KR970046956U - Semiconductor package - Google Patents

Semiconductor package

Info

Publication number
KR970046956U
KR970046956U KR2019950055215U KR19950055215U KR970046956U KR 970046956 U KR970046956 U KR 970046956U KR 2019950055215 U KR2019950055215 U KR 2019950055215U KR 19950055215 U KR19950055215 U KR 19950055215U KR 970046956 U KR970046956 U KR 970046956U
Authority
KR
South Korea
Prior art keywords
semiconductor package
package
semiconductor
Prior art date
Application number
KR2019950055215U
Other languages
Korean (ko)
Other versions
KR0134168Y1 (en
Inventor
이현규
Original Assignee
엘지반도체 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 엘지반도체 주식회사 filed Critical 엘지반도체 주식회사
Priority to KR2019950055215U priority Critical patent/KR0134168Y1/en
Publication of KR970046956U publication Critical patent/KR970046956U/en
Application granted granted Critical
Publication of KR0134168Y1 publication Critical patent/KR0134168Y1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L24/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H01L2224/13001—Core members of the bump connector
    • H01L2224/1302—Disposition
    • H01L2224/13026—Disposition relative to the bonding area, e.g. bond pad, of the semiconductor or solid-state body

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Lead Frames For Integrated Circuits (AREA)
KR2019950055215U 1995-12-30 1995-12-30 Semiconductor package KR0134168Y1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019950055215U KR0134168Y1 (en) 1995-12-30 1995-12-30 Semiconductor package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019950055215U KR0134168Y1 (en) 1995-12-30 1995-12-30 Semiconductor package

Publications (2)

Publication Number Publication Date
KR970046956U true KR970046956U (en) 1997-07-31
KR0134168Y1 KR0134168Y1 (en) 1999-01-15

Family

ID=19443641

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019950055215U KR0134168Y1 (en) 1995-12-30 1995-12-30 Semiconductor package

Country Status (1)

Country Link
KR (1) KR0134168Y1 (en)

Also Published As

Publication number Publication date
KR0134168Y1 (en) 1999-01-15

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Legal Events

Date Code Title Description
A201 Request for examination
E701 Decision to grant or registration of patent right
REGI Registration of establishment
FPAY Annual fee payment

Payment date: 20090921

Year of fee payment: 12

LAPS Lapse due to unpaid annual fee