KR980006137A - Wafer Sawing Method - Google Patents
Wafer Sawing Method Download PDFInfo
- Publication number
- KR980006137A KR980006137A KR1019960020180A KR19960020180A KR980006137A KR 980006137 A KR980006137 A KR 980006137A KR 1019960020180 A KR1019960020180 A KR 1019960020180A KR 19960020180 A KR19960020180 A KR 19960020180A KR 980006137 A KR980006137 A KR 980006137A
- Authority
- KR
- South Korea
- Prior art keywords
- wafer
- bonded
- adhesive tape
- die attach
- chips
- Prior art date
Links
Landscapes
- Dicing (AREA)
Abstract
본 발명은 격자 무늬가 형성된 접착 테이프를 웨이퍼의 전면에 정합하여 접착한 후 격자 무늬와 다이아몬드 블레이드를 정합하면서 웨이퍼를 쏘잉하여 웨이퍼의 전, 후면을 그대로 유지하면서 LOC, 플립 칩 또는 탭의 다이 어태치 공정을 실시할 수 있어 다이 어태치 공정을 단순화시킬 수 있다. 따라서, 본 발명은 LOC, 플립 칩 또는 탭의 다이 어태치 공정을 위해 별도의 요소들을 추가로 설치하지 않아도 되므로 새로운 다이 어태치 장치에 대한 부담을 제거할 수 있다.According to the present invention, a lattice-shaped adhesive tape is bonded to a front surface of a wafer, and then bonded and sawed while the lattice and diamond blades are matched, so that the die attach of the LOC, flip chip, or tab is maintained while maintaining the front and back sides of the wafer. The process can be carried out to simplify the die attach process. Thus, the present invention eliminates the burden on the new die attach device since it is not necessary to install additional elements for the die attach process of the LOC, flip chip or tab.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음As this is a public information case, the full text was not included.
제2도는 본 발명에 의한 웨이퍼 쏘잉 방법을 나타낸 상태도.2 is a state diagram showing a wafer sawing method according to the present invention.
Claims (7)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019960020180A KR980006137A (en) | 1996-06-07 | 1996-06-07 | Wafer Sawing Method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019960020180A KR980006137A (en) | 1996-06-07 | 1996-06-07 | Wafer Sawing Method |
Publications (1)
Publication Number | Publication Date |
---|---|
KR980006137A true KR980006137A (en) | 1998-03-30 |
Family
ID=66284748
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019960020180A KR980006137A (en) | 1996-06-07 | 1996-06-07 | Wafer Sawing Method |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR980006137A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100478678B1 (en) * | 1997-08-21 | 2005-07-11 | 삼성전자주식회사 | Wafer sawing method |
KR100542850B1 (en) * | 2001-11-30 | 2006-01-20 | 가부시끼가이샤 도시바 | Manufacturing method of semiconductor apparatus |
-
1996
- 1996-06-07 KR KR1019960020180A patent/KR980006137A/en not_active Application Discontinuation
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100478678B1 (en) * | 1997-08-21 | 2005-07-11 | 삼성전자주식회사 | Wafer sawing method |
KR100542850B1 (en) * | 2001-11-30 | 2006-01-20 | 가부시끼가이샤 도시바 | Manufacturing method of semiconductor apparatus |
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Legal Events
Date | Code | Title | Description |
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WITN | Withdrawal due to no request for examination |