KR960012419A - 시료검사장치에 있어서의 시료반송방법 및 시료반송장치 - Google Patents

시료검사장치에 있어서의 시료반송방법 및 시료반송장치 Download PDF

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Publication number
KR960012419A
KR960012419A KR1019950023964A KR19950023964A KR960012419A KR 960012419 A KR960012419 A KR 960012419A KR 1019950023964 A KR1019950023964 A KR 1019950023964A KR 19950023964 A KR19950023964 A KR 19950023964A KR 960012419 A KR960012419 A KR 960012419A
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KR
South Korea
Prior art keywords
sample
inspection apparatus
sample carrying
carrying device
carrying method
Prior art date
Application number
KR1019950023964A
Other languages
English (en)
Other versions
KR100196457B1 (ko
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of KR960012419A publication Critical patent/KR960012419A/ko
Application granted granted Critical
Publication of KR100196457B1 publication Critical patent/KR100196457B1/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
    • B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
    • B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
    • B07C5/36—Sorting apparatus characterised by the means used for distribution
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/859—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector involving monitoring, e.g. feedback loop
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01039—Yttrium [Y]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S209/00—Classifying, separating, and assorting solids
    • Y10S209/922—Miscellaneous feed conveyors
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S209/00—Classifying, separating, and assorting solids
    • Y10S209/939—Video scanning

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Wire Bonding (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1019950023964A 1994-09-27 1995-08-03 부분 tert-부톡시화 폴리(p-히드록시스티렌)의 제조방법 KR100196457B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP25603294A JP3245507B2 (ja) 1994-09-27 1994-09-27 試料検査装置における試料搬送方法及び試料搬送装置
JP94-271909 1994-09-30

Publications (2)

Publication Number Publication Date
KR960012419A true KR960012419A (ko) 1996-04-20
KR100196457B1 KR100196457B1 (ko) 1999-06-15

Family

ID=17286976

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019950023964A KR100196457B1 (ko) 1994-09-27 1995-08-03 부분 tert-부톡시화 폴리(p-히드록시스티렌)의 제조방법

Country Status (4)

Country Link
US (1) US5772040A (ko)
JP (1) JP3245507B2 (ko)
KR (1) KR100196457B1 (ko)
TW (1) TW414365U (ko)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000118681A (ja) * 1998-10-19 2000-04-25 Shinkawa Ltd トレイ搬送装置及び方法
US6563904B2 (en) * 2000-12-01 2003-05-13 Fmc Technologies, Inc. Apparatus and method for detecting and removing undesirable material from workpieces
DE10210033A1 (de) * 2002-03-07 2003-10-02 Agro Federkernproduktion Ek Verfahren zur Herstellung eines Federkerns und Vorrichtung zur Durchführung des Verfahrens
FR2856088B1 (fr) * 2003-06-11 2005-09-09 Cie Du Sol Outil de fraisage pour la realisation de tranchees, permettant un changement rapide de la tete de coupe
US7232070B2 (en) * 2004-06-10 2007-06-19 Lockheed Martin Corporation Chemical/biological hazard trigger with automatic mail piece tagging system and method
US8175548B2 (en) * 2005-03-30 2012-05-08 Freescale Semiconductor, Inc. Method and device for transmitting a sequence of transmission bursts
KR100909944B1 (ko) * 2007-08-02 2009-07-29 이용원 실체 현미경을 이용한 렌즈 검사 시스템
JP5680005B2 (ja) 2012-02-24 2015-03-04 株式会社東芝 コネクタの嵌合状態を検査する検査方法および検査装置、並びにコネクタを有する電気機器の組立方法
KR101326098B1 (ko) 2013-01-21 2013-11-06 주식회사 아이비에스 와이어 본딩 검사방법

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3623603A (en) * 1967-08-31 1971-11-30 Western Electric Co Magnetic identification and separation of small parts
DE2726454B2 (de) * 1977-06-11 1979-08-23 Hoesch Werke Ag, 4600 Dortmund Verfahren zum Kennzeichnen von bewegten Tafeln und Bändern
DE3325125C1 (de) * 1983-07-12 1985-02-14 Erwin Sick Gmbh Optik-Elektronik, 7808 Waldkirch Anordnung zur Markierung von Fehlstellen an schnell laufenden Materialbahnen
US4851902A (en) * 1986-10-29 1989-07-25 Electroplating Engineers Of Japan, Limited Auatomatic inspection system for IC lead frames and visual inspection method thereof
DE3638430A1 (de) * 1986-11-11 1988-05-19 Multitest Elektronische Syst Vorrichtung zum testen und sortieren von elektronischen bauelementen, insbesondere ic's
JPH01249181A (ja) * 1988-03-31 1989-10-04 Tdk Corp チップ部品自動外観選別機における部品仕分け方法
US4926118A (en) * 1988-02-22 1990-05-15 Sym-Tek Systems, Inc. Test station
US5168218A (en) * 1990-06-01 1992-12-01 Rich Donald S Tray-to-tray circuit package handler
JP2921937B2 (ja) * 1990-07-18 1999-07-19 東京エレクトロン株式会社 Ｉｃ検査装置
JP2981942B2 (ja) * 1991-12-02 1999-11-22 株式会社新川 ボンデイングワイヤ検査方法

Also Published As

Publication number Publication date
KR100196457B1 (ko) 1999-06-15
JP3245507B2 (ja) 2002-01-15
US5772040A (en) 1998-06-30
TW414365U (en) 2000-12-01
JPH0897264A (ja) 1996-04-12

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