JPS50112231A - - Google Patents

Info

Publication number
JPS50112231A
JPS50112231A JP49017567A JP1756774A JPS50112231A JP S50112231 A JPS50112231 A JP S50112231A JP 49017567 A JP49017567 A JP 49017567A JP 1756774 A JP1756774 A JP 1756774A JP S50112231 A JPS50112231 A JP S50112231A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP49017567A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP49017567A priority Critical patent/JPS50112231A/ja
Priority to DE2506150A priority patent/DE2506150C3/en
Publication of JPS50112231A publication Critical patent/JPS50112231A/ja
Priority to US05/747,723 priority patent/US4293592A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H05K3/184—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method using masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0706—Inactivating or removing catalyst, e.g. on surface of resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0713—Plating poison, e.g. for selective plating or for preventing plating on resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1415—Applying catalyst after applying plating resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/426—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in substrates without metal
JP49017567A 1974-02-15 1974-02-15 Pending JPS50112231A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP49017567A JPS50112231A (en) 1974-02-15 1974-02-15
DE2506150A DE2506150C3 (en) 1974-02-15 1975-02-14 Process for the production of printed circuits
US05/747,723 US4293592A (en) 1974-02-15 1976-12-06 Method for production of printed circuits by electroless metal plating

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP49017567A JPS50112231A (en) 1974-02-15 1974-02-15

Publications (1)

Publication Number Publication Date
JPS50112231A true JPS50112231A (en) 1975-09-03

Family

ID=11947478

Family Applications (1)

Application Number Title Priority Date Filing Date
JP49017567A Pending JPS50112231A (en) 1974-02-15 1974-02-15

Country Status (3)

Country Link
US (1) US4293592A (en)
JP (1) JPS50112231A (en)
DE (1) DE2506150C3 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51109226A (en) * 1975-03-24 1976-09-28 Hitachi Ltd BUBUNKAGAKUMETSUKIHO
JPH08199367A (en) * 1995-01-20 1996-08-06 Kenseidou Kagaku Kogyo Kk Formation of contact metallic layer on optional surface part of resin molded good

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08228068A (en) * 1995-02-22 1996-09-03 Nec Corp Resist composition for electroless plating
US4151313A (en) * 1977-03-11 1979-04-24 Hitachi, Ltd. Method for production of printed circuits by electroless metal plating employing a solid solution of metal oxides of titanium, nickel, and antimony as a masking material
JPS605079B2 (en) * 1980-09-02 1985-02-08 株式会社日立製作所 Printed circuit board manufacturing method
JPS6074599A (en) * 1983-09-30 1985-04-26 株式会社日立製作所 Printed circuit board and method of producing same
US4552787A (en) * 1984-02-29 1985-11-12 International Business Machines Corporation Deposition of a metal from an electroless plating composition
US4668532A (en) * 1984-09-04 1987-05-26 Kollmorgen Technologies Corporation System for selective metallization of electronic interconnection boards
US4550036A (en) * 1984-10-18 1985-10-29 Hughes Aircraft Company Electroless silver plating process and system
EP0335565B1 (en) * 1988-03-28 1994-06-15 Hitachi Chemical Co., Ltd. Process for producing printed wiring board
US4940608A (en) * 1988-11-07 1990-07-10 Okuno Chemical Industry Co., Ltd. Local electroless plating process for plastics
JP2666470B2 (en) * 1989-05-09 1997-10-22 日立化成工業株式会社 Electroless plating method
JPH02237197A (en) * 1989-03-10 1990-09-19 Hitachi Ltd Multilayer circuit board and manufacture and use thereof
US5254156A (en) * 1989-05-09 1993-10-19 Hitachi Chemical Company, Ltd. Aqueous solution for activation accelerating treatment
US5080937A (en) * 1989-10-30 1992-01-14 Henkel Corporation Reducing or avoiding pinhole formation in autodeposition
US5118029A (en) * 1989-11-30 1992-06-02 The Furukawa Electric Co., Ltd. Method of forming a solder layer on pads of a circuit board and method of mounting an electronic part on a circuit board
JP2768390B2 (en) * 1990-12-11 1998-06-25 インターナショナル・ビジネス・マシーンズ・コーポレイション Method of conditioning a substrate for electroless metal deposition
US6175084B1 (en) * 1995-04-12 2001-01-16 Denki Kagaku Kogyo Kabushiki Kaisha Metal-base multilayer circuit substrate having a heat conductive adhesive layer
US5659951A (en) * 1996-04-15 1997-08-26 International Business Machines Corporation Method for making printed circuit board with flush surface lands
US20090239079A1 (en) * 2008-03-18 2009-09-24 Mark Wojtaszek Process for Preventing Plating on a Portion of a Molded Plastic Part
EP2124514A1 (en) * 2008-05-23 2009-11-25 Nederlandse Centrale Organisatie Voor Toegepast Natuurwetenschappelijk Onderzoek TNO Providing a plastic substrate with a metallic pattern
US8172627B2 (en) * 2008-12-03 2012-05-08 Tyco Electronics Corporation Electrical connector with plated plug and receptacle
US9699914B2 (en) 2014-10-20 2017-07-04 Averatek Corporation Patterning of electroless metals by selective deactivation of catalysts
ES2727075T5 (en) * 2015-02-23 2022-05-27 Macdermid Enthone Inc Inhibiting composition for frames when chrome-free mordants are used in a galvanizing process on plastic materials
EP3276042B1 (en) * 2015-03-24 2024-01-31 OM Sangyo Co., Ltd. Method for producing plated article

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3202612A (en) * 1960-12-05 1965-08-24 Monsanto Co Composition for bright polishing aluminum
US3269861A (en) * 1963-06-21 1966-08-30 Day Company Method for electroless copper plating
US3443988A (en) * 1965-05-06 1969-05-13 Photocircuits Corp Printed circuits,work holders and method of preventing electroless metal deposition
US3506482A (en) * 1967-04-25 1970-04-14 Matsushita Electric Ind Co Ltd Method of making printed circuits
US3562038A (en) * 1968-05-15 1971-02-09 Shipley Co Metallizing a substrate in a selective pattern utilizing a noble metal colloid catalytic to the metal to be deposited
SE332214B (en) * 1968-07-12 1971-02-01 Gylling & Co
US3640765A (en) * 1969-08-06 1972-02-08 Rca Corp Selective deposition of metal
US3676213A (en) * 1970-03-23 1972-07-11 Welwyn Canada Ltd Process for the selective formation of coatings by electroless deposition

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51109226A (en) * 1975-03-24 1976-09-28 Hitachi Ltd BUBUNKAGAKUMETSUKIHO
JPH08199367A (en) * 1995-01-20 1996-08-06 Kenseidou Kagaku Kogyo Kk Formation of contact metallic layer on optional surface part of resin molded good

Also Published As

Publication number Publication date
US4293592A (en) 1981-10-06
DE2506150A1 (en) 1975-08-28
DE2506150B2 (en) 1977-04-07
DE2506150C3 (en) 1980-11-06

Similar Documents

Publication Publication Date Title
JPS50153572U (en)
JPS50134045U (en)
BG19905A1 (en)
BG20421A1 (en)
BG20686A1 (en)
BG20720A1 (en)
BG20931A1 (en)
BG21057A1 (en)
BG21434A1 (en)
BG21634A1 (en)
BG27087A3 (en)
CH1727074A4 (en)
CH568117A5 (en)
CH570222A5 (en)
CH570338A5 (en)
CH572727A5 (en)
CH573580A5 (en)
CH574660A5 (en)
CH577489A5 (en)
CH578170A5 (en)
CH579668A5 (en)
CH580431A5 (en)
CH581967A5 (en)
CH582312A5 (en)
CH582789A5 (en)