KR960025523U - Semiconductor package - Google Patents

Semiconductor package

Info

Publication number
KR960025523U
KR960025523U KR2019940039546U KR19940039546U KR960025523U KR 960025523 U KR960025523 U KR 960025523U KR 2019940039546 U KR2019940039546 U KR 2019940039546U KR 19940039546 U KR19940039546 U KR 19940039546U KR 960025523 U KR960025523 U KR 960025523U
Authority
KR
South Korea
Prior art keywords
semiconductor package
package
semiconductor
Prior art date
Application number
KR2019940039546U
Other languages
Korean (ko)
Other versions
KR0119088Y1 (en
Inventor
홍성학
Original Assignee
현대전자산업주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 현대전자산업주식회사 filed Critical 현대전자산업주식회사
Priority to KR2019940039546U priority Critical patent/KR0119088Y1/en
Publication of KR960025523U publication Critical patent/KR960025523U/en
Application granted granted Critical
Publication of KR0119088Y1 publication Critical patent/KR0119088Y1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
KR2019940039546U 1994-12-31 1994-12-31 Semiconductor package KR0119088Y1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019940039546U KR0119088Y1 (en) 1994-12-31 1994-12-31 Semiconductor package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019940039546U KR0119088Y1 (en) 1994-12-31 1994-12-31 Semiconductor package

Publications (2)

Publication Number Publication Date
KR960025523U true KR960025523U (en) 1996-07-22
KR0119088Y1 KR0119088Y1 (en) 1998-07-01

Family

ID=19405619

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019940039546U KR0119088Y1 (en) 1994-12-31 1994-12-31 Semiconductor package

Country Status (1)

Country Link
KR (1) KR0119088Y1 (en)

Also Published As

Publication number Publication date
KR0119088Y1 (en) 1998-07-01

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Legal Events

Date Code Title Description
A201 Request for examination
E701 Decision to grant or registration of patent right
REGI Registration of establishment
FPAY Annual fee payment

Payment date: 20090223

Year of fee payment: 12

EXPY Expiration of term