KR950028709U - Alignment device for semiconductor package - Google Patents

Alignment device for semiconductor package

Info

Publication number
KR950028709U
KR950028709U KR2019940006376U KR19940006376U KR950028709U KR 950028709 U KR950028709 U KR 950028709U KR 2019940006376 U KR2019940006376 U KR 2019940006376U KR 19940006376 U KR19940006376 U KR 19940006376U KR 950028709 U KR950028709 U KR 950028709U
Authority
KR
South Korea
Prior art keywords
semiconductor package
alignment device
alignment
package
semiconductor
Prior art date
Application number
KR2019940006376U
Other languages
Korean (ko)
Other versions
KR0119716Y1 (en
Inventor
곽노권
Original Assignee
주식회사한미
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사한미 filed Critical 주식회사한미
Priority to KR2019940006376U priority Critical patent/KR0119716Y1/en
Publication of KR950028709U publication Critical patent/KR950028709U/en
Application granted granted Critical
Publication of KR0119716Y1 publication Critical patent/KR0119716Y1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67333—Trays for chips

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manipulator (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR2019940006376U 1994-03-29 1994-03-29 Apparatus for arranging the semiconductor package KR0119716Y1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019940006376U KR0119716Y1 (en) 1994-03-29 1994-03-29 Apparatus for arranging the semiconductor package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019940006376U KR0119716Y1 (en) 1994-03-29 1994-03-29 Apparatus for arranging the semiconductor package

Publications (2)

Publication Number Publication Date
KR950028709U true KR950028709U (en) 1995-10-20
KR0119716Y1 KR0119716Y1 (en) 1998-08-01

Family

ID=19379864

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019940006376U KR0119716Y1 (en) 1994-03-29 1994-03-29 Apparatus for arranging the semiconductor package

Country Status (1)

Country Link
KR (1) KR0119716Y1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115561060A (en) * 2022-09-02 2023-01-03 嘉兴市扬佳科技合伙企业(有限合伙) Test equipment of spacer for semiconductor packaging

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115561060A (en) * 2022-09-02 2023-01-03 嘉兴市扬佳科技合伙企业(有限合伙) Test equipment of spacer for semiconductor packaging

Also Published As

Publication number Publication date
KR0119716Y1 (en) 1998-08-01

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Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
REGI Registration of establishment
FPAY Annual fee payment

Payment date: 20070223

Year of fee payment: 10

LAPS Lapse due to unpaid annual fee