KR970001004B1 - 수명경보기능을 구비한 스패터링타겟 - Google Patents

수명경보기능을 구비한 스패터링타겟 Download PDF

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Publication number
KR970001004B1
KR970001004B1 KR1019940008918A KR19940008918A KR970001004B1 KR 970001004 B1 KR970001004 B1 KR 970001004B1 KR 1019940008918 A KR1019940008918 A KR 1019940008918A KR 19940008918 A KR19940008918 A KR 19940008918A KR 970001004 B1 KR970001004 B1 KR 970001004B1
Authority
KR
South Korea
Prior art keywords
sputtering target
sputtering
gas component
target
gas
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1019940008918A
Other languages
English (en)
Korean (ko)
Inventor
스스무 사와다
준이치 아난
히로키 나카무라
요시히로 사카야
Original Assignee
나가시마 카즈나리
카부시키카이샤 재팬에너지
진구지 오사무
오키덴키코교 카부시키카이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 나가시마 카즈나리, 카부시키카이샤 재팬에너지, 진구지 오사무, 오키덴키코교 카부시키카이샤 filed Critical 나가시마 카즈나리
Application granted granted Critical
Publication of KR970001004B1 publication Critical patent/KR970001004B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32917—Plasma diagnostics
    • H01J37/32935—Monitoring and controlling tubes by information coming from the object and/or discharge

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
KR1019940008918A 1993-04-28 1994-04-27 수명경보기능을 구비한 스패터링타겟 Expired - Fee Related KR970001004B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP93-125067 1993-04-28
JP5125067A JPH08176808A (ja) 1993-04-28 1993-04-28 寿命警報機能を備えたスパッタリングタ−ゲット

Publications (1)

Publication Number Publication Date
KR970001004B1 true KR970001004B1 (ko) 1997-01-25

Family

ID=14901005

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019940008918A Expired - Fee Related KR970001004B1 (ko) 1993-04-28 1994-04-27 수명경보기능을 구비한 스패터링타겟

Country Status (6)

Country Link
US (1) US5487823A (enExample)
EP (1) EP0622823B1 (enExample)
JP (1) JPH08176808A (enExample)
KR (1) KR970001004B1 (enExample)
DE (1) DE69404372T2 (enExample)
TW (1) TW286413B (enExample)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6179975B1 (en) * 1996-10-02 2001-01-30 National Semiconductor Corporation Method of monitoring target/component consumption for dual use titanium/titanium nitride sputtering
WO2002014571A2 (en) * 2000-08-17 2002-02-21 Tosoh Smd, Inc. High purity sputter targets with target end-of-life indication and method of manufacture
EP1556526B1 (en) * 2002-10-21 2009-03-11 Cabot Corporation Method of forming a sputtering target assembly and assembly made therefrom
US6702930B1 (en) 2003-05-08 2004-03-09 Seagate Technology Llc Method and means for enhancing utilization of sputtering targets
US20050178653A1 (en) * 2004-02-17 2005-08-18 Charles Fisher Method for elimination of sputtering into the backing plate of a target/backing plate assembly
US7282122B2 (en) * 2004-03-26 2007-10-16 Taiwan Semiconductor Manufacturing Company Method and system for target lifetime
US20060081459A1 (en) * 2004-10-18 2006-04-20 Applied Materials, Inc. In-situ monitoring of target erosion
US8795486B2 (en) * 2005-09-26 2014-08-05 Taiwan Semiconductor Manufacturing Company, Ltd. PVD target with end of service life detection capability
US7891536B2 (en) 2005-09-26 2011-02-22 Taiwan Semiconductor Manufacturing Co., Ltd. PVD target with end of service life detection capability
JP4560500B2 (ja) * 2005-09-26 2010-10-13 台湾積體電路製造股▲ふん▼有限公司 スラブの寿命検出方法
CN100529160C (zh) * 2005-09-26 2009-08-19 台湾积体电路制造股份有限公司 可消耗材料的厚板及物理气相沉积靶材料
US20070068796A1 (en) * 2005-09-26 2007-03-29 Taiwan Semiconductor Manufacturing Co., Ltd. Method of using a target having end of service life detection capability
US9127362B2 (en) 2005-10-31 2015-09-08 Applied Materials, Inc. Process kit and target for substrate processing chamber
US20070125646A1 (en) * 2005-11-25 2007-06-07 Applied Materials, Inc. Sputtering target for titanium sputtering chamber
US8968536B2 (en) * 2007-06-18 2015-03-03 Applied Materials, Inc. Sputtering target having increased life and sputtering uniformity
US7901552B2 (en) 2007-10-05 2011-03-08 Applied Materials, Inc. Sputtering target with grooves and intersecting channels
DE102010052341B4 (de) * 2010-11-25 2015-02-12 Von Ardenne Gmbh Schutzvorrichtung an Rohrtargets
TWI470103B (zh) * 2011-10-27 2015-01-21 Solar Applied Mat Tech Corp 具有警示功能之濺鍍靶材
CN103088304A (zh) * 2011-10-28 2013-05-08 光洋应用材料科技股份有限公司 具有警示功能的溅镀靶材
US20130206589A1 (en) * 2012-02-14 2013-08-15 Solar Applied Materials Technology Corp. Sputtering Target Having Alarm Function
JP2013185230A (ja) * 2012-03-09 2013-09-19 Solar Applied Materials Technology Corp アラーム機能を有するスパッタリングターゲット
US10060023B2 (en) 2012-10-19 2018-08-28 Infineon Technologies Ag Backing plate for a sputter target, sputter target, and sputter device
CN102994970B (zh) * 2012-11-16 2014-12-10 京东方科技集团股份有限公司 一种靶材使用检测系统和方法
CN106032565A (zh) * 2015-03-11 2016-10-19 北京北方微电子基地设备工艺研究中心有限责任公司 靶材组件及物理气相沉积设备
CN111172507A (zh) * 2020-03-05 2020-05-19 东莞南玻工程玻璃有限公司 平面靶材烧穿报警系统
US11424111B2 (en) * 2020-06-25 2022-08-23 Taiwan Semiconductor Manufacturing Company Limited Sputtering target assembly to prevent overetch of backing plate and methods of using the same

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ATE10512T1 (de) * 1980-08-08 1984-12-15 Battelle Development Corporation Vorrichtung zur beschichtung von substraten mittels hochleistungskathodenzerstaeubung sowie zerstaeuberkathode fuer diese vorrichtung.
US4345968A (en) * 1981-08-27 1982-08-24 Ncr Corporation End point detection using gas flow
US4545882A (en) * 1983-09-02 1985-10-08 Shatterproof Glass Corporation Method and apparatus for detecting sputtering target depletion
DE3630737C1 (de) * 1986-09-10 1987-11-05 Philips & Du Pont Optical Kathodenzerstaeubungseinrichtung mit einer Vorrichtung zur Messung eines kritischen Target-Abtrages
CH669609A5 (enExample) * 1986-12-23 1989-03-31 Balzers Hochvakuum

Also Published As

Publication number Publication date
DE69404372D1 (de) 1997-08-28
US5487823A (en) 1996-01-30
DE69404372T2 (de) 1998-02-26
EP0622823A1 (en) 1994-11-02
TW286413B (enExample) 1996-09-21
EP0622823B1 (en) 1997-07-23
JPH08176808A (ja) 1996-07-09

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