KR950004831U - Semiconductor package lead forming device - Google Patents

Semiconductor package lead forming device

Info

Publication number
KR950004831U
KR950004831U KR2019930013798U KR930013798U KR950004831U KR 950004831 U KR950004831 U KR 950004831U KR 2019930013798 U KR2019930013798 U KR 2019930013798U KR 930013798 U KR930013798 U KR 930013798U KR 950004831 U KR950004831 U KR 950004831U
Authority
KR
South Korea
Prior art keywords
semiconductor package
forming device
lead forming
package lead
semiconductor
Prior art date
Application number
KR2019930013798U
Other languages
Korean (ko)
Other versions
KR960000466Y1 (en
Inventor
곽노권
Original Assignee
주식회사 한미금형
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 한미금형 filed Critical 주식회사 한미금형
Priority to KR2019930013798U priority Critical patent/KR960000466Y1/en
Publication of KR950004831U publication Critical patent/KR950004831U/en
Application granted granted Critical
Publication of KR960000466Y1 publication Critical patent/KR960000466Y1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
KR2019930013798U 1993-07-23 1993-07-23 Lead correction device of package KR960000466Y1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019930013798U KR960000466Y1 (en) 1993-07-23 1993-07-23 Lead correction device of package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019930013798U KR960000466Y1 (en) 1993-07-23 1993-07-23 Lead correction device of package

Publications (2)

Publication Number Publication Date
KR950004831U true KR950004831U (en) 1995-02-18
KR960000466Y1 KR960000466Y1 (en) 1996-01-10

Family

ID=19359701

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019930013798U KR960000466Y1 (en) 1993-07-23 1993-07-23 Lead correction device of package

Country Status (1)

Country Link
KR (1) KR960000466Y1 (en)

Also Published As

Publication number Publication date
KR960000466Y1 (en) 1996-01-10

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