KR970025795U - 반도체 배선층의 접촉부 - Google Patents

반도체 배선층의 접촉부

Info

Publication number
KR970025795U
KR970025795U KR2019950035797U KR19950035797U KR970025795U KR 970025795 U KR970025795 U KR 970025795U KR 2019950035797 U KR2019950035797 U KR 2019950035797U KR 19950035797 U KR19950035797 U KR 19950035797U KR 970025795 U KR970025795 U KR 970025795U
Authority
KR
South Korea
Prior art keywords
wiring layer
layer contacts
semiconductor wiring
semiconductor
contacts
Prior art date
Application number
KR2019950035797U
Other languages
English (en)
Other versions
KR0140083Y1 (ko
Inventor
임근식
Original Assignee
엘지반도체주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 엘지반도체주식회사 filed Critical 엘지반도체주식회사
Priority to KR2019950035797U priority Critical patent/KR0140083Y1/ko
Publication of KR970025795U publication Critical patent/KR970025795U/ko
Application granted granted Critical
Publication of KR0140083Y1 publication Critical patent/KR0140083Y1/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76801—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing
    • H01L21/76802—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing by forming openings in dielectrics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76801—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing
    • H01L21/76829—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing characterised by the formation of thin functional dielectric layers, e.g. dielectric etch-stop, barrier, capping or liner layers
    • H01L21/76831—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing characterised by the formation of thin functional dielectric layers, e.g. dielectric etch-stop, barrier, capping or liner layers in via holes or trenches, e.g. non-conductive sidewall liners
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
    • H01L21/76877—Filling of holes, grooves or trenches, e.g. vias, with conductive material

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
KR2019950035797U 1995-11-25 1995-11-25 반도체 배선층의 접촉부 KR0140083Y1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019950035797U KR0140083Y1 (ko) 1995-11-25 1995-11-25 반도체 배선층의 접촉부

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019950035797U KR0140083Y1 (ko) 1995-11-25 1995-11-25 반도체 배선층의 접촉부

Publications (2)

Publication Number Publication Date
KR970025795U true KR970025795U (ko) 1997-06-20
KR0140083Y1 KR0140083Y1 (ko) 1999-04-15

Family

ID=19430408

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019950035797U KR0140083Y1 (ko) 1995-11-25 1995-11-25 반도체 배선층의 접촉부

Country Status (1)

Country Link
KR (1) KR0140083Y1 (ko)

Also Published As

Publication number Publication date
KR0140083Y1 (ko) 1999-04-15

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