KR960033179A - Resist composition for electroless plating - Google Patents

Resist composition for electroless plating Download PDF

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Publication number
KR960033179A
KR960033179A KR1019960004218A KR19960004218A KR960033179A KR 960033179 A KR960033179 A KR 960033179A KR 1019960004218 A KR1019960004218 A KR 1019960004218A KR 19960004218 A KR19960004218 A KR 19960004218A KR 960033179 A KR960033179 A KR 960033179A
Authority
KR
South Korea
Prior art keywords
resist
resist composition
electroless plating
parts
weight
Prior art date
Application number
KR1019960004218A
Other languages
Korean (ko)
Inventor
요시쯔구 후나다
고지 마쓰이
Original Assignee
가네꼬 히사시
닛뽕 덴끼 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가네꼬 히사시, 닛뽕 덴끼 가부시끼가이샤 filed Critical 가네꼬 히사시
Publication of KR960033179A publication Critical patent/KR960033179A/en

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H05K3/184—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method using masks
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C08L63/10—Epoxy resins modified by unsaturated compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemically Coating (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

부분 무전해 도금에 사용되는 레지스트 조성물에 있어서, 각각 비공유 전자쌍을 갖는 질소, 인 또는 황을 포함한 적어도 한 화합물이 레지스트 수지 무게를 중량으로 100중량부로 했을 때 중량으로 약 1에서 15중량부정도의 양이 포함되어 있다. 프린트 배선 보드에 전술한 레지스트 조성물을 도포시켜, 부분 도금은 높은 신뢰성으로 수행될 수 있으며, 레지스트 표면위의 불필요한 부분으로 흡착된 촉매의 제거 공정을 포함하여 공정의 수가 줄어들 수 있다.1. A resist composition for use in partial electroless plating, wherein at least one compound containing nitrogen, phosphorus, or sulfur, each having a non-covalent electron pair, is added in an amount of about 1 to 15 parts by weight based on 100 parts by weight of the resist resin . By applying the resist composition described above to the printed wiring board, the partial plating can be performed with high reliability, and the number of processes can be reduced, including the removal process of the catalyst adsorbed to unnecessary portions on the resist surface.

Description

무전해 도금용 레지스트 조성물Resist composition for electroless plating

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is a trivial issue, I did not include the contents of the text.

내용 없음.No content.

Claims (4)

부분 무전해 도금에 사용되는 레지스트 조성물에 있어서, 레지스트 수지와; 질소, 인, 및 황으로부터 선택되고 하나 이상의 비공유 전자쌍을 갖는 하나의 원소를 함유하며 상기 레지스트 수지 100중량부에 대하여 약 1 내지 15중량부로 상기 레지스트 수지에 첨가되는 한 종류 이상의 화합물로 이루어지는 것을 특징으로 하는 레지스트 조성물.1. A resist composition for use in partial electroless plating, comprising: a resist resin; And one or more compounds selected from nitrogen, phosphorus, and sulfur and containing one element having at least one non-covalent electron pair, and about 1 to 15 parts by weight based on 100 parts by weight of the resist resin, . 제1항에 있어서, 상기 화합물들은 각각 물에 난용성인 것을 특징으로 하는 레지스트 조성물.The resist composition according to claim 1, wherein each of the compounds is poorly soluble in water. 제1항에 있어서, 상기 화합물의 녹는 점은 각각 약 100℃ 이상인 것을 특징으로 하는 레지스트 조성물.The resist composition according to claim 1, wherein the melting point of the compound is at least about 100 ° C. 부분 무전해 도금에 사용되는 레지스트 조성물에 있어서, 레지스트 수지의 골격중에 질소, 인 또는 황으로부터 선택된 한 원소 이상을 화학 결합한 상태로 약 3 내지 약 30중량% 함유하는 레지스트 수지로 이루어지는 것을 특징으로 하는 레지스트 조성물.A resist composition for use in partial electroless plating, which comprises a resist resin containing about 3 to about 30% by weight of a skeleton of a resist resin in a chemically bonded state of one or more elements selected from nitrogen, phosphorus, Composition. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: It is disclosed by the contents of the first application.
KR1019960004218A 1955-02-22 1996-02-22 Resist composition for electroless plating KR960033179A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP95-32765 1955-02-22
JP7032765A JPH08228068A (en) 1995-02-22 1995-02-22 Resist composition for electroless plating

Publications (1)

Publication Number Publication Date
KR960033179A true KR960033179A (en) 1996-09-17

Family

ID=12367946

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019960004218A KR960033179A (en) 1955-02-22 1996-02-22 Resist composition for electroless plating

Country Status (3)

Country Link
JP (1) JPH08228068A (en)
KR (1) KR960033179A (en)
DE (1) DE19606636A1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090239079A1 (en) * 2008-03-18 2009-09-24 Mark Wojtaszek Process for Preventing Plating on a Portion of a Molded Plastic Part
EP2360293A1 (en) 2010-02-11 2011-08-24 Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO Method and apparatus for depositing atomic layers on a substrate
EP2362411A1 (en) 2010-02-26 2011-08-31 Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO Apparatus and method for reactive ion etching
JP6580033B2 (en) * 2014-04-25 2019-09-25 太陽インキ製造株式会社 RESIN COMPOSITION FOR PERMANENT INSULATION FILM, PERMANENT INSULATION FILM, MULTILAYER PRINTED WIRING BOARD AND METHOD FOR PRODUCING THE SAME

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1253568A (en) * 1968-05-06 1971-11-17 Rca Corp Formerly Radio Corp O Selective catalytic deposition by controlled poisoning of the catalyst
JPS4875426A (en) * 1972-01-14 1973-10-11
JPS525299B2 (en) * 1972-11-02 1977-02-12
JPS50112231A (en) * 1974-02-15 1975-09-03
JPS574116B2 (en) * 1975-02-07 1982-01-25
JPS52138671A (en) * 1976-05-17 1977-11-18 Hitachi Ltd Method of producing printed circuit substrate
JPS57162391A (en) * 1981-03-31 1982-10-06 Toshiba Chem Prod Copper-lined insulating board
DE3379816D1 (en) * 1982-06-18 1989-06-08 Kempten Elektroschmelz Gmbh Process for the stable deposition of metallic layers on a plastic foil, and their utilization in self-healing capacitors
JPS6487781A (en) * 1987-09-30 1989-03-31 Canon Kk Partial plating method
JPH03173493A (en) * 1989-12-01 1991-07-26 Nippon Soda Co Ltd Plating resist peeling preventive agent
JPH04118992A (en) * 1990-09-10 1992-04-20 Hitachi Chem Co Ltd Manufacture of printed circuit board

Also Published As

Publication number Publication date
DE19606636A1 (en) 1996-08-29
JPH08228068A (en) 1996-09-03

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