KR960006331U - 반도체 제조장치의 패키지 리이드 성형다이 - Google Patents

반도체 제조장치의 패키지 리이드 성형다이

Info

Publication number
KR960006331U
KR960006331U KR2019940016250U KR19940016250U KR960006331U KR 960006331 U KR960006331 U KR 960006331U KR 2019940016250 U KR2019940016250 U KR 2019940016250U KR 19940016250 U KR19940016250 U KR 19940016250U KR 960006331 U KR960006331 U KR 960006331U
Authority
KR
South Korea
Prior art keywords
semiconductor manufacturing
manufacturing equipment
forming die
lead forming
package lead
Prior art date
Application number
KR2019940016250U
Other languages
English (en)
Other versions
KR200161174Y1 (ko
Inventor
이준섭
Original Assignee
현대반도체주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 현대반도체주식회사 filed Critical 현대반도체주식회사
Priority to KR2019940016250U priority Critical patent/KR200161174Y1/ko
Publication of KR960006331U publication Critical patent/KR960006331U/ko
Application granted granted Critical
Publication of KR200161174Y1 publication Critical patent/KR200161174Y1/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
KR2019940016250U 1994-07-02 1994-07-02 반도체 제조장치의 패키지 리이드 성형다이 KR200161174Y1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019940016250U KR200161174Y1 (ko) 1994-07-02 1994-07-02 반도체 제조장치의 패키지 리이드 성형다이

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019940016250U KR200161174Y1 (ko) 1994-07-02 1994-07-02 반도체 제조장치의 패키지 리이드 성형다이

Publications (2)

Publication Number Publication Date
KR960006331U true KR960006331U (ko) 1996-02-17
KR200161174Y1 KR200161174Y1 (ko) 1999-11-15

Family

ID=19387454

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019940016250U KR200161174Y1 (ko) 1994-07-02 1994-07-02 반도체 제조장치의 패키지 리이드 성형다이

Country Status (1)

Country Link
KR (1) KR200161174Y1 (ko)

Also Published As

Publication number Publication date
KR200161174Y1 (ko) 1999-11-15

Similar Documents

Publication Publication Date Title
KR960015805A (ko) 반도체 장치의 제조 방법
KR960006331U (ko) 반도체 제조장치의 패키지 리이드 성형다이
KR970025854U (ko) 반도체 패키지 제조장비의 포밍펀치
KR960009211A (ko) 반도체장치의 제조방법
KR950031491U (ko) 반도체 패키지의 다이 본딩 구조
KR970046998U (ko) 반도체 제조장비의 트림/포밍 다이
KR970025823U (ko) 반도체 패키지 제조용 와이어 본딩 장비의 캐피러리
KR960035608U (ko) 반도체 제조장치의 와이어 본딩장치
KR960003146U (ko) 반도체 리드프레임의 댐버다이
KR960015637U (ko) 기판실장형 반도체 패키지
KR970046865U (ko) 반도체패키지 제조용 트림/포밍장비의 리드프레임 이송장치
KR960025515U (ko) 반도체 제조용 리드프레임
KR970046769U (ko) 반도체 제조장비의 몰딩 및 성형장치
KR970003276U (ko) 반도체 제조장비의 패키지 배출부 슈트 덮개구조
KR970046976U (ko) 반도체패키지용 리드프레임 구조
KR970011225U (ko) 반도체 패키지의 리드프레임 구조
KR960027798U (ko) 반도체 팩키지의 리이드 성형장치
KR950028679U (ko) 반도체 패키지의 와이어 본딩용 금형
KR960025509U (ko) 반도체 제조장비에 있어서의 패키지 가이드
KR970025856U (ko) 반도체 패키지 제조장비의 흡착 블록
KR970046864U (ko) 반도체패키지 제조용 트림/포밍장비의 과부하시 동력 차단장치
KR970025874U (ko) 반도체 패키지 마킹장비의 마킹구조
KR970052837U (ko) 반도체 패키지 제조용 와이어본딩 장비의 와이어 스풀구조
KR970025835U (ko) 반도체 패키지 제조장비의 트림다이 고정홀더
KR960003105U (ko) 반도체금형의 펀치

Legal Events

Date Code Title Description
A201 Request for examination
E701 Decision to grant or registration of patent right
REGI Registration of establishment
FPAY Annual fee payment

Payment date: 20080728

Year of fee payment: 10

EXPY Expiration of term