KR970004478B1 - Manufacturing method of semiconductor device - Google Patents
Manufacturing method of semiconductor device Download PDFInfo
- Publication number
- KR970004478B1 KR970004478B1 KR93027233A KR930027233A KR970004478B1 KR 970004478 B1 KR970004478 B1 KR 970004478B1 KR 93027233 A KR93027233 A KR 93027233A KR 930027233 A KR930027233 A KR 930027233A KR 970004478 B1 KR970004478 B1 KR 970004478B1
- Authority
- KR
- South Korea
- Prior art keywords
- molecular weight
- silylation
- photoresist film
- forming
- semiconductor device
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
The present invention provides a method of making a semiconductor device which can enhance contrast by performing a silylation twice with a silicon source of large molecular weight and a silicon of small molecular weight, thus forming a microscopic pattern. The inventive method includes the steps of forming a photoresist film; performing a first silylation on the photoresist film by using a silicon source with a large molecular weight; performing a second silylation on the photoresist film by using a silicon source with a small molecular weight to form a silylation layer on the exposed region; and forming a photoresist pattern by removing the photoresist film's non-exposed region.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR93027233A KR970004478B1 (en) | 1993-12-10 | 1993-12-10 | Manufacturing method of semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR93027233A KR970004478B1 (en) | 1993-12-10 | 1993-12-10 | Manufacturing method of semiconductor device |
Publications (2)
Publication Number | Publication Date |
---|---|
KR950021028A KR950021028A (en) | 1995-07-26 |
KR970004478B1 true KR970004478B1 (en) | 1997-03-28 |
Family
ID=19370560
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR93027233A KR970004478B1 (en) | 1993-12-10 | 1993-12-10 | Manufacturing method of semiconductor device |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR970004478B1 (en) |
-
1993
- 1993-12-10 KR KR93027233A patent/KR970004478B1/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR950021028A (en) | 1995-07-26 |
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