KR970019769U - Semiconductor package - Google Patents

Semiconductor package

Info

Publication number
KR970019769U
KR970019769U KR2019950030854U KR19950030854U KR970019769U KR 970019769 U KR970019769 U KR 970019769U KR 2019950030854 U KR2019950030854 U KR 2019950030854U KR 19950030854 U KR19950030854 U KR 19950030854U KR 970019769 U KR970019769 U KR 970019769U
Authority
KR
South Korea
Prior art keywords
semiconductor package
package
semiconductor
Prior art date
Application number
KR2019950030854U
Other languages
Korean (ko)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to KR2019950030854U priority Critical patent/KR970019769U/en
Publication of KR970019769U publication Critical patent/KR970019769U/en

Links

KR2019950030854U 1995-10-28 1995-10-28 Semiconductor package KR970019769U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019950030854U KR970019769U (en) 1995-10-28 1995-10-28 Semiconductor package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019950030854U KR970019769U (en) 1995-10-28 1995-10-28 Semiconductor package

Publications (1)

Publication Number Publication Date
KR970019769U true KR970019769U (en) 1997-05-26

Family

ID=60903101

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019950030854U KR970019769U (en) 1995-10-28 1995-10-28 Semiconductor package

Country Status (1)

Country Link
KR (1) KR970019769U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100487464B1 (en) * 1997-12-12 2005-08-10 삼성전자주식회사 Semiconductor chip package using lead frame

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100487464B1 (en) * 1997-12-12 2005-08-10 삼성전자주식회사 Semiconductor chip package using lead frame

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Legal Events

Date Code Title Description
WITN Withdrawal due to no request for examination