KR970064187U - 겐트리 타입 와이어 본딩 장치 - Google Patents

겐트리 타입 와이어 본딩 장치

Info

Publication number
KR970064187U
KR970064187U KR2019960013876U KR19960013876U KR970064187U KR 970064187 U KR970064187 U KR 970064187U KR 2019960013876 U KR2019960013876 U KR 2019960013876U KR 19960013876 U KR19960013876 U KR 19960013876U KR 970064187 U KR970064187 U KR 970064187U
Authority
KR
South Korea
Prior art keywords
wire bonding
bonding device
type wire
gantry type
gantry
Prior art date
Application number
KR2019960013876U
Other languages
English (en)
Other versions
KR200174660Y1 (ko
Inventor
남수근
Original Assignee
삼성항공산업주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 삼성항공산업주식회사 filed Critical 삼성항공산업주식회사
Priority to KR2019960013876U priority Critical patent/KR200174660Y1/ko
Publication of KR970064187U publication Critical patent/KR970064187U/ko
Application granted granted Critical
Publication of KR200174660Y1 publication Critical patent/KR200174660Y1/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/788—Means for moving parts
    • H01L2224/78801—Lower part of the bonding apparatus, e.g. XY table
    • H01L2224/78804—Translational mechanism
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
KR2019960013876U 1996-05-30 1996-05-30 겐트리 타입 와이어 본딩 장치 KR200174660Y1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019960013876U KR200174660Y1 (ko) 1996-05-30 1996-05-30 겐트리 타입 와이어 본딩 장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019960013876U KR200174660Y1 (ko) 1996-05-30 1996-05-30 겐트리 타입 와이어 본딩 장치

Publications (2)

Publication Number Publication Date
KR970064187U true KR970064187U (ko) 1997-12-11
KR200174660Y1 KR200174660Y1 (ko) 2000-03-02

Family

ID=19457371

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019960013876U KR200174660Y1 (ko) 1996-05-30 1996-05-30 겐트리 타입 와이어 본딩 장치

Country Status (1)

Country Link
KR (1) KR200174660Y1 (ko)

Also Published As

Publication number Publication date
KR200174660Y1 (ko) 2000-03-02

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