ATE425277T1 - Verfahren zur herstellung eines sputtertargets und sputtertarget - Google Patents

Verfahren zur herstellung eines sputtertargets und sputtertarget

Info

Publication number
ATE425277T1
ATE425277T1 AT03776474T AT03776474T ATE425277T1 AT E425277 T1 ATE425277 T1 AT E425277T1 AT 03776474 T AT03776474 T AT 03776474T AT 03776474 T AT03776474 T AT 03776474T AT E425277 T1 ATE425277 T1 AT E425277T1
Authority
AT
Austria
Prior art keywords
sputter target
sputtering target
producing
forming
target assembly
Prior art date
Application number
AT03776474T
Other languages
English (en)
Inventor
Charles Wickersham
David Workman
Original Assignee
Cabot Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cabot Corp filed Critical Cabot Corp
Application granted granted Critical
Publication of ATE425277T1 publication Critical patent/ATE425277T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3488—Constructional details of particle beam apparatus not otherwise provided for, e.g. arrangement, mounting, housing, environment; special provisions for cleaning or maintenance of the apparatus
    • H01J37/3491—Manufacturing of targets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21K—MAKING FORGED OR PRESSED METAL PRODUCTS, e.g. HORSE-SHOES, RIVETS, BOLTS OR WHEELS
    • B21K25/00—Uniting components to form integral members, e.g. turbine wheels and shafts, caulks with inserts, with or without shaping of the components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
AT03776474T 2002-10-21 2003-10-20 Verfahren zur herstellung eines sputtertargets und sputtertarget ATE425277T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US41991602P 2002-10-21 2002-10-21

Publications (1)

Publication Number Publication Date
ATE425277T1 true ATE425277T1 (de) 2009-03-15

Family

ID=32176485

Family Applications (1)

Application Number Title Priority Date Filing Date
AT03776474T ATE425277T1 (de) 2002-10-21 2003-10-20 Verfahren zur herstellung eines sputtertargets und sputtertarget

Country Status (10)

Country Link
US (1) US7467741B2 (de)
EP (1) EP1556526B1 (de)
JP (1) JP4768266B2 (de)
KR (1) KR101047722B1 (de)
CN (1) CN100526499C (de)
AT (1) ATE425277T1 (de)
AU (1) AU2003284294A1 (de)
DE (1) DE60326621D1 (de)
TW (1) TWI315747B (de)
WO (1) WO2004038062A2 (de)

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JP5779491B2 (ja) * 2011-12-13 2015-09-16 株式会社アルバック ターゲット装置、スパッタリング装置、ターゲット装置の製造方法
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DE102012210621A1 (de) * 2012-06-22 2013-12-24 Robert Bosch Gmbh Bauteileverbund, Verfahren zum Herstellen eines Bauteileverbunds sowie Verwendung eines Bauteileverbunds
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US9534286B2 (en) * 2013-03-15 2017-01-03 Applied Materials, Inc. PVD target for self-centering process shield
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DE102013015676A1 (de) * 2013-09-23 2015-03-26 Gkn Sinter Metals Holding Gmbh Verfahren zur Herstellung eines Sinterteils mit höhenpräziser Formteilhöhe sowie Teilesatz aus Sinterfügeteilen
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CN104625389A (zh) * 2014-12-22 2015-05-20 有研亿金新材料有限公司 一种集成电路封装材料用铝合金溅射靶材的焊接方法
CN104646821A (zh) * 2015-01-08 2015-05-27 山东大学 一种钛合金与锆合金的气体保护摩擦焊方法
KR102635620B1 (ko) * 2015-07-13 2024-02-08 알베마를 코포레이션 고체 리튬을 금속 기재에 저압 냉간 본딩하는 방법
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EP3632251B1 (de) * 2018-10-04 2023-03-29 Calzaturificio dal Bello S.R.L. Sportschuh und verfahren zur konstruktion davon
CN109578420A (zh) * 2019-01-16 2019-04-05 佛山市巨隆金属制品有限公司 焊接铝螺母及其焊接方法
CN110439941B (zh) * 2019-08-20 2020-12-29 重庆中帝机械制造股份有限公司 高稳定性铸锻式冲焊制动蹄
DE102019134680A1 (de) * 2019-12-17 2021-06-17 Kme Germany Gmbh Verfahren zur Herstellung eines Lotdepots sowie Lotdepot
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Also Published As

Publication number Publication date
US20040079634A1 (en) 2004-04-29
KR20050084863A (ko) 2005-08-29
JP2006508239A (ja) 2006-03-09
KR101047722B1 (ko) 2011-07-08
US7467741B2 (en) 2008-12-23
EP1556526B1 (de) 2009-03-11
TWI315747B (en) 2009-10-11
TW200502416A (en) 2005-01-16
WO2004038062A2 (en) 2004-05-06
CN1726301A (zh) 2006-01-25
JP4768266B2 (ja) 2011-09-07
WO2004038062A3 (en) 2004-12-09
DE60326621D1 (de) 2009-04-23
EP1556526A2 (de) 2005-07-27
AU2003284294A1 (en) 2004-05-13
CN100526499C (zh) 2009-08-12

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