KR970077523A - Multi-metal film forming method - Google Patents
Multi-metal film forming method Download PDFInfo
- Publication number
- KR970077523A KR970077523A KR1019960017918A KR19960017918A KR970077523A KR 970077523 A KR970077523 A KR 970077523A KR 1019960017918 A KR1019960017918 A KR 1019960017918A KR 19960017918 A KR19960017918 A KR 19960017918A KR 970077523 A KR970077523 A KR 970077523A
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- KR
- South Korea
- Prior art keywords
- metal film
- film
- metal
- forming
- wafer
- Prior art date
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- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Abstract
웨이퍼 상에 형성된 금속막과 금속막을 연결하는 콘택형성시 금속막이 부식되는 것을 방지하는 다중금속막 형성방법에 관한 것이다.And more particularly, to a method for forming a multi-metal film which prevents corrosion of a metal film when forming a contact connecting the metal film and the metal film formed on the wafer.
본 발명은, 제1금속막과 절연막이 적층된 웨이퍼상에 건식식각방법에 의해서 콘택을 형성하는 단계, 상기 콘택이 형성된 상기 제1금속막 상에 금속산화막을 형성하는 단계, 상기 금속산화막을 식각하는 단계 및 상기 금속산화막이 제거된 상기 제1금속막 상에 제2금속막을 도포하는 단계를 구비하여 이루어진다.According to the present invention, there is provided a method of manufacturing a semiconductor device, comprising the steps of: forming a contact on a wafer on which a first metal film and an insulating film are stacked by a dry etching method; forming a metal oxide film on the first metal film on which the contact is formed; And applying a second metal film on the first metal film from which the metal oxide film has been removed.
따라서, 웨이퍼 상에 다중적층되는 금속막형성을 위해서 하부 금속막 콘택 형성시 하부 금속막이 부식되어 생산되는 반도체 소자의 불량원으로 작용하는 것을 방지할 수 있는 효과가 있다.Accordingly, it is possible to prevent the lower metal film from acting as a defective source of the semiconductor device which is produced by corrosion of the lower metal film during the formation of the metal film to be laminated on the wafer.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is a trivial issue, I did not include the contents of the text.
제1도는 본 발명에 따른 다중금속막 형성방법의 일 실시예를 설명하기 위한 단면도들이다.FIG. 1 is a cross-sectional view illustrating an embodiment of a multi-metal film forming method according to the present invention.
Claims (2)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019960017918A KR970077523A (en) | 1996-05-25 | 1996-05-25 | Multi-metal film forming method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019960017918A KR970077523A (en) | 1996-05-25 | 1996-05-25 | Multi-metal film forming method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR970077523A true KR970077523A (en) | 1997-12-12 |
Family
ID=66220368
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019960017918A KR970077523A (en) | 1996-05-25 | 1996-05-25 | Multi-metal film forming method |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR970077523A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20180000484U (en) | 2016-08-10 | 2018-02-21 | 김규호 | Tape cutting device |
-
1996
- 1996-05-25 KR KR1019960017918A patent/KR970077523A/en not_active Application Discontinuation
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20180000484U (en) | 2016-08-10 | 2018-02-21 | 김규호 | Tape cutting device |
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