KR950021468U - 반도체 패키지의 다이 본드 구조 - Google Patents

반도체 패키지의 다이 본드 구조

Info

Publication number
KR950021468U
KR950021468U KR2019930028827U KR930028827U KR950021468U KR 950021468 U KR950021468 U KR 950021468U KR 2019930028827 U KR2019930028827 U KR 2019930028827U KR 930028827 U KR930028827 U KR 930028827U KR 950021468 U KR950021468 U KR 950021468U
Authority
KR
South Korea
Prior art keywords
die
semiconductor package
bond structure
bond
package
Prior art date
Application number
KR2019930028827U
Other languages
English (en)
Other versions
KR970001141Y1 (ko
Inventor
조재원
Original Assignee
금성일렉트론 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 금성일렉트론 주식회사 filed Critical 금성일렉트론 주식회사
Priority to KR2019930028827U priority Critical patent/KR970001141Y1/ko
Publication of KR950021468U publication Critical patent/KR950021468U/ko
Application granted granted Critical
Publication of KR970001141Y1 publication Critical patent/KR970001141Y1/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
KR2019930028827U 1993-12-21 1993-12-21 반도체 패키지의 다이 본드 구조 KR970001141Y1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019930028827U KR970001141Y1 (ko) 1993-12-21 1993-12-21 반도체 패키지의 다이 본드 구조

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019930028827U KR970001141Y1 (ko) 1993-12-21 1993-12-21 반도체 패키지의 다이 본드 구조

Publications (2)

Publication Number Publication Date
KR950021468U true KR950021468U (ko) 1995-07-28
KR970001141Y1 KR970001141Y1 (ko) 1997-02-18

Family

ID=19371917

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019930028827U KR970001141Y1 (ko) 1993-12-21 1993-12-21 반도체 패키지의 다이 본드 구조

Country Status (1)

Country Link
KR (1) KR970001141Y1 (ko)

Also Published As

Publication number Publication date
KR970001141Y1 (ko) 1997-02-18

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