KR950031491U - 반도체 패키지의 다이 본딩 구조 - Google Patents

반도체 패키지의 다이 본딩 구조

Info

Publication number
KR950031491U
KR950031491U KR2019940009173U KR19940009173U KR950031491U KR 950031491 U KR950031491 U KR 950031491U KR 2019940009173 U KR2019940009173 U KR 2019940009173U KR 19940009173 U KR19940009173 U KR 19940009173U KR 950031491 U KR950031491 U KR 950031491U
Authority
KR
South Korea
Prior art keywords
semiconductor package
die bonding
bonding structure
die
package
Prior art date
Application number
KR2019940009173U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to KR2019940009173U priority Critical patent/KR950031491U/ko
Publication of KR950031491U publication Critical patent/KR950031491U/ko
Priority to KR1019970015776A priority patent/KR100214567B1/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
    • H01L2224/83101—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus as prepeg comprising a layer connector, e.g. provided in an insulating plate member

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
KR2019940009173U 1994-04-28 1994-04-28 반도체 패키지의 다이 본딩 구조 KR950031491U (ko)

Priority Applications (2)

Application Number Priority Date Filing Date Title
KR2019940009173U KR950031491U (ko) 1994-04-28 1994-04-28 반도체 패키지의 다이 본딩 구조
KR1019970015776A KR100214567B1 (ko) 1994-04-28 1997-04-26 반도체 패키지의 다이 본딩 구조 및 그 방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019940009173U KR950031491U (ko) 1994-04-28 1994-04-28 반도체 패키지의 다이 본딩 구조

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1019970015776A Division KR100214567B1 (ko) 1994-04-28 1997-04-26 반도체 패키지의 다이 본딩 구조 및 그 방법

Publications (1)

Publication Number Publication Date
KR950031491U true KR950031491U (ko) 1995-11-22

Family

ID=19382016

Family Applications (2)

Application Number Title Priority Date Filing Date
KR2019940009173U KR950031491U (ko) 1994-04-28 1994-04-28 반도체 패키지의 다이 본딩 구조
KR1019970015776A KR100214567B1 (ko) 1994-04-28 1997-04-26 반도체 패키지의 다이 본딩 구조 및 그 방법

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1019970015776A KR100214567B1 (ko) 1994-04-28 1997-04-26 반도체 패키지의 다이 본딩 구조 및 그 방법

Country Status (1)

Country Link
KR (2) KR950031491U (ko)

Also Published As

Publication number Publication date
KR100214567B1 (ko) 1999-08-02

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Legal Events

Date Code Title Description
U125 Withdrawal of application by converted application