KR960033179A - 무전해 도금용 레지스트 조성물 - Google Patents

무전해 도금용 레지스트 조성물 Download PDF

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Publication number
KR960033179A
KR960033179A KR1019960004218A KR19960004218A KR960033179A KR 960033179 A KR960033179 A KR 960033179A KR 1019960004218 A KR1019960004218 A KR 1019960004218A KR 19960004218 A KR19960004218 A KR 19960004218A KR 960033179 A KR960033179 A KR 960033179A
Authority
KR
South Korea
Prior art keywords
resist
resist composition
electroless plating
parts
weight
Prior art date
Application number
KR1019960004218A
Other languages
English (en)
Korean (ko)
Inventor
요시쯔구 후나다
고지 마쓰이
Original Assignee
가네꼬 히사시
닛뽕 덴끼 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가네꼬 히사시, 닛뽕 덴끼 가부시끼가이샤 filed Critical 가네꼬 히사시
Publication of KR960033179A publication Critical patent/KR960033179A/ko

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H05K3/184—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method using masks
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C08L63/10—Epoxy resins modified by unsaturated compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemically Coating (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
KR1019960004218A 1955-02-22 1996-02-22 무전해 도금용 레지스트 조성물 KR960033179A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP95-32765 1955-02-22
JP7032765A JPH08228068A (ja) 1995-02-22 1995-02-22 無電解めっき用レジスト組成物

Publications (1)

Publication Number Publication Date
KR960033179A true KR960033179A (ko) 1996-09-17

Family

ID=12367946

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019960004218A KR960033179A (ko) 1955-02-22 1996-02-22 무전해 도금용 레지스트 조성물

Country Status (3)

Country Link
JP (1) JPH08228068A (de)
KR (1) KR960033179A (de)
DE (1) DE19606636A1 (de)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090239079A1 (en) * 2008-03-18 2009-09-24 Mark Wojtaszek Process for Preventing Plating on a Portion of a Molded Plastic Part
EP2360293A1 (de) 2010-02-11 2011-08-24 Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO Verfahren und Vorrichtung zur Ablagerung atomarer Schichten auf einem Substrat
EP2362411A1 (de) 2010-02-26 2011-08-31 Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO Vorrichtung und Verfahren zum reaktiven Ionenätzen
WO2015163053A1 (ja) * 2014-04-25 2015-10-29 太陽インキ製造株式会社 永久絶縁膜用樹脂組成物、永久絶縁膜、多層プリント配線板およびその製造方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2007875A1 (de) * 1968-05-06 1970-01-16 Rca Corp
JPS4875426A (de) * 1972-01-14 1973-10-11
JPS525299B2 (de) * 1972-11-02 1977-02-12
JPS50112231A (de) * 1974-02-15 1975-09-03
JPS574116B2 (de) * 1975-02-07 1982-01-25
JPS52138671A (en) * 1976-05-17 1977-11-18 Hitachi Ltd Method of producing printed circuit substrate
JPS57162391A (en) * 1981-03-31 1982-10-06 Toshiba Chem Prod Copper-lined insulating board
EP0097334B1 (de) * 1982-06-18 1989-05-03 Elektroschmelzwerk Kempten GmbH Verfahren zum dauerhaften Aufbringen von metallischen Schichten auf eine Kunststoffolie und deren Verwendung in autoregenerativen Kondensatoren
JPS6487781A (en) * 1987-09-30 1989-03-31 Canon Kk Partial plating method
JPH03173493A (ja) * 1989-12-01 1991-07-26 Nippon Soda Co Ltd めっきレジスト剥離防止剤
JPH04118992A (ja) * 1990-09-10 1992-04-20 Hitachi Chem Co Ltd プリント配線板の製造方法

Also Published As

Publication number Publication date
DE19606636A1 (de) 1996-08-29
JPH08228068A (ja) 1996-09-03

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A201 Request for examination
E701 Decision to grant or registration of patent right
NORF Unpaid initial registration fee