KR970052837U - 반도체 패키지 제조용 와이어본딩 장비의 와이어 스풀구조 - Google Patents

반도체 패키지 제조용 와이어본딩 장비의 와이어 스풀구조

Info

Publication number
KR970052837U
KR970052837U KR2019960034290U KR19960034290U KR970052837U KR 970052837 U KR970052837 U KR 970052837U KR 2019960034290 U KR2019960034290 U KR 2019960034290U KR 19960034290 U KR19960034290 U KR 19960034290U KR 970052837 U KR970052837 U KR 970052837U
Authority
KR
South Korea
Prior art keywords
wire
semiconductor package
package manufacturing
bonding equipment
spool structure
Prior art date
Application number
KR2019960034290U
Other languages
English (en)
Other versions
KR200155460Y1 (ko
Inventor
김송학
Original Assignee
아남반도체주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 아남반도체주식회사 filed Critical 아남반도체주식회사
Priority to KR2019960034290U priority Critical patent/KR200155460Y1/ko
Publication of KR970052837U publication Critical patent/KR970052837U/ko
Application granted granted Critical
Publication of KR200155460Y1 publication Critical patent/KR200155460Y1/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/786—Means for supplying the connector to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
KR2019960034290U 1996-10-18 1996-10-18 반도체 패키지 제조용 와이어본딩 장비의 와이어 스풀구조 KR200155460Y1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019960034290U KR200155460Y1 (ko) 1996-10-18 1996-10-18 반도체 패키지 제조용 와이어본딩 장비의 와이어 스풀구조

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019960034290U KR200155460Y1 (ko) 1996-10-18 1996-10-18 반도체 패키지 제조용 와이어본딩 장비의 와이어 스풀구조

Publications (2)

Publication Number Publication Date
KR970052837U true KR970052837U (ko) 1997-09-08
KR200155460Y1 KR200155460Y1 (ko) 1999-09-01

Family

ID=19469967

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019960034290U KR200155460Y1 (ko) 1996-10-18 1996-10-18 반도체 패키지 제조용 와이어본딩 장비의 와이어 스풀구조

Country Status (1)

Country Link
KR (1) KR200155460Y1 (ko)

Also Published As

Publication number Publication date
KR200155460Y1 (ko) 1999-09-01

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