KR970046599U - Wafer chuck - Google Patents

Wafer chuck

Info

Publication number
KR970046599U
KR970046599U KR2019950046269U KR19950046269U KR970046599U KR 970046599 U KR970046599 U KR 970046599U KR 2019950046269 U KR2019950046269 U KR 2019950046269U KR 19950046269 U KR19950046269 U KR 19950046269U KR 970046599 U KR970046599 U KR 970046599U
Authority
KR
South Korea
Prior art keywords
wafer chuck
chuck
wafer
Prior art date
Application number
KR2019950046269U
Other languages
Korean (ko)
Other versions
KR200152649Y1 (en
Inventor
송경섭
Original Assignee
엘지반도체주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 엘지반도체주식회사 filed Critical 엘지반도체주식회사
Priority to KR2019950046269U priority Critical patent/KR200152649Y1/en
Publication of KR970046599U publication Critical patent/KR970046599U/en
Application granted granted Critical
Publication of KR200152649Y1 publication Critical patent/KR200152649Y1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68735—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile
KR2019950046269U 1995-12-23 1995-12-23 Wafer chuck KR200152649Y1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019950046269U KR200152649Y1 (en) 1995-12-23 1995-12-23 Wafer chuck

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019950046269U KR200152649Y1 (en) 1995-12-23 1995-12-23 Wafer chuck

Publications (2)

Publication Number Publication Date
KR970046599U true KR970046599U (en) 1997-07-31
KR200152649Y1 KR200152649Y1 (en) 1999-07-15

Family

ID=19437492

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019950046269U KR200152649Y1 (en) 1995-12-23 1995-12-23 Wafer chuck

Country Status (1)

Country Link
KR (1) KR200152649Y1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102492533B1 (en) 2017-09-21 2023-01-30 삼성전자주식회사 Support substrate, Method of fabricating a semiconductor Package and Method of fabricating an electronic device

Also Published As

Publication number Publication date
KR200152649Y1 (en) 1999-07-15

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Legal Events

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