KR960038753U - Semiconductor package - Google Patents

Semiconductor package

Info

Publication number
KR960038753U
KR960038753U KR2019950010012U KR19950010012U KR960038753U KR 960038753 U KR960038753 U KR 960038753U KR 2019950010012 U KR2019950010012 U KR 2019950010012U KR 19950010012 U KR19950010012 U KR 19950010012U KR 960038753 U KR960038753 U KR 960038753U
Authority
KR
South Korea
Prior art keywords
semiconductor package
package
semiconductor
Prior art date
Application number
KR2019950010012U
Other languages
Korean (ko)
Other versions
KR200141168Y1 (en
Inventor
허진구
Original Assignee
엘지반도체주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 엘지반도체주식회사 filed Critical 엘지반도체주식회사
Priority to KR2019950010012U priority Critical patent/KR200141168Y1/en
Publication of KR960038753U publication Critical patent/KR960038753U/en
Application granted granted Critical
Publication of KR200141168Y1 publication Critical patent/KR200141168Y1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
KR2019950010012U 1995-05-12 1995-05-12 Semiconductor package KR200141168Y1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019950010012U KR200141168Y1 (en) 1995-05-12 1995-05-12 Semiconductor package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019950010012U KR200141168Y1 (en) 1995-05-12 1995-05-12 Semiconductor package

Publications (2)

Publication Number Publication Date
KR960038753U true KR960038753U (en) 1996-12-18
KR200141168Y1 KR200141168Y1 (en) 1999-03-20

Family

ID=19413050

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019950010012U KR200141168Y1 (en) 1995-05-12 1995-05-12 Semiconductor package

Country Status (1)

Country Link
KR (1) KR200141168Y1 (en)

Also Published As

Publication number Publication date
KR200141168Y1 (en) 1999-03-20

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Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
AMND Amendment
E601 Decision to refuse application
J201 Request for trial against refusal decision

Free format text: TRIAL AGAINST DECISION OF REJECTION FOR APPEAL AGAINST DECISION TO DECLINE REFUSAL

B701 Decision to grant
REGI Registration of establishment
FPAY Annual fee payment

Payment date: 20051118

Year of fee payment: 8

LAPS Lapse due to unpaid annual fee