DE69404372D1 - Zerstäubungstarget mit Warneinrichtung - Google Patents
Zerstäubungstarget mit WarneinrichtungInfo
- Publication number
- DE69404372D1 DE69404372D1 DE69404372T DE69404372T DE69404372D1 DE 69404372 D1 DE69404372 D1 DE 69404372D1 DE 69404372 T DE69404372 T DE 69404372T DE 69404372 T DE69404372 T DE 69404372T DE 69404372 D1 DE69404372 D1 DE 69404372D1
- Authority
- DE
- Germany
- Prior art keywords
- warning device
- atomization target
- atomization
- target
- warning
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32917—Plasma diagnostics
- H01J37/32935—Monitoring and controlling tubes by information coming from the object and/or discharge
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5125067A JPH08176808A (ja) | 1993-04-28 | 1993-04-28 | 寿命警報機能を備えたスパッタリングタ−ゲット |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69404372D1 true DE69404372D1 (de) | 1997-08-28 |
DE69404372T2 DE69404372T2 (de) | 1998-02-26 |
Family
ID=14901005
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69404372T Expired - Fee Related DE69404372T2 (de) | 1993-04-28 | 1994-04-27 | Zerstäubungstarget mit Warneinrichtung |
Country Status (6)
Country | Link |
---|---|
US (1) | US5487823A (de) |
EP (1) | EP0622823B1 (de) |
JP (1) | JPH08176808A (de) |
KR (1) | KR970001004B1 (de) |
DE (1) | DE69404372T2 (de) |
TW (1) | TW286413B (de) |
Families Citing this family (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6179975B1 (en) * | 1996-10-02 | 2001-01-30 | National Semiconductor Corporation | Method of monitoring target/component consumption for dual use titanium/titanium nitride sputtering |
DE60142299D1 (de) * | 2000-08-17 | 2010-07-15 | Tosoh Smd Inc | Hochreiner sputtering targets mit indikator zur anzeige des endes der nutzungsdauerfür target und herstellungsverfahren dafür |
ATE425277T1 (de) * | 2002-10-21 | 2009-03-15 | Cabot Corp | Verfahren zur herstellung eines sputtertargets und sputtertarget |
US6702930B1 (en) | 2003-05-08 | 2004-03-09 | Seagate Technology Llc | Method and means for enhancing utilization of sputtering targets |
US20050178653A1 (en) * | 2004-02-17 | 2005-08-18 | Charles Fisher | Method for elimination of sputtering into the backing plate of a target/backing plate assembly |
US7282122B2 (en) * | 2004-03-26 | 2007-10-16 | Taiwan Semiconductor Manufacturing Company | Method and system for target lifetime |
US20060081459A1 (en) * | 2004-10-18 | 2006-04-20 | Applied Materials, Inc. | In-situ monitoring of target erosion |
US8795486B2 (en) | 2005-09-26 | 2014-08-05 | Taiwan Semiconductor Manufacturing Company, Ltd. | PVD target with end of service life detection capability |
US20070068796A1 (en) * | 2005-09-26 | 2007-03-29 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method of using a target having end of service life detection capability |
JP4560500B2 (ja) * | 2005-09-26 | 2010-10-13 | 台湾積體電路製造股▲ふん▼有限公司 | スラブの寿命検出方法 |
US7891536B2 (en) | 2005-09-26 | 2011-02-22 | Taiwan Semiconductor Manufacturing Co., Ltd. | PVD target with end of service life detection capability |
CN100560784C (zh) * | 2005-09-26 | 2009-11-18 | 台湾积体电路制造股份有限公司 | 侦测制程机台使用的消耗性材料厚板寿命的系统及方法 |
US9127362B2 (en) | 2005-10-31 | 2015-09-08 | Applied Materials, Inc. | Process kit and target for substrate processing chamber |
US8647484B2 (en) * | 2005-11-25 | 2014-02-11 | Applied Materials, Inc. | Target for sputtering chamber |
US8968536B2 (en) * | 2007-06-18 | 2015-03-03 | Applied Materials, Inc. | Sputtering target having increased life and sputtering uniformity |
US7901552B2 (en) | 2007-10-05 | 2011-03-08 | Applied Materials, Inc. | Sputtering target with grooves and intersecting channels |
DE102010052341B4 (de) * | 2010-11-25 | 2015-02-12 | Von Ardenne Gmbh | Schutzvorrichtung an Rohrtargets |
TWI470103B (zh) * | 2011-10-27 | 2015-01-21 | Solar Applied Mat Tech Corp | 具有警示功能之濺鍍靶材 |
CN103088304A (zh) * | 2011-10-28 | 2013-05-08 | 光洋应用材料科技股份有限公司 | 具有警示功能的溅镀靶材 |
US20130206589A1 (en) * | 2012-02-14 | 2013-08-15 | Solar Applied Materials Technology Corp. | Sputtering Target Having Alarm Function |
JP2013185230A (ja) * | 2012-03-09 | 2013-09-19 | Solar Applied Materials Technology Corp | アラーム機能を有するスパッタリングターゲット |
US10060023B2 (en) | 2012-10-19 | 2018-08-28 | Infineon Technologies Ag | Backing plate for a sputter target, sputter target, and sputter device |
CN102994970B (zh) * | 2012-11-16 | 2014-12-10 | 京东方科技集团股份有限公司 | 一种靶材使用检测系统和方法 |
CN106032565A (zh) * | 2015-03-11 | 2016-10-19 | 北京北方微电子基地设备工艺研究中心有限责任公司 | 靶材组件及物理气相沉积设备 |
CN111172507A (zh) * | 2020-03-05 | 2020-05-19 | 东莞南玻工程玻璃有限公司 | 平面靶材烧穿报警系统 |
US11424111B2 (en) | 2020-06-25 | 2022-08-23 | Taiwan Semiconductor Manufacturing Company Limited | Sputtering target assembly to prevent overetch of backing plate and methods of using the same |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3069702D1 (en) * | 1980-08-08 | 1985-01-10 | Battelle Development Corp | Apparatus for coating substrates by high-rate cathodic sputtering, as well as sputtering cathode for such apparatus |
US4345968A (en) * | 1981-08-27 | 1982-08-24 | Ncr Corporation | End point detection using gas flow |
US4545882A (en) * | 1983-09-02 | 1985-10-08 | Shatterproof Glass Corporation | Method and apparatus for detecting sputtering target depletion |
DE3630737C1 (de) * | 1986-09-10 | 1987-11-05 | Philips & Du Pont Optical | Kathodenzerstaeubungseinrichtung mit einer Vorrichtung zur Messung eines kritischen Target-Abtrages |
CH669609A5 (de) * | 1986-12-23 | 1989-03-31 | Balzers Hochvakuum |
-
1993
- 1993-04-28 JP JP5125067A patent/JPH08176808A/ja active Pending
-
1994
- 1994-04-23 TW TW083103642A patent/TW286413B/zh active
- 1994-04-26 US US08/233,171 patent/US5487823A/en not_active Expired - Fee Related
- 1994-04-27 KR KR1019940008918A patent/KR970001004B1/ko not_active IP Right Cessation
- 1994-04-27 DE DE69404372T patent/DE69404372T2/de not_active Expired - Fee Related
- 1994-04-27 EP EP94106586A patent/EP0622823B1/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
KR970001004B1 (ko) | 1997-01-25 |
US5487823A (en) | 1996-01-30 |
EP0622823A1 (de) | 1994-11-02 |
DE69404372T2 (de) | 1998-02-26 |
JPH08176808A (ja) | 1996-07-09 |
EP0622823B1 (de) | 1997-07-23 |
TW286413B (de) | 1996-09-21 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |