KR960702370A - 지지체상에 평활 표면을 제공하는 방법(method of providing a smooth surface on a substrate) - Google Patents

지지체상에 평활 표면을 제공하는 방법(method of providing a smooth surface on a substrate)

Info

Publication number
KR960702370A
KR960702370A KR1019950705227A KR19950705227A KR960702370A KR 960702370 A KR960702370 A KR 960702370A KR 1019950705227 A KR1019950705227 A KR 1019950705227A KR 19950705227 A KR19950705227 A KR 19950705227A KR 960702370 A KR960702370 A KR 960702370A
Authority
KR
South Korea
Prior art keywords
workpiece
abrasive
structural
value
initial
Prior art date
Application number
KR1019950705227A
Other languages
English (en)
Other versions
KR100327295B1 (ko
Inventor
마이클. 브이. 무치
리챠드 엠. 올슨
Original Assignee
테릴 켄트 퀄리
미네소타 마이닝 앤드 매뉴팩츄어링 컴패니
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 테릴 켄트 퀄리, 미네소타 마이닝 앤드 매뉴팩츄어링 컴패니 filed Critical 테릴 켄트 퀄리
Publication of KR960702370A publication Critical patent/KR960702370A/ko
Application granted granted Critical
Publication of KR100327295B1 publication Critical patent/KR100327295B1/ko

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
    • B24B1/04—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes subjecting the grinding or polishing tools, the abrading or polishing medium or work to vibration, e.g. grinding with ultrasonic frequency
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B35/00—Machines or devices designed for superfinishing surfaces on work, i.e. by means of abrading blocks reciprocating with high frequency

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

본 발명은 가공물의 연마 방법에 관한 것이다. 본 발명의 방법은 (a) 하나이상의 주표면상에 정밀 성형된 연마재 복합재료를 포함하는 구조 연마 제품을 초기 Ra값을 갖는 스크래치 패턴의 표면을 포함하는 가공물과 접촉 상태로 배치시켜 상기 정밀 성형된 연마재 목합재료를 포함한 표면을 상기 가공물 표면과 접촉시키는 단계; 및 (b) 하나이상의 상기 가공물 또는 상기 구조 연마 제품을 서로에 대해서 제1연마 방향으로 이동시키고, 동시에 하나이상의 상기 가공물 또는 상기 구조 연마 제품을 서로에 대해서 제1연마 방향에 평행하지 않은 제2연마 방향으로 이동시켜 상기 복합재료를 포함하는 표면과 상기 가공물 표면 사이의 접촉을 유지하면서 상기 제2연마 방향을 상기 제1연마 방향과 교차시키므로써 상기 초기 Ra값을 감소시키는 단계를 포함하는 가공물의 표면을 연마시키는 방법에 관한 것이다. 특히, 가공물의 표면은 초기 Ra값이 바랍직하게는 약 120㎛이하, 더욱 바람직하게는 약 90㎛ 이하, 가장 바람직하게는 약 20㎛ 이하인 스크래치 패턴을 특징으로 한다.

Description

지지체상에 평활 표면을 제공하는 방법 (METHOD OF PROVIDING A SMOOTH SURFACE ON A SUBSTRATE)
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도 및 제2도는 본 발명의 방법에 유용한 구조 연마 제품의 단면을 예시한다.
제5도는 구조 연마 제품을 사용하여 가공물의 표면상에 연마된 마무리를 얻는데 사용할 수 있는 장치의 한 유형을 예시하는 개략도이다.

Claims (16)

  1. (a) 하나이상의 주표면상에 정밀 성형된 연마재 복합재료를 포함하는 구조 연마 제품을 초기 Ra값을 갖는 스크래치 패턴의 표면을 포함하는 가공물과 접촉 상태로 배치시켜 상기 정밀 성형된 연마재 복합재료를 포함한 표면을 상기 가공물 표면과 접촉시키는 단계; 및 (b) 하나이상의 상기 가공물 또는 상기 구조 연마 제품을 서로에 대해서 제1연마 방향으로 이동시키고, 동시에 하나이상의 상기 가공물 또는 상기 구조 연마 제품을 서로에 대해서 제1연마 방향에 평행하지 않은 제2연마 방향으로 이동시켜 상기 복합재료를 포함하는 표면과 상기 가공물 표면 사이의 접촉을 유지하면서 상기 제2연마 방향을 상기 제1연마 방향과 교차시키므로써 상기 초기 Ra값을 강소시키는 단계를 포함하는 가공물의 표면을 연마시키는 방법.
  2. 제1항에 있어서, 상기 가공물은 회전 축을 지니며, 상기 제1연마 방향으로의 이동은 상기 회전 축을 중심으로 상기 가공울을 회전시키킴으로써 이루어지는 방법.
  3. 제1항에 있어서, 상기 정밀 성형된 연마재 복합재료의 형태가 피라미드형인 방법.
  4. 제1항에 있어서, 상기 구조 연마 제품이 이음매가 없는 벨트 형태인 방법.
  5. 제1항에 있어서, 상기 구조 연마 제품이 2개의 말단을 갖는 테이프 형태인 방법.
  6. 제1항에 있어서, 상기 구조 연마 제품이 고정 상태인 방법.
  7. 제1항에 있어서, 상기 가공물이 고정 상태인 방법.
  8. 제5항에 있어서, 상기 테이프가 인텍스 처리된 것인 방법.
  9. 제1항에 있어서, 상기 접촉압이 약 700kPa 이하인 방법.
  10. 제1항에 있어서, 상기 평행하지 않은 이동은 진폭이 약 0.0l㎝ 내지 약 15㎝인 방법.
  11. 제1항에 있어서, 상기 가공물이 실린더형 제품인 방법.
  12. 제1항에 있어서, 상기 평행하지 않은 이동은 진동수가 1분당 약 1 내지 약 100 진동인 방법.
  13. 제1항에 있어서, 상기 구조 연마 제품이 원추형 또는 피라미드 형태인 연마재 복합재료를 포함하고, 상기 원추형 또는 피라미드의 높이가 약 50 내지 약 350㎛인 방법.
  14. 제13항에 있어서, 상기 가공물이 로우브 형태인 방법.
  15. 제1항에 있어서, 상기 초기 Ra값이 약 20㎛ 이하이고, 약 2㎛ 이하의 값으로 감소되는 방법.
  16. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019950705227A 1993-05-26 1994-04-12 가공부재의표면을연마하는방법 KR100327295B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US6770893A 1993-05-26 1993-05-26
US08/067708 1993-05-26
US08/067,708 1993-05-26
PCT/US1994/003950 WO1994027780A1 (en) 1993-05-26 1994-04-12 Method of providing a smooth surface on a substrate

Publications (2)

Publication Number Publication Date
KR960702370A true KR960702370A (ko) 1996-04-27
KR100327295B1 KR100327295B1 (ko) 2002-08-13

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Family Applications (1)

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Country Status (9)

Country Link
US (1) US5913716A (ko)
EP (1) EP0700326A1 (ko)
JP (1) JPH08510693A (ko)
KR (1) KR100327295B1 (ko)
CN (1) CN1124472A (ko)
AU (1) AU684776B2 (ko)
BR (1) BR9406687A (ko)
CA (1) CA2163761A1 (ko)
WO (1) WO1994027780A1 (ko)

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KR100327295B1 (ko) 2002-08-13
EP0700326A1 (en) 1996-03-13
CN1124472A (zh) 1996-06-12
AU6664994A (en) 1994-12-20
JPH08510693A (ja) 1996-11-12
WO1994027780A1 (en) 1994-12-08
AU684776B2 (en) 1998-01-08
BR9406687A (pt) 1996-02-06
US5913716A (en) 1999-06-22
CA2163761A1 (en) 1994-12-08

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