KR970007239U - Semiconductor package - Google Patents
Semiconductor packageInfo
- Publication number
- KR970007239U KR970007239U KR2019950019138U KR19950019138U KR970007239U KR 970007239 U KR970007239 U KR 970007239U KR 2019950019138 U KR2019950019138 U KR 2019950019138U KR 19950019138 U KR19950019138 U KR 19950019138U KR 970007239 U KR970007239 U KR 970007239U
- Authority
- KR
- South Korea
- Prior art keywords
- semiconductor package
- package
- semiconductor
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
- H01L23/49816—Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/02—Bonding areas ; Manufacturing methods related thereto
- H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR2019950019138U KR0128205Y1 (en) | 1995-07-28 | 1995-07-28 | Semiconductor package |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR2019950019138U KR0128205Y1 (en) | 1995-07-28 | 1995-07-28 | Semiconductor package |
Publications (2)
Publication Number | Publication Date |
---|---|
KR970007239U true KR970007239U (en) | 1997-02-21 |
KR0128205Y1 KR0128205Y1 (en) | 1998-10-15 |
Family
ID=19419487
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR2019950019138U KR0128205Y1 (en) | 1995-07-28 | 1995-07-28 | Semiconductor package |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR0128205Y1 (en) |
-
1995
- 1995-07-28 KR KR2019950019138U patent/KR0128205Y1/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR0128205Y1 (en) | 1998-10-15 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E701 | Decision to grant or registration of patent right | ||
REGI | Registration of establishment | ||
FPAY | Annual fee payment |
Payment date: 20090727 Year of fee payment: 12 |
|
EXPY | Expiration of term |