KR960019108U - 웨이퍼 처리조 - Google Patents

웨이퍼 처리조

Info

Publication number
KR960019108U
KR960019108U KR2019940031153U KR19940031153U KR960019108U KR 960019108 U KR960019108 U KR 960019108U KR 2019940031153 U KR2019940031153 U KR 2019940031153U KR 19940031153 U KR19940031153 U KR 19940031153U KR 960019108 U KR960019108 U KR 960019108U
Authority
KR
South Korea
Prior art keywords
processing tank
wafer processing
wafer
tank
processing
Prior art date
Application number
KR2019940031153U
Other languages
English (en)
Other versions
KR0125239Y1 (ko
Inventor
윤철수
Original Assignee
엘지반도체주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 엘지반도체주식회사 filed Critical 엘지반도체주식회사
Priority to KR2019940031153U priority Critical patent/KR0125239Y1/ko
Publication of KR960019108U publication Critical patent/KR960019108U/ko
Application granted granted Critical
Publication of KR0125239Y1 publication Critical patent/KR0125239Y1/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
KR2019940031153U 1994-11-24 1994-11-24 웨이퍼 처리조 KR0125239Y1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019940031153U KR0125239Y1 (ko) 1994-11-24 1994-11-24 웨이퍼 처리조

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019940031153U KR0125239Y1 (ko) 1994-11-24 1994-11-24 웨이퍼 처리조

Publications (2)

Publication Number Publication Date
KR960019108U true KR960019108U (ko) 1996-06-19
KR0125239Y1 KR0125239Y1 (ko) 1999-02-18

Family

ID=19398946

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019940031153U KR0125239Y1 (ko) 1994-11-24 1994-11-24 웨이퍼 처리조

Country Status (1)

Country Link
KR (1) KR0125239Y1 (ko)

Also Published As

Publication number Publication date
KR0125239Y1 (ko) 1999-02-18

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Legal Events

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Payment date: 20050524

Year of fee payment: 8

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