KR960029378A - 절연 필름의 비아 홀의 형성방법 및 절연 필름의 절단 방법 - Google Patents

절연 필름의 비아 홀의 형성방법 및 절연 필름의 절단 방법 Download PDF

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KR960029378A
KR960029378A KR1019940040716A KR19940040716A KR960029378A KR 960029378 A KR960029378 A KR 960029378A KR 1019940040716 A KR1019940040716 A KR 1019940040716A KR 19940040716 A KR19940040716 A KR 19940040716A KR 960029378 A KR960029378 A KR 960029378A
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film
layer
film comprises
laser beam
filler
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KR0139708B1 (en
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벨가셈 하바
유키오 모리시게
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가네코 나오시
닛뽄덴키 가부시키가이샤
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    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
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    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/16—Removal of by-products, e.g. particles or vapours produced during treatment of a workpiece
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    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
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    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
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    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
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    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
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    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
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    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/08—Non-ferrous metals or alloys
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    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/08—Non-ferrous metals or alloys
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/08—Non-ferrous metals or alloys
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/16—Composite materials, e.g. fibre reinforced
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/16—Composite materials, e.g. fibre reinforced
    • B23K2103/166—Multilayered materials
    • B23K2103/172—Multilayered materials wherein at least one of the layers is non-metallic
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    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/18—Dissimilar materials
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    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/30—Organic material
    • B23K2103/42—Plastics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
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    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0112—Absorbing light, e.g. dielectric layer with carbon filler for laser processing
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    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/015—Fluoropolymer, e.g. polytetrafluoroethylene [PTFE]
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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    • H05K2201/01—Dielectrics
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    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
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    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
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    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
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Abstract

유기 절연 필름에 비아 홀(via holes)을 형성하거나 필름을 절단하는 방법은 필름의 소정의 부분을 레이저 빔에 노출시켜노출부분이 변형되거나 분해될 때까지 필름의 노출 부분의 온도를 상승시키는 단계 및 필름을 초음파에 적용시켜 변형되거나 분해된 부분이 분산되도록 하는 단계를 포함한다.

Description

절연 필름의 비아 홀의 형성방법 및 절연 필름의 절단 방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (28)

  1. 유기 절연 필름의 소정의 부분을 레이저 빔에 노출시켜 노출부분이 변형되거나 분해될 때까지 필름의 노출부분의 온도를 상승시키는 단계 및 필름을 초음파에 적용시켜 변형되거나 분해된 부분을 분산시켜 비아 홀(via holes)을형성하는 단계를 포함하는 유기 절연 필름의 비아 홀의 형성방법.
  2. 제1항에 있어서, 레이저 빔이 가시광선 또는 근적외선인 방법.
  3. 제1항에 있어서, 레이저 빔에 대한 흡광도가 큰 층을 형성하는 단계를 추가로 포함하는 방법.
  4. 제3항에 있어서, 층이 스퍼터링(sputtering)에 의해 형성되는 방법.
  5. 제3항에 있어서, 층이 기화에 의해 형성되는 방법.
  6. 제3항에 있어서, 층이 화학적 증착에 의해 형성되는 방법.
  7. 제3항에 있어서, 층이, 나트륨 나프탈렌을 포함하는 액체에 필름을 적용시킴으로써 형성되는 방법.
  8. 제1항에 있어서, 레이저 빔이 필름의 흡수 파장을 갖는 방법.
  9. 제1항에 있어서, 필름이 테플론 수지 기재와 유리 입자 충전재를 포함하는 방법.
  10. 제1항에 있어서, 필름이 폴리이미드 수지를 포함하는 방법.
  11. 제1항에 있어서, 필름이 에폭시 수지를 포함하는 방법.
  12. 제1항에 있어서, 필름이 에폭시 수지 기재와 절연 화합물 입자의 충전재를 포함하는 방법.
  13. 제1항에 있어서, 필름이 폴리이미드 수지 기재와 절연 화합물 입자의 충전재를 포함하는 방법.
  14. 제1항에 있어서, 필름이 테플론 수지 기재와 절연 화합물 입자의 충전재를 포함하는 방법.
  15. 유기 절연 필름의 소정의 부분을 레이저 빔에 노출시켜 노출부분이 변형되거나 분해될 때까지 필름의 노출부분의 온도를 상승시키는 단계 및 필름을 초음파에 적용시켜 변형되거나 분해된 부분을 분산시켜 필름을 절단하는 단계를 포함하는 유기 절연 필름의 절단 방법.
  16. 제15항에 있어서, 레이저 빔이 가시광선 또는 근적외선인 방법.
  17. 제15항에 있어서, 레이저 빔에 대한 흡광도가 큰 층을 형성하는 단계를 추가로 포함하는 방법.
  18. 제17항에 있어서, 층이 스퍼터링에 의해 형성되는 방법.
  19. 제17항에 있어서, 층이 기화에 의해 형성되는 방법.
  20. 제17항에 있어서, 층이 화학적 증착에 의해 형성되는 방법.
  21. 제17항에 있어서, 층이, 나트륨 나프탈렌을 포함하는 액체에 필름을 적용시킴으로써 형성되는 방법.
  22. 제15항에 있어서, 레이저 빔이 필름의 흡수 파장을 갖는 방법.
  23. 제15항에 있어서, 필름이 테플론 수지 기재의 유리 입자 충전재를 포함하는 방법.
  24. 제15항에 있어서, 필름이 폴리이미드 수지를 포함하는 방법.
  25. 제15항에 있어서, 필름이 에폭시 수지를 포함하는 방법.
  26. 제15항에 있어서, 필름이 에폭시 수지 기재와 절연 화합물 입자의 충전재를 포함하는 방법.
  27. 제15항에 있어서, 필름이 폴리이미드 수지 기재와 절연 화합물 입자의 충전재를 포함하는 방법.
  28. 제15항에 있어서, 필름이 테플론 수지 기재와 절연 화합물 입자의 충전재를 포함하는 방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR94040716A 1993-12-28 1994-12-28 Method of forming via holes in an insulation film and method of cutting the insulation film KR0139708B1 (en)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP93-337939 1993-12-28
JP33793993 1993-12-28
JP5083794 1994-03-22
JP94-050837 1994-03-22
JP94-174413 1994-07-26
JP6174413A JP2760288B2 (ja) 1993-12-28 1994-07-26 ビアホール形成法及びフィルム切断法

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KR960029378A true KR960029378A (ko) 1996-08-17
KR0139708B1 KR0139708B1 (en) 1998-07-01

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US5833759A (en) * 1996-11-08 1998-11-10 W. L. Gore & Associates, Inc. Method for preparing vias for subsequent metallization
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DE69424393D1 (de) 2000-06-15
US5628926A (en) 1997-05-13
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EP0661734A3 (en) 1996-11-06
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