KR970019735U - Chuck for sputtering deposition of semiconductor manufacturing equipment - Google Patents

Chuck for sputtering deposition of semiconductor manufacturing equipment

Info

Publication number
KR970019735U
KR970019735U KR2019950027954U KR19950027954U KR970019735U KR 970019735 U KR970019735 U KR 970019735U KR 2019950027954 U KR2019950027954 U KR 2019950027954U KR 19950027954 U KR19950027954 U KR 19950027954U KR 970019735 U KR970019735 U KR 970019735U
Authority
KR
South Korea
Prior art keywords
chuck
semiconductor manufacturing
manufacturing equipment
sputtering deposition
sputtering
Prior art date
Application number
KR2019950027954U
Other languages
Korean (ko)
Other versions
KR200152539Y1 (en
Inventor
이현우
Original Assignee
엘지반도체주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 엘지반도체주식회사 filed Critical 엘지반도체주식회사
Priority to KR2019950027954U priority Critical patent/KR200152539Y1/en
Publication of KR970019735U publication Critical patent/KR970019735U/en
Application granted granted Critical
Publication of KR200152539Y1 publication Critical patent/KR200152539Y1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50—Substrate holders
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3488—Constructional details of particle beam apparatus not otherwise provided for, e.g. arrangement, mounting, housing, environment; special provisions for cleaning or maintenance of the apparatus

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
KR2019950027954U 1995-10-06 1995-10-06 Chuck for sputtering deposition of semiconductor fabricating system KR200152539Y1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019950027954U KR200152539Y1 (en) 1995-10-06 1995-10-06 Chuck for sputtering deposition of semiconductor fabricating system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019950027954U KR200152539Y1 (en) 1995-10-06 1995-10-06 Chuck for sputtering deposition of semiconductor fabricating system

Publications (2)

Publication Number Publication Date
KR970019735U true KR970019735U (en) 1997-05-26
KR200152539Y1 KR200152539Y1 (en) 1999-07-15

Family

ID=19425414

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019950027954U KR200152539Y1 (en) 1995-10-06 1995-10-06 Chuck for sputtering deposition of semiconductor fabricating system

Country Status (1)

Country Link
KR (1) KR200152539Y1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20000030079A (en) * 1999-10-18 2000-06-05 김명규 Structure of chuck to catch semiconductor weiper

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20000030079A (en) * 1999-10-18 2000-06-05 김명규 Structure of chuck to catch semiconductor weiper

Also Published As

Publication number Publication date
KR200152539Y1 (en) 1999-07-15

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Legal Events

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A201 Request for examination
E902 Notification of reason for refusal
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E701 Decision to grant or registration of patent right
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FPAY Annual fee payment

Payment date: 20050322

Year of fee payment: 7

LAPS Lapse due to unpaid annual fee