KR980006137A - Wafer Sawing Method - Google Patents

Wafer Sawing Method Download PDF

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Publication number
KR980006137A
KR980006137A KR1019960020180A KR19960020180A KR980006137A KR 980006137 A KR980006137 A KR 980006137A KR 1019960020180 A KR1019960020180 A KR 1019960020180A KR 19960020180 A KR19960020180 A KR 19960020180A KR 980006137 A KR980006137 A KR 980006137A
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KR
South Korea
Prior art keywords
wafer
bonded
adhesive tape
die attach
chips
Prior art date
Application number
KR1019960020180A
Other languages
Korean (ko)
Inventor
송영희
문성천
Original Assignee
김광호
삼성전자주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 김광호, 삼성전자주식회사 filed Critical 김광호
Priority to KR1019960020180A priority Critical patent/KR980006137A/en
Publication of KR980006137A publication Critical patent/KR980006137A/en

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Abstract

본 발명은 격자 무늬가 형성된 접착 테이프를 웨이퍼의 전면에 정합하여 접착한 후 격자 무늬와 다이아몬드 블레이드를 정합하면서 웨이퍼를 쏘잉하여 웨이퍼의 전, 후면을 그대로 유지하면서 LOC, 플립 칩 또는 탭의 다이 어태치 공정을 실시할 수 있어 다이 어태치 공정을 단순화시킬 수 있다. 따라서, 본 발명은 LOC, 플립 칩 또는 탭의 다이 어태치 공정을 위해 별도의 요소들을 추가로 설치하지 않아도 되므로 새로운 다이 어태치 장치에 대한 부담을 제거할 수 있다.According to the present invention, a lattice-shaped adhesive tape is bonded to a front surface of a wafer, and then bonded and sawed while the lattice and diamond blades are matched, so that the die attach of the LOC, flip chip, or tab is maintained while maintaining the front and back sides of the wafer. The process can be carried out to simplify the die attach process. Thus, the present invention eliminates the burden on the new die attach device since it is not necessary to install additional elements for the die attach process of the LOC, flip chip or tab.

Description

웨이퍼 쏘잉 방법Wafer Sawing Method

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음As this is a public information case, the full text was not included.

제2도는 본 발명에 의한 웨이퍼 쏘잉 방법을 나타낸 상태도.2 is a state diagram showing a wafer sawing method according to the present invention.

Claims (7)

접착 테이프에 접착된 웨이퍼를 각각의 칩들로 분할하는 쏘잉 공정에 있어서, 상기 각각의 칩들에 해당하는 소정의 무늬가 형성된 접착 테이프를 준비하는 단계와, 상기 접착 테이프를 상기 칩들을 위한 회로의 패턴들이 형성된 상기 웨이퍼의 전면에 접착하는 단계와, 상기 접착된 웨이퍼의 후면을 쏘잉하여 각각의 칩들을 위한 크기로 절단하는 단계를 포함하는 웨이퍼 쏘잉 방법.In a sawing process of dividing a wafer bonded to an adhesive tape into chips, preparing a adhesive tape having a predetermined pattern corresponding to each of the chips, and applying the adhesive tape to patterns of a circuit for the chips. Adhering to the front side of the formed wafer, and sawing the back side of the bonded wafer to cut to size for respective chips. 제1항에 있어서, 상기 접착 테이프의 무늬에 정합하여 상기 웨이퍼를 접착하는 것을 특징으로 하는 웨이퍼 쏘잉 방법.The wafer sawing method according to claim 1, wherein the wafer is bonded by matching with the pattern of the adhesive tape. 제1항에 있어서, 상기 접착 테이프에 격자 무늬가 형성된 것을 특징으로 하는 웨이퍼 쏘잉 방법.The method of claim 1, wherein a lattice pattern is formed on the adhesive tape. 제1항 또는 제2항에 있어서, 상기 무늬에 정합하면서 상기 접착된 웨이퍼를 각각의 칩들을 위한 크기로 절단하는 것을 특징으로 하는 웨이퍼 쏘잉 방법.The method of claim 1 or 2, wherein the bonded wafer is cut to size for each chip while matching the pattern. 제4항에 있어서, 상기 웨이퍼를 상기 웨이퍼의 두께보다 크게 절단하는 것을 특징으로 하는 웨이퍼 쏘잉 방법.5. The method of claim 4, wherein the wafer is cut larger than the thickness of the wafer. 제1항에 있어서, 상기 웨이퍼의 절단 상태를 체크하기 위한 감시 장치들이 상기 웨이퍼의 상, 하측으로부터 소정의 거리를 두고 설치되는 것을 특징으로 하는 웨이퍼 쏘잉 방법.The wafer sawing method according to claim 1, wherein monitoring devices for checking a cutting state of the wafer are provided at a predetermined distance from an upper side and a lower side of the wafer. 제1항 또는 제6항에 있어서, 상기 웨이퍼에 접착된 테이프가 투명한 것을 특징으로 하는 웨이퍼 쏘잉 방법.The method of claim 1, wherein the tape adhered to the wafer is transparent.
KR1019960020180A 1996-06-07 1996-06-07 Wafer Sawing Method KR980006137A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019960020180A KR980006137A (en) 1996-06-07 1996-06-07 Wafer Sawing Method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019960020180A KR980006137A (en) 1996-06-07 1996-06-07 Wafer Sawing Method

Publications (1)

Publication Number Publication Date
KR980006137A true KR980006137A (en) 1998-03-30

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019960020180A KR980006137A (en) 1996-06-07 1996-06-07 Wafer Sawing Method

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100478678B1 (en) * 1997-08-21 2005-07-11 삼성전자주식회사 Wafer sawing method
KR100542850B1 (en) * 2001-11-30 2006-01-20 가부시끼가이샤 도시바 Manufacturing method of semiconductor apparatus

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100478678B1 (en) * 1997-08-21 2005-07-11 삼성전자주식회사 Wafer sawing method
KR100542850B1 (en) * 2001-11-30 2006-01-20 가부시끼가이샤 도시바 Manufacturing method of semiconductor apparatus

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