JPS5717152A - Semiconductor chip and manufacture therefor - Google Patents

Semiconductor chip and manufacture therefor

Info

Publication number
JPS5717152A
JPS5717152A JP9130180A JP9130180A JPS5717152A JP S5717152 A JPS5717152 A JP S5717152A JP 9130180 A JP9130180 A JP 9130180A JP 9130180 A JP9130180 A JP 9130180A JP S5717152 A JPS5717152 A JP S5717152A
Authority
JP
Japan
Prior art keywords
section
wafer
resin
street line
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9130180A
Other languages
Japanese (ja)
Inventor
Yukichi Kobayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Citizen Watch Co Ltd
Original Assignee
Citizen Watch Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Citizen Watch Co Ltd filed Critical Citizen Watch Co Ltd
Priority to JP9130180A priority Critical patent/JPS5717152A/en
Publication of JPS5717152A publication Critical patent/JPS5717152A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Dicing (AREA)

Abstract

PURPOSE:To make small-sized thin chips having shading effect by forming a resin thin film on a wafer surface wherein the resin thin film on a bonding section and a street line section is removed and a wafer is cut on the street line to separate the wafer into each chip. CONSTITUTION:Resin film 5 having high shading effect, for example, black epoxy resin, is applied on a semiconductor integrated circuit chip 1 provided a bonding pad section 2, a passivation section 3 and a resin film on the bonding pad section 2 and a street line section 4 is removed by patterning by a photoresist 7. A wafer is separated on the street line to compose each chip. In this way, small-sized thin semiconductor chips having shading effect can be produced in large quantities.
JP9130180A 1980-07-04 1980-07-04 Semiconductor chip and manufacture therefor Pending JPS5717152A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9130180A JPS5717152A (en) 1980-07-04 1980-07-04 Semiconductor chip and manufacture therefor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9130180A JPS5717152A (en) 1980-07-04 1980-07-04 Semiconductor chip and manufacture therefor

Publications (1)

Publication Number Publication Date
JPS5717152A true JPS5717152A (en) 1982-01-28

Family

ID=14022639

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9130180A Pending JPS5717152A (en) 1980-07-04 1980-07-04 Semiconductor chip and manufacture therefor

Country Status (1)

Country Link
JP (1) JPS5717152A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0314258U (en) * 1989-06-26 1991-02-13
JPH0754513A (en) * 1993-08-20 1995-02-28 Naoe Seisaku:Kk Two-story parking device
KR100253116B1 (en) * 1997-07-07 2000-04-15 윤덕용 Method of manufacturing chip size package using the method
US6420244B2 (en) * 2000-02-21 2002-07-16 Advanced Semiconductor Engineering, Inc. Method of making wafer level chip scale package

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0314258U (en) * 1989-06-26 1991-02-13
JPH0754513A (en) * 1993-08-20 1995-02-28 Naoe Seisaku:Kk Two-story parking device
KR100253116B1 (en) * 1997-07-07 2000-04-15 윤덕용 Method of manufacturing chip size package using the method
US6420244B2 (en) * 2000-02-21 2002-07-16 Advanced Semiconductor Engineering, Inc. Method of making wafer level chip scale package

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