KR970007237U - Leading device for semiconductor package - Google Patents

Leading device for semiconductor package

Info

Publication number
KR970007237U
KR970007237U KR2019950017068U KR19950017068U KR970007237U KR 970007237 U KR970007237 U KR 970007237U KR 2019950017068 U KR2019950017068 U KR 2019950017068U KR 19950017068 U KR19950017068 U KR 19950017068U KR 970007237 U KR970007237 U KR 970007237U
Authority
KR
South Korea
Prior art keywords
semiconductor package
leading device
leading
package
semiconductor
Prior art date
Application number
KR2019950017068U
Other languages
Korean (ko)
Other versions
KR0125114Y1 (en
Inventor
곽노권
Original Assignee
주식회사한미금형
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사한미금형 filed Critical 주식회사한미금형
Priority to KR2019950017068U priority Critical patent/KR0125114Y1/en
Publication of KR970007237U publication Critical patent/KR970007237U/en
Application granted granted Critical
Publication of KR0125114Y1 publication Critical patent/KR0125114Y1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
KR2019950017068U 1995-07-12 1995-07-12 Lead mold apparatus of semiconductor package KR0125114Y1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019950017068U KR0125114Y1 (en) 1995-07-12 1995-07-12 Lead mold apparatus of semiconductor package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019950017068U KR0125114Y1 (en) 1995-07-12 1995-07-12 Lead mold apparatus of semiconductor package

Publications (2)

Publication Number Publication Date
KR970007237U true KR970007237U (en) 1997-02-21
KR0125114Y1 KR0125114Y1 (en) 1998-10-01

Family

ID=19417996

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019950017068U KR0125114Y1 (en) 1995-07-12 1995-07-12 Lead mold apparatus of semiconductor package

Country Status (1)

Country Link
KR (1) KR0125114Y1 (en)

Also Published As

Publication number Publication date
KR0125114Y1 (en) 1998-10-01

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Legal Events

Date Code Title Description
A201 Request for examination
E701 Decision to grant or registration of patent right
REGI Registration of establishment
LAPS Lapse due to unpaid annual fee