WO2008112086A3 - Electroplating process - Google Patents

Electroplating process Download PDF

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Publication number
WO2008112086A3
WO2008112086A3 PCT/US2008/002702 US2008002702W WO2008112086A3 WO 2008112086 A3 WO2008112086 A3 WO 2008112086A3 US 2008002702 W US2008002702 W US 2008002702W WO 2008112086 A3 WO2008112086 A3 WO 2008112086A3
Authority
WO
WIPO (PCT)
Prior art keywords
processes
electroplating process
recessed
useful
semiconductor wafer
Prior art date
Application number
PCT/US2008/002702
Other languages
French (fr)
Other versions
WO2008112086A2 (en
Inventor
Hongli Dai
Original Assignee
Du Pont
Hongli Dai
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Du Pont, Hongli Dai filed Critical Du Pont
Publication of WO2008112086A2 publication Critical patent/WO2008112086A2/en
Publication of WO2008112086A3 publication Critical patent/WO2008112086A3/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C25D7/123—Semiconductors first coated with a seed layer or a conductive layer
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/002—Cell separation, e.g. membranes, diaphragms
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
    • H01L21/288—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition
    • H01L21/2885—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition using an external electrical current, i.e. electro-deposition
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
    • H01L21/76877—Filling of holes, grooves or trenches, e.g. vias, with conductive material
    • H01L21/76879—Filling of holes, grooves or trenches, e.g. vias, with conductive material by selective deposition of conductive material in the vias, e.g. selective C.V.D. on semiconductor material, plating

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

This invention provides processes for selectively electroplating metal layers into recessed topographic features on the surface of a conductive substrate. The processes are useful for fabricating metal circuit patterns, for example for creating copper interconnects between integrated circuit elements embedded in a thin layer of dielectric material on the surface of a semiconductor wafer.
PCT/US2008/002702 2007-03-08 2008-02-29 Electroplating process WO2008112086A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/683,478 US20080217182A1 (en) 2007-03-08 2007-03-08 Electroplating process
US11/683,478 2007-03-08

Publications (2)

Publication Number Publication Date
WO2008112086A2 WO2008112086A2 (en) 2008-09-18
WO2008112086A3 true WO2008112086A3 (en) 2009-04-30

Family

ID=39708959

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2008/002702 WO2008112086A2 (en) 2007-03-08 2008-02-29 Electroplating process

Country Status (3)

Country Link
US (1) US20080217182A1 (en)
TW (1) TW200848553A (en)
WO (1) WO2008112086A2 (en)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI495767B (en) * 2010-09-02 2015-08-11 Electroplating Eng Iridium plating solution and method of plating using the same
CN102400190A (en) * 2010-09-17 2012-04-04 日本电镀工程股份有限公司 Iridium plating solution and electroplate method thereof
US9017528B2 (en) 2011-04-14 2015-04-28 Tel Nexx, Inc. Electro chemical deposition and replenishment apparatus
US9005409B2 (en) 2011-04-14 2015-04-14 Tel Nexx, Inc. Electro chemical deposition and replenishment apparatus
EP2818585B1 (en) * 2012-02-23 2019-11-27 Toyota Jidosha Kabushiki Kaisha Film formation device and film formation method for forming metal film
JP5949696B2 (en) * 2013-08-07 2016-07-13 トヨタ自動車株式会社 Metal film forming apparatus and film forming method
JP5915602B2 (en) 2013-08-07 2016-05-11 トヨタ自動車株式会社 Metal film forming apparatus and film forming method
JP6024714B2 (en) * 2013-10-03 2016-11-16 トヨタ自動車株式会社 Nickel solution for film formation and film forming method using the same
US9303329B2 (en) 2013-11-11 2016-04-05 Tel Nexx, Inc. Electrochemical deposition apparatus with remote catholyte fluid management
JP6011559B2 (en) * 2014-02-14 2016-10-19 トヨタ自動車株式会社 Metal film deposition method
JP6197813B2 (en) 2015-03-11 2017-09-20 トヨタ自動車株式会社 Metal film forming apparatus and film forming method
US20170167042A1 (en) 2015-12-14 2017-06-15 International Business Machines Corporation Selective solder plating
JP7135958B2 (en) * 2019-03-22 2022-09-13 トヨタ自動車株式会社 Metal film deposition equipment
CN112002752B (en) 2020-07-27 2023-04-21 北海惠科光电技术有限公司 Preparation method of source and drain electrodes, preparation method of array substrate and display mechanism

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000077278A1 (en) * 1999-06-14 2000-12-21 Cvc Products, Inc. Method and apparatus for electroplating depressions of a substrate simultaneously preventing plating on the substrate surface using a membrane cover
US20060175202A1 (en) * 2004-11-30 2006-08-10 Stephen Mazur Membrane-limited selective electroplating of a conductive surface

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3282875A (en) * 1964-07-22 1966-11-01 Du Pont Fluorocarbon vinyl ether polymers
US4176215A (en) * 1978-03-13 1979-11-27 E. I. Du Pont De Nemours And Company Ion-exchange structures of copolymer blends useful in electrolytic cells
US4358545A (en) * 1980-06-11 1982-11-09 The Dow Chemical Company Sulfonic acid electrolytic cell having flourinated polymer membrane with hydration product less than 22,000
US4940525A (en) * 1987-05-08 1990-07-10 The Dow Chemical Company Low equivalent weight sulfonic fluoropolymers
US5112448A (en) * 1989-11-28 1992-05-12 The Boeing Company Self-aligned process for fabrication of interconnect structures in semiconductor applications
US5773480A (en) * 1993-09-21 1998-06-30 Ballard Power Systems Inc. Trifluorostyrene and substituted trifluorostyrene copolymeric compositions and ion-exchange membranes formed therefrom
US5547551A (en) * 1995-03-15 1996-08-20 W. L. Gore & Associates, Inc. Ultra-thin integral composite membrane
US5700398A (en) * 1994-12-14 1997-12-23 International Business Machines Corporation Composition containing a polymer and conductive filler and use thereof
US6110333A (en) * 1997-05-02 2000-08-29 E. I. Du Pont De Nemours And Company Composite membrane with highly crystalline porous support
US6359019B1 (en) * 1997-11-12 2002-03-19 Ballard Power Systems Inc. Graft polymeric membranes and ion-exchange membranes formed therefrom
US6534116B2 (en) * 2000-08-10 2003-03-18 Nutool, Inc. Plating method and apparatus that creates a differential between additive disposed on a top surface and a cavity surface of a workpiece using an external influence
US7335153B2 (en) * 2001-12-28 2008-02-26 Bio Array Solutions Ltd. Arrays of microparticles and methods of preparation thereof
US20040149584A1 (en) * 2002-12-27 2004-08-05 Mizuki Nagai Plating method

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000077278A1 (en) * 1999-06-14 2000-12-21 Cvc Products, Inc. Method and apparatus for electroplating depressions of a substrate simultaneously preventing plating on the substrate surface using a membrane cover
US20060175202A1 (en) * 2004-11-30 2006-08-10 Stephen Mazur Membrane-limited selective electroplating of a conductive surface

Also Published As

Publication number Publication date
WO2008112086A2 (en) 2008-09-18
TW200848553A (en) 2008-12-16
US20080217182A1 (en) 2008-09-11

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