KR950702339A - 크라운 캐패시터용 제조방법 및 장치(process for producing a dish capacitor) - Google Patents

크라운 캐패시터용 제조방법 및 장치(process for producing a dish capacitor)

Info

Publication number
KR950702339A
KR950702339A KR1019940704838A KR19940704838A KR950702339A KR 950702339 A KR950702339 A KR 950702339A KR 1019940704838 A KR1019940704838 A KR 1019940704838A KR 19940704838 A KR19940704838 A KR 19940704838A KR 950702339 A KR950702339 A KR 950702339A
Authority
KR
South Korea
Prior art keywords
producing
manufacturing
crown capacitors
dish
capacitor
Prior art date
Application number
KR1019940704838A
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of KR950702339A publication Critical patent/KR950702339A/ko

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L28/00Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor
    • H01L28/40Capacitors
    • H01L28/60Electrodes
    • H01L28/82Electrodes with an enlarged surface, e.g. formed by texturisation
    • H01L28/90Electrodes with an enlarged surface, e.g. formed by texturisation having vertical extensions
    • H01L28/91Electrodes with an enlarged surface, e.g. formed by texturisation having vertical extensions made by depositing layers, e.g. by depositing alternating conductive and insulating layers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10BELECTRONIC MEMORY DEVICES
    • H10B12/00Dynamic random access memory [DRAM] devices
    • H10B12/01Manufacture or treatment
    • H10B12/02Manufacture or treatment for one transistor one-capacitor [1T-1C] memory cells
    • H10B12/03Making the capacitor or connections thereto
    • H10B12/033Making the capacitor or connections thereto the capacitor extending over the transistor
    • H10B12/0335Making a connection between the transistor and the capacitor, e.g. plug
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10BELECTRONIC MEMORY DEVICES
    • H10B12/00Dynamic random access memory [DRAM] devices
    • H10B12/30DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells
    • H10B12/31DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells having a storage electrode stacked over the transistor
    • H10B12/318DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells having a storage electrode stacked over the transistor the storage electrode having multiple segments

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Semiconductor Memories (AREA)
KR1019940704838A 1992-06-30 1994-12-30 크라운 캐패시터용 제조방법 및 장치(process for producing a dish capacitor) KR950702339A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE4221431A DE4221431A1 (de) 1992-06-30 1992-06-30 Herstellverfahren für einen Schlüsselkondensator
PCT/DE1993/000551 WO1994000874A1 (de) 1992-06-30 1993-06-24 Herstellungsverfahren für einen schüsselkondensator

Publications (1)

Publication Number Publication Date
KR950702339A true KR950702339A (ko) 1995-06-19

Family

ID=6462140

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019940704838A KR950702339A (ko) 1992-06-30 1994-12-30 크라운 캐패시터용 제조방법 및 장치(process for producing a dish capacitor)

Country Status (6)

Country Link
EP (1) EP0647356A1 (ko)
JP (1) JPH07508136A (ko)
KR (1) KR950702339A (ko)
DE (1) DE4221431A1 (ko)
TW (1) TW230844B (ko)
WO (1) WO1994000874A1 (ko)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5714779A (en) * 1992-06-30 1998-02-03 Siemens Aktiengesellschaft Semiconductor memory device having a transistor, a bit line, a word line and a stacked capacitor
DE4221432C2 (de) * 1992-06-30 1994-06-09 Siemens Ag Globales Planarisierungsverfahren für integrierte Halbleiterschaltungen oder mikromechanische Bauteile
KR950021710A (ko) * 1993-12-01 1995-07-26 김주용 반도체 장치의 캐패시터 제조방법
US5840623A (en) * 1995-10-04 1998-11-24 Advanced Micro Devices, Inc. Efficient and economical method of planarization of multilevel metallization structures in integrated circuits using CMP
JPH10144882A (ja) * 1996-11-13 1998-05-29 Oki Electric Ind Co Ltd 半導体記憶素子のキャパシタ及びその製造方法
WO1998028789A1 (fr) * 1996-12-20 1998-07-02 Hitachi, Ltd. Dispositif memoire a semi-conducteur et procede de fabrication associe
GB2322964B (en) * 1997-03-07 2001-10-17 United Microelectronics Corp Polysilicon CMP process for high-density DRAM cell structures

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2524862B2 (ja) * 1990-05-01 1996-08-14 三菱電機株式会社 半導体記憶装置およびその製造方法
US5162248A (en) * 1992-03-13 1992-11-10 Micron Technology, Inc. Optimized container stacked capacitor DRAM cell utilizing sacrificial oxide deposition and chemical mechanical polishing

Also Published As

Publication number Publication date
JPH07508136A (ja) 1995-09-07
EP0647356A1 (de) 1995-04-12
DE4221431A1 (de) 1994-01-05
WO1994000874A1 (de) 1994-01-06
TW230844B (ko) 1994-09-21

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Legal Events

Date Code Title Description
A201 Request for examination
E701 Decision to grant or registration of patent right
NORF Unpaid initial registration fee