KR950702339A - 크라운 캐패시터용 제조방법 및 장치(process for producing a dish capacitor) - Google Patents
크라운 캐패시터용 제조방법 및 장치(process for producing a dish capacitor)Info
- Publication number
- KR950702339A KR950702339A KR1019940704838A KR19940704838A KR950702339A KR 950702339 A KR950702339 A KR 950702339A KR 1019940704838 A KR1019940704838 A KR 1019940704838A KR 19940704838 A KR19940704838 A KR 19940704838A KR 950702339 A KR950702339 A KR 950702339A
- Authority
- KR
- South Korea
- Prior art keywords
- producing
- manufacturing
- crown capacitors
- dish
- capacitor
- Prior art date
Links
- 239000003990 capacitor Substances 0.000 title 2
- 238000004519 manufacturing process Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L28/00—Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor
- H01L28/40—Capacitors
- H01L28/60—Electrodes
- H01L28/82—Electrodes with an enlarged surface, e.g. formed by texturisation
- H01L28/90—Electrodes with an enlarged surface, e.g. formed by texturisation having vertical extensions
- H01L28/91—Electrodes with an enlarged surface, e.g. formed by texturisation having vertical extensions made by depositing layers, e.g. by depositing alternating conductive and insulating layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B12/00—Dynamic random access memory [DRAM] devices
- H10B12/01—Manufacture or treatment
- H10B12/02—Manufacture or treatment for one transistor one-capacitor [1T-1C] memory cells
- H10B12/03—Making the capacitor or connections thereto
- H10B12/033—Making the capacitor or connections thereto the capacitor extending over the transistor
- H10B12/0335—Making a connection between the transistor and the capacitor, e.g. plug
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B12/00—Dynamic random access memory [DRAM] devices
- H10B12/30—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells
- H10B12/31—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells having a storage electrode stacked over the transistor
- H10B12/318—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells having a storage electrode stacked over the transistor the storage electrode having multiple segments
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Semiconductor Memories (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE4221431A DE4221431A1 (de) | 1992-06-30 | 1992-06-30 | Herstellverfahren für einen Schlüsselkondensator |
PCT/DE1993/000551 WO1994000874A1 (de) | 1992-06-30 | 1993-06-24 | Herstellungsverfahren für einen schüsselkondensator |
Publications (1)
Publication Number | Publication Date |
---|---|
KR950702339A true KR950702339A (ko) | 1995-06-19 |
Family
ID=6462140
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019940704838A KR950702339A (ko) | 1992-06-30 | 1994-12-30 | 크라운 캐패시터용 제조방법 및 장치(process for producing a dish capacitor) |
Country Status (6)
Country | Link |
---|---|
EP (1) | EP0647356A1 (ko) |
JP (1) | JPH07508136A (ko) |
KR (1) | KR950702339A (ko) |
DE (1) | DE4221431A1 (ko) |
TW (1) | TW230844B (ko) |
WO (1) | WO1994000874A1 (ko) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5714779A (en) * | 1992-06-30 | 1998-02-03 | Siemens Aktiengesellschaft | Semiconductor memory device having a transistor, a bit line, a word line and a stacked capacitor |
DE4221432C2 (de) * | 1992-06-30 | 1994-06-09 | Siemens Ag | Globales Planarisierungsverfahren für integrierte Halbleiterschaltungen oder mikromechanische Bauteile |
KR950021710A (ko) * | 1993-12-01 | 1995-07-26 | 김주용 | 반도체 장치의 캐패시터 제조방법 |
US5840623A (en) * | 1995-10-04 | 1998-11-24 | Advanced Micro Devices, Inc. | Efficient and economical method of planarization of multilevel metallization structures in integrated circuits using CMP |
JPH10144882A (ja) * | 1996-11-13 | 1998-05-29 | Oki Electric Ind Co Ltd | 半導体記憶素子のキャパシタ及びその製造方法 |
WO1998028789A1 (fr) * | 1996-12-20 | 1998-07-02 | Hitachi, Ltd. | Dispositif memoire a semi-conducteur et procede de fabrication associe |
GB2322964B (en) * | 1997-03-07 | 2001-10-17 | United Microelectronics Corp | Polysilicon CMP process for high-density DRAM cell structures |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2524862B2 (ja) * | 1990-05-01 | 1996-08-14 | 三菱電機株式会社 | 半導体記憶装置およびその製造方法 |
US5162248A (en) * | 1992-03-13 | 1992-11-10 | Micron Technology, Inc. | Optimized container stacked capacitor DRAM cell utilizing sacrificial oxide deposition and chemical mechanical polishing |
-
1992
- 1992-06-30 DE DE4221431A patent/DE4221431A1/de not_active Withdrawn
-
1993
- 1993-06-12 TW TW082104683A patent/TW230844B/zh active
- 1993-06-24 JP JP6501947A patent/JPH07508136A/ja active Pending
- 1993-06-24 EP EP93912618A patent/EP0647356A1/de not_active Withdrawn
- 1993-06-24 WO PCT/DE1993/000551 patent/WO1994000874A1/de not_active Application Discontinuation
-
1994
- 1994-12-30 KR KR1019940704838A patent/KR950702339A/ko active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
JPH07508136A (ja) | 1995-09-07 |
EP0647356A1 (de) | 1995-04-12 |
DE4221431A1 (de) | 1994-01-05 |
WO1994000874A1 (de) | 1994-01-06 |
TW230844B (ko) | 1994-09-21 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E701 | Decision to grant or registration of patent right | ||
NORF | Unpaid initial registration fee |