KR960038715U - Semiconductor package - Google Patents

Semiconductor package

Info

Publication number
KR960038715U
KR960038715U KR2019950009927U KR19950009927U KR960038715U KR 960038715 U KR960038715 U KR 960038715U KR 2019950009927 U KR2019950009927 U KR 2019950009927U KR 19950009927 U KR19950009927 U KR 19950009927U KR 960038715 U KR960038715 U KR 960038715U
Authority
KR
South Korea
Prior art keywords
semiconductor package
package
semiconductor
Prior art date
Application number
KR2019950009927U
Other languages
Korean (ko)
Other versions
KR0125874Y1 (en
Inventor
이상원
Original Assignee
엘지반도체주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 엘지반도체주식회사 filed Critical 엘지반도체주식회사
Priority to KR2019950009927U priority Critical patent/KR0125874Y1/en
Publication of KR960038715U publication Critical patent/KR960038715U/en
Application granted granted Critical
Publication of KR0125874Y1 publication Critical patent/KR0125874Y1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49517—Additional leads
    • H01L23/4952—Additional leads the additional leads being a bump or a wire
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
    • H01L23/49816—Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73253—Bump and layer connectors

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
KR2019950009927U 1995-05-11 1995-05-11 Semiconductor package KR0125874Y1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019950009927U KR0125874Y1 (en) 1995-05-11 1995-05-11 Semiconductor package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019950009927U KR0125874Y1 (en) 1995-05-11 1995-05-11 Semiconductor package

Publications (2)

Publication Number Publication Date
KR960038715U true KR960038715U (en) 1996-12-18
KR0125874Y1 KR0125874Y1 (en) 1998-11-02

Family

ID=19412993

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019950009927U KR0125874Y1 (en) 1995-05-11 1995-05-11 Semiconductor package

Country Status (1)

Country Link
KR (1) KR0125874Y1 (en)

Also Published As

Publication number Publication date
KR0125874Y1 (en) 1998-11-02

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Legal Events

Date Code Title Description
A201 Request for examination
E701 Decision to grant or registration of patent right
REGI Registration of establishment
FPAY Annual fee payment

Payment date: 20050524

Year of fee payment: 8

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