KR960027798U - Semiconductor package lead forming device - Google Patents

Semiconductor package lead forming device

Info

Publication number
KR960027798U
KR960027798U KR2019950000608U KR19950000608U KR960027798U KR 960027798 U KR960027798 U KR 960027798U KR 2019950000608 U KR2019950000608 U KR 2019950000608U KR 19950000608 U KR19950000608 U KR 19950000608U KR 960027798 U KR960027798 U KR 960027798U
Authority
KR
South Korea
Prior art keywords
semiconductor package
forming device
lead forming
package lead
semiconductor
Prior art date
Application number
KR2019950000608U
Other languages
Korean (ko)
Other versions
KR0131053Y1 (en
Inventor
곽노권
Original Assignee
주식회사한미금형
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사한미금형 filed Critical 주식회사한미금형
Priority to KR2019950000608U priority Critical patent/KR0131053Y1/en
Publication of KR960027798U publication Critical patent/KR960027798U/en
Application granted granted Critical
Publication of KR0131053Y1 publication Critical patent/KR0131053Y1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
KR2019950000608U 1995-01-17 1995-01-17 Lead forming apparatus of semiconductor package KR0131053Y1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019950000608U KR0131053Y1 (en) 1995-01-17 1995-01-17 Lead forming apparatus of semiconductor package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019950000608U KR0131053Y1 (en) 1995-01-17 1995-01-17 Lead forming apparatus of semiconductor package

Publications (2)

Publication Number Publication Date
KR960027798U true KR960027798U (en) 1996-08-17
KR0131053Y1 KR0131053Y1 (en) 1998-12-01

Family

ID=19406775

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019950000608U KR0131053Y1 (en) 1995-01-17 1995-01-17 Lead forming apparatus of semiconductor package

Country Status (1)

Country Link
KR (1) KR0131053Y1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100398188B1 (en) * 2000-12-15 2003-09-19 현대자동차주식회사 Start plate steel forming apparatus

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100398188B1 (en) * 2000-12-15 2003-09-19 현대자동차주식회사 Start plate steel forming apparatus

Also Published As

Publication number Publication date
KR0131053Y1 (en) 1998-12-01

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Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
REGI Registration of establishment
LAPS Lapse due to unpaid annual fee