KR960003107U - 멀티칩 와이어 본딩용 위치분할장치 - Google Patents

멀티칩 와이어 본딩용 위치분할장치

Info

Publication number
KR960003107U
KR960003107U KR2019940015768U KR19940015768U KR960003107U KR 960003107 U KR960003107 U KR 960003107U KR 2019940015768 U KR2019940015768 U KR 2019940015768U KR 19940015768 U KR19940015768 U KR 19940015768U KR 960003107 U KR960003107 U KR 960003107U
Authority
KR
South Korea
Prior art keywords
multichip
positioning device
wire bonding
bonding
wire
Prior art date
Application number
KR2019940015768U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to KR2019940015768U priority Critical patent/KR960003107U/ko
Publication of KR960003107U publication Critical patent/KR960003107U/ko

Links

KR2019940015768U 1994-06-29 1994-06-29 멀티칩 와이어 본딩용 위치분할장치 KR960003107U (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019940015768U KR960003107U (ko) 1994-06-29 1994-06-29 멀티칩 와이어 본딩용 위치분할장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019940015768U KR960003107U (ko) 1994-06-29 1994-06-29 멀티칩 와이어 본딩용 위치분할장치

Publications (1)

Publication Number Publication Date
KR960003107U true KR960003107U (ko) 1996-01-22

Family

ID=60667394

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019940015768U KR960003107U (ko) 1994-06-29 1994-06-29 멀티칩 와이어 본딩용 위치분할장치

Country Status (1)

Country Link
KR (1) KR960003107U (ko)

Similar Documents

Publication Publication Date Title
KR960012388A (ko) 반도체 소자 장착용 패키지
DE59508581D1 (de) Halbleiterbauelement
DE69522789D1 (de) Halbleitervorrichtung
DE69504781D1 (de) Drahtsägevorrichtung
DE69501381D1 (de) Halbleitergerät
DE69513207D1 (de) Halbleitervorrichtung
GB2245902B (en) Bonding wire for semiconductor device
KR960009084A (ko) 반도체장치
KR960003107U (ko) 멀티칩 와이어 본딩용 위치분할장치
KR960009128A (ko) 수지-캡슐화 반도체 장치
KR960006336U (ko) 와이어본딩용 와이어크램프 장치
KR970046974U (ko) 와이어 본딩이 용이한 반도체 장치
KR980005402U (ko) 반도체 와이어 본딩장치
KR950023960U (ko) 와이어 본더의 리드 프레임 클램핑 장치
KR960009225A (ko) 반도체장치
KR970064185U (ko) 와이어본딩 장치
KR950034344U (ko) 와이어 본딩머신의 메가진 장착장치
GB2273716B (en) Bonding wire for semiconductor device
KR950025982U (ko) 인입선용 클램프
KR920005328U (ko) 와이어 본딩용 클램프
KR960009263U (ko) 와이어 본더용 트랜스듀서
KR970046771U (ko) 와이어 본딩 장치
KR970003230U (ko) 와이어 본딩장치
KR960010144U (ko) 전선납땜 장치
KR960019158U (ko) 멀티칩 반도체 장치

Legal Events

Date Code Title Description
WITN Withdrawal due to no request for examination