KR980006139A

KR980006139A - Die manufacturing method with conductive film

Info

Publication number: KR980006139A
Application number: KR1019960021252A
Authority: KR
Inventors: 김삼일; 김경희
Original assignee: 김광호; 삼성전자주식회사
Priority date: 1996-06-13
Filing date: 1996-06-13
Publication date: 1998-03-30

Abstract

본 발명은 웨이퍼 상에서 이방성 도전 막을 형성하는 방법에 관한 것으로, 도전 막이 형성된 다이를 웨이퍼로부터 안정성을 확보하면서 분리할 수 있도록, 절단 공정이 완료된 복수 개의 다이를 갖는 웨이퍼를 준비하는 단계; 도전 물질이 함유된 접착 막이 일면에 형성된 자외선 테이프를 준비하는 단계; 상기 웨이퍼의 상면과 상기 자외선 테이프의 하면을 접착하는 단계; 및 상기 자외선 테이프를 제거하고, 상기 웨이퍼에서 개별의 다이로 분리하는 단계를 포함하는 것을 특징으로 하는 도전 막을 갖는 다이 제조 방법을 제공함으로써, 웨이퍼 상에 도포되는 접착제가 수분에 민감하므로 절단 공정을 적용하기가 곤란하며, 그 절단 공정 시에 접착제와 웨이퍼 사이에 접착력을 2차 본딩되기 때문에 완전히 경화(硬化)되지 않기 때문에 웨이퍼로부터 분리된 다이의 안정성을 확보하는데 많은 주의와 공정 개발이 요구되던 단점을 극복할 수 있는 특징이 있다.The present invention relates to a method of forming an anisotropic conductive film on a wafer, comprising: preparing a wafer having a plurality of dies having a cutting process so that the die on which the conductive film is formed can be separated from the wafer while ensuring stability; Preparing an ultraviolet tape having an adhesive film containing a conductive material formed on one surface thereof; Bonding an upper surface of the wafer and a lower surface of the ultraviolet tape; And removing the ultraviolet tape and separating the ultraviolet tape into individual dies on the wafer, thereby applying a cutting process because the adhesive applied on the wafer is sensitive to moisture. It is difficult to do this, and the adhesive force between the adhesive and the wafer is second-bonded during the cutting process, and thus it is not completely hardened. Therefore, a lot of attention and process development are required to secure the stability of the die separated from the wafer. There are features that can be overcome.

Description

Die manufacturing method with conductive film

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음As this is a public information case, the full text was not included.

제1도는 웨이퍼의 하면에 접착 테이프가 부착된 상태의 저면을 나타내는 사시도.1 is a perspective view showing a bottom surface of a state where an adhesive tape is attached to a bottom surface of a wafer.

Claims

(a) preparing a wafer having a plurality of dies for which a cutting process is completed; (b) preparing an ultraviolet tape having an adhesive film containing a conductive material formed on one surface thereof; (c) adhering an upper surface of the wafer and a lower surface of the ultraviolet tape; And (d) removing the ultraviolet tape and separating the ultraviolet tape into individual dies on the wafer.

The die manufacturing method according to claim 1, wherein the adhesive film of step (b) is in a B-stage state.

The method according to claim 1, wherein the step (d) is performed as follows: (e) the wafer to which the ultraviolet tape of step (c) is attached is supplied to the ultraviolet generating device; and (f) the ultraviolet tape is removed: (g) fabricating a plurality of die having a conductive film on the wafer; And (h) separating the wafer into individual dies.