-02 | Feinics Amatech Teoranta | RFID antenna modules and increasing coupling |
US8366009B2 (en) | 2010-08-12 | 2013-02-05 | Féinics Amatech Teoranta | Coupling in and to RFID smart cards |
EP2369616A1 (fr) * | 2010-03-22 | 2011-09-28 | Gemalto SA | Procédé de fabrication d'un module électronique comportant une puce électronique fixée sur un substrat contenant une antenne |
US8789762B2 (en) | 2010-08-12 | 2014-07-29 | Feinics Amatech Teoranta | RFID antenna modules and methods of making |
US9033250B2 (en) | 2010-08-12 | 2015-05-19 | Féinics Amatech Teoranta | Dual interface smart cards, and methods of manufacturing |
US9112272B2 (en) | 2010-08-12 | 2015-08-18 | Feinics Amatech Teoranta | Antenna modules for dual interface smart cards, booster antenna configurations, and methods |
US9195932B2 (en) | 2010-08-12 | 2015-11-24 | Féinics Amatech Teoranta | Booster antenna configurations and methods |
US8870080B2 (en) | 2010-08-12 | 2014-10-28 | Féinics Amatech Teoranta | RFID antenna modules and methods |
CA2842504A1 (fr) | 2010-08-12 | 2012-02-16 | Feinics Amatech Teoranta Limited | Modules d'antenne rfid et amelioration de couplage |
US8991712B2 (en) | 2010-08-12 | 2015-03-31 | Féinics Amatech Teoranta | Coupling in and to RFID smart cards |
CN102622639B (zh) * | 2011-01-28 | 2014-09-17 | 中国机动车辆安全鉴定检测中心 | 电子护照元件层制作方法 |
DE102011001722A1 (de) * | 2011-04-01 | 2012-10-04 | Bundesdruckerei Gmbh | Halbzeug zur Herstellung eines Chipkartenmoduls, Verfahren zur Herstellung des Halbzeuges sowie Verfahren zur Herstellung einer Chipkarte |
US9390364B2 (en) | 2011-08-08 | 2016-07-12 | Féinics Amatech Teoranta | Transponder chip module with coupling frame on a common substrate for secure and non-secure smartcards and tags |
MX2014001531A (es) | 2011-08-08 | 2014-06-04 | Féinics Amatech Teoranta | Mejora de acoplamiento en y para tarjetas inteligentes de rfid. |
EP2742466B1 (fr) | 2011-08-08 | 2017-07-19 | Féinics AmaTech Teoranta | Amélioration du couplage dans et sur des cartes intelligentes d'identification par radiofréquence (rfid) |
CA2847968A1 (fr) | 2011-09-11 | 2013-03-14 | Feinics Amatech Teoranta | Modules d'antenne rfid et leurs procedes de fabrication |
WO2013113945A1 (fr) | 2012-02-05 | 2013-08-08 | Féinics Amatech Teoranta | Modules et procédés pour antennes rfid |
EP2811427A1 (fr) * | 2013-06-07 | 2014-12-10 | Gemalto SA | Procédé de fabrication d'un dispositif électronique anti-fissuration |
WO2017040973A1 (fr) * | 2015-09-04 | 2017-03-09 | The Trustees Of Columbia University In The City Of New York | Étiquettes de détection d'identification d'ultrasons à échelle micrométrique |
DE102016106698A1 (de) * | 2016-04-12 | 2017-10-12 | Infineon Technologies Ag | Chipkarte und Verfahren zum Herstellen einer Chipkarte |
CN108235792B (zh) * | 2016-10-21 | 2021-01-26 | 京瓷株式会社 | 标签用基板、rfid标签以及rfid系统 |
DE102017103411A1 (de) * | 2017-02-20 | 2018-08-23 | Bundesdruckerei Gmbh | Verfahren zur Herstellung eines Inlays für einen Folienverbund eines Sicherheits- und/oder Wertdokumentes sowie Inlay |
US10282654B2 (en) * | 2017-07-09 | 2019-05-07 | Interlake Research, Llc | Tag assembly methods |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2000022893A1 (fr) * | 1998-10-15 | 2000-04-20 | Amerasia International Technology, Inc. | Article auquel est integre un dispositif electronique, et procede de fabrication associe |
US6100804A (en) * | 1998-10-29 | 2000-08-08 | Intecmec Ip Corp. | Radio frequency identification system |
WO2001003188A1 (fr) * | 1999-07-01 | 2001-01-11 | Intermec Ip Corp. | Procede de fixation de circuit integre et dispositif correspondant |
FR2824018A1 (fr) * | 2001-04-26 | 2002-10-31 | Arjo Wiggins Sa | Couverture incorporant un dispositif d'identification radiofrequence |
EP1406209A2 (fr) | 2002-09-27 | 2004-04-07 | Eastman Kodak Company | Carte à puce sans contact comportant un transpondeur placé dans une cavité du corps de la carte |
US9922438B2 (en) | 2014-03-05 | 2018-03-20 | Tencent Technology (Shenzhen) Company Limited | Method and apparatus for switching real-time image in instant messaging |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5528222A (en) * | 1994-09-09 | 1996-06-18 | International Business Machines Corporation | Radio frequency circuit and memory in thin flexible package |
FR2743649B1 (fr) * | 1996-01-17 | 1998-04-03 | Gemplus Card Int | Module electronique sans contact, carte etiquette electronique l'incorporant, et leurs procedes de fabrication |
FR2761497B1 (fr) * | 1997-03-27 | 1999-06-18 | Gemplus Card Int | Procede de fabrication d'une carte a puce ou analogue |
RU2257614C2 (ru) * | 1999-12-23 | 2005-07-27 | Награид Са | Электронная этикетка (варианты) |
US20040062016A1 (en) * | 2002-09-27 | 2004-04-01 | Eastman Kodak Company | Medium having data storage and communication capabilites and method for forming same |
US8286332B2 (en) * | 2006-09-26 | 2012-10-16 | Hid Global Gmbh | Method and apparatus for making a radio frequency inlay |
-
2005
- 2005-02-11 FR FR0501378A patent/FR2882174B1/fr not_active Expired - Fee Related
-
2006
- 2006-02-03 US US11/884,123 patent/US7992790B2/en not_active Expired - Fee Related
- 2006-02-03 CN CN200680011238.8A patent/CN101203869B/zh not_active Expired - Fee Related
- 2006-02-03 RU RU2007133794/08A patent/RU2464635C2/ru not_active IP Right Cessation
- 2006-02-03 EP EP06709260A patent/EP1846875A1/fr not_active Withdrawn
- 2006-02-03 WO PCT/FR2006/000271 patent/WO2006084984A1/fr active Application Filing
-
2007
- 2007-08-31 MA MA30189A patent/MA29314B1/fr unknown
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2000022893A1 (fr) * | 1998-10-15 | 2000-04-20 | Amerasia International Technology, Inc. | Article auquel est integre un dispositif electronique, et procede de fabrication associe |
US6100804A (en) * | 1998-10-29 | 2000-08-08 | Intecmec Ip Corp. | Radio frequency identification system |
WO2001003188A1 (fr) * | 1999-07-01 | 2001-01-11 | Intermec Ip Corp. | Procede de fixation de circuit integre et dispositif correspondant |
FR2824018A1 (fr) * | 2001-04-26 | 2002-10-31 | Arjo Wiggins Sa | Couverture incorporant un dispositif d'identification radiofrequence |
EP1406209A2 (fr) | 2002-09-27 | 2004-04-07 | Eastman Kodak Company | Carte à puce sans contact comportant un transpondeur placé dans une cavité du corps de la carte |
US9922438B2 (en) | 2014-03-05 | 2018-03-20 | Tencent Technology (Shenzhen) Company Limited | Method and apparatus for switching real-time image in instant messaging |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
RU2471232C2 (ru) * | 2007-09-14 | 2012-12-27 | Топпан Принтинг Ко., Лтд. | Антенный лист, ретранслятор и буклет |
US8519905B2 (en) | 2007-09-14 | 2013-08-27 | Toppan Printing Co., Ltd. | Antenna sheet, transponder, and booklet |
Also Published As
Publication number | Publication date |
---|---|
US7992790B2 (en) | 2011-08-09 |
CN101203869A (zh) | 2008-06-18 |
EP1846875A1 (fr) | 2007-10-24 |
US20090057414A1 (en) | 2009-03-05 |
RU2007133794A (ru) | 2009-03-20 |
FR2882174A1 (fr) | 2006-08-18 |
FR2882174B1 (fr) | 2007-09-07 |
MA29314B1 (fr) | 2008-03-03 |
CN101203869B (zh) | 2016-03-30 |
RU2464635C2 (ru) | 2012-10-20 |
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