KR960025464U - Semiconductor package - Google Patents

Semiconductor package

Info

Publication number
KR960025464U
KR960025464U KR2019940033835U KR19940033835U KR960025464U KR 960025464 U KR960025464 U KR 960025464U KR 2019940033835 U KR2019940033835 U KR 2019940033835U KR 19940033835 U KR19940033835 U KR 19940033835U KR 960025464 U KR960025464 U KR 960025464U
Authority
KR
South Korea
Prior art keywords
semiconductor package
package
semiconductor
Prior art date
Application number
KR2019940033835U
Other languages
Korean (ko)
Other versions
KR0117716Y1 (en
Inventor
문두환
박인규
Original Assignee
아남산업 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 아남산업 주식회사 filed Critical 아남산업 주식회사
Priority to KR2019940033835U priority Critical patent/KR0117716Y1/en
Publication of KR960025464U publication Critical patent/KR960025464U/en
Application granted granted Critical
Publication of KR0117716Y1 publication Critical patent/KR0117716Y1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
KR2019940033835U 1994-12-13 1994-12-13 Semiconductor package KR0117716Y1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019940033835U KR0117716Y1 (en) 1994-12-13 1994-12-13 Semiconductor package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019940033835U KR0117716Y1 (en) 1994-12-13 1994-12-13 Semiconductor package

Publications (2)

Publication Number Publication Date
KR960025464U true KR960025464U (en) 1996-07-22
KR0117716Y1 KR0117716Y1 (en) 1998-04-24

Family

ID=19401131

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019940033835U KR0117716Y1 (en) 1994-12-13 1994-12-13 Semiconductor package

Country Status (1)

Country Link
KR (1) KR0117716Y1 (en)

Also Published As

Publication number Publication date
KR0117716Y1 (en) 1998-04-24

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Legal Events

Date Code Title Description
A201 Request for examination
E701 Decision to grant or registration of patent right
REGI Registration of establishment
FPAY Annual fee payment

Payment date: 20090213

Year of fee payment: 12

EXPY Expiration of term