KR980005402U - 반도체 와이어 본딩장치 - Google Patents
반도체 와이어 본딩장치Info
- Publication number
- KR980005402U KR980005402U KR2019960019296U KR19960019296U KR980005402U KR 980005402 U KR980005402 U KR 980005402U KR 2019960019296 U KR2019960019296 U KR 2019960019296U KR 19960019296 U KR19960019296 U KR 19960019296U KR 980005402 U KR980005402 U KR 980005402U
- Authority
- KR
- South Korea
- Prior art keywords
- wire bonding
- bonding device
- semiconductor wire
- semiconductor
- wire
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019960019296U KR200150930Y1 (ko) | 1996-06-29 | 1996-06-29 | 반도체 와이어 본딩장치 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019960019296U KR200150930Y1 (ko) | 1996-06-29 | 1996-06-29 | 반도체 와이어 본딩장치 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR980005402U true KR980005402U (ko) | 1998-03-30 |
| KR200150930Y1 KR200150930Y1 (ko) | 1999-07-15 |
Family
ID=19460483
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR2019960019296U KR200150930Y1 (ko) | 1996-06-29 | 1996-06-29 | 반도체 와이어 본딩장치 |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR200150930Y1 (ko) |
-
1996
- 1996-06-29 KR KR2019960019296U patent/KR200150930Y1/ko not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| KR200150930Y1 (ko) | 1999-07-15 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A201 | Request for examination | ||
| E701 | Decision to grant or registration of patent right | ||
| REGI | Registration of establishment | ||
| FPAY | Annual fee payment |
Payment date: 20050318 Year of fee payment: 7 |
|
| LAPS | Lapse due to unpaid annual fee |