KR970047007U - Cutting device for semiconductor package - Google Patents

Cutting device for semiconductor package

Info

Publication number
KR970047007U
KR970047007U KR2019950046270U KR19950046270U KR970047007U KR 970047007 U KR970047007 U KR 970047007U KR 2019950046270 U KR2019950046270 U KR 2019950046270U KR 19950046270 U KR19950046270 U KR 19950046270U KR 970047007 U KR970047007 U KR 970047007U
Authority
KR
South Korea
Prior art keywords
cutting device
semiconductor package
package
semiconductor
cutting
Prior art date
Application number
KR2019950046270U
Other languages
Korean (ko)
Other versions
KR200145297Y1 (en
Inventor
최신
Original Assignee
엘지반도체주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 엘지반도체주식회사 filed Critical 엘지반도체주식회사
Priority to KR2019950046270U priority Critical patent/KR200145297Y1/en
Publication of KR970047007U publication Critical patent/KR970047007U/en
Application granted granted Critical
Publication of KR200145297Y1 publication Critical patent/KR200145297Y1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Punching Or Piercing (AREA)
KR2019950046270U 1995-12-23 1995-12-23 Apparatus of semiconductor package for triming and forming KR200145297Y1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019950046270U KR200145297Y1 (en) 1995-12-23 1995-12-23 Apparatus of semiconductor package for triming and forming

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019950046270U KR200145297Y1 (en) 1995-12-23 1995-12-23 Apparatus of semiconductor package for triming and forming

Publications (2)

Publication Number Publication Date
KR970047007U true KR970047007U (en) 1997-07-31
KR200145297Y1 KR200145297Y1 (en) 1999-07-01

Family

ID=19437494

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019950046270U KR200145297Y1 (en) 1995-12-23 1995-12-23 Apparatus of semiconductor package for triming and forming

Country Status (1)

Country Link
KR (1) KR200145297Y1 (en)

Also Published As

Publication number Publication date
KR200145297Y1 (en) 1999-07-01

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Legal Events

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E701 Decision to grant or registration of patent right
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Payment date: 20050120

Year of fee payment: 7

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