KR950030759A - 전자부품실장장치 및 전자부품실장방법 - Google Patents

전자부품실장장치 및 전자부품실장방법 Download PDF

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KR950030759A
KR950030759A KR1019950009289A KR19950009289A KR950030759A KR 950030759 A KR950030759 A KR 950030759A KR 1019950009289 A KR1019950009289 A KR 1019950009289A KR 19950009289 A KR19950009289 A KR 19950009289A KR 950030759 A KR950030759 A KR 950030759A
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circuit board
printed circuit
electronic component
component
holding means
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KR1019950009289A
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KR0145211B1 (ko
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카즈유키 히로타
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모리시타 요이찌
마쯔시다덴기산교 가부시기가이샤
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/20—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve
    • H01R43/205—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve with a panel or printed circuit board
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
    • H01R12/722—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures coupling devices mounted on the edge of the printed circuits
    • H01R12/725—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures coupling devices mounted on the edge of the printed circuits containing contact members presenting a contact carrying strip, e.g. edge-like strip
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T279/00—Chucks or sockets
    • Y10T279/11—Vacuum
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49133—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting
    • Y10T29/49137—Different components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49147—Assembling terminal to base
    • Y10T29/49149—Assembling terminal to base by metal fusion bonding
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178—Chip component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53183—Multilead component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53191—Means to apply vacuum directly to position or hold work part

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

본 발명은, 프린트회로기판의 옆부분에 전자부품의 단자를 장착하는 전자부품실장장치 및 전자부품실장방법에 관한 것으로서, 프린트회로기판을 위치결정수단에 의해 위치결정하고, 프린트회로기판의 옆부분에 장착되는 전자부품을 이재헤드에 의해 부품유지수단에 공급하는 것을 목적으로 한 것이며, 부품유지수단은 전자부품의 단자가 프린트회로기판의 옆부분에 임하는 자세로 전자부품을 유지하고, 이 부품유지수단을 프린트회로기판을 향해서 이동시키고, 전자부품의 단자를 프린트회로기판의 옆부분에 장착하는 것을 특징으로 한 것이며, 이 구성에 의해, 프린트회로기판의 옆부분에 코넥터 등의 전자부품의 단자를 자동 장착할 수 있는 효과가 있다.

Description

전자부품실장치 및 전자부품실장방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 제1의 실시예의 전자부품실장장치의 평면도, 제2도는 동전자부품실장장치의 단면도, 제3도(a)∼(c)는, 동전자부품실장장치의 동작설명도, 제4도는 동전자부품실장장치에 의해 전자부품을 실장한 프린트회로기판의 검사공정의 설명도, 제5도(a)∼(c)는 본 발명의 제2실시예의 전자부품실장장치의 동작설명도.

Claims (8)

  1. 프린트 회로기판을 위치 결정하는 위치결정수단과, 상기 프린트회로기판의 옆부분에 장착되는 전자부품의 단자가 프린트회로기판의 옆부분에 임하는 자세로 전자부품을 유지하는 부품유지수단과, 상기 부품유지수단에 전자부품을 공급하는 공급수단과, 상기 부품유지수단을 프린트회로기판을 향해서 이동시키고, 전자부품의 단자를 프린트회로기판의 옆부분에 장착하는 이동수단을 구비한 것을 특징으로 하는 전자부품실장장치.
  2. 제1항에 있어서, 상기 부품유지수단은, 전자부품의 단자를 프린트회로기판에 임하게 한 자세에 있어서 전자부품의 하부면을 지지하는 평탄부와 상기 전자부품의 배면에 당접하는 수직면을 가진 것을 특징으로 하는 전자부품실장장치.
  3. 제1항에 있어서, 프린트회로기판의 옆부분에 장착되는 전자부품을 수납한 제1의 수납수단과, 상기 프린트 회로기판의 표면에 장착되는 표면실장형전자부품을 수납한 제2의 수납수단을 구비하고, 공급수단은, 상기 제2의 수납수단으로부터 상기 표면실장형전자부품을 흡착해서 상기 프린트회로기판의 표면의 소망위치에 장착하는 이재헤드인 것을 특징으로 하는 전자부품실장장치.
  4. 프린트회로기판을 반송하는 반송수단가, 상기 프린트회로기판의 반송을 반송레벨에 의해 안내하는 1쌍의 안내수단과, 상기 프린트회로기판을 위치결정하는 위치결정수단과, 상기 1쌍의 안내수단사이에 있어서 프린트회로기판의 옆부분에 장착되는 전자부품을 유지하는 부품유지수단과, 상기 부품유지수단을 상기 반송레벨에 진퇴시키는 승강수단과, 상기 부품유지수단을 상기 프린트 회로기판의 옆부분을 향해서 이동시키는 이동수단과, 상기 부품유지수단에 전자부품을 공급하는 공급수단을 구비한 것을 특징으로 하는 전자부품실장장치.
  5. 제4항에 있어서, 위치결정수단은, 프린트회로기판의 하부면을 밑받침하는 밑받침부재를 구비하고, 승강수단은 부품유지수단을 반송레벨에 진입시키는 동시에, 상기 밑받침부재를 상기 프린트회로기판의 하부면에 당접시키도록 한 것을 특징으로 하는 전자부품실장장치.
  6. 제4항에 있어서, 프린트회로기판의 옆부분에 장착되는 전자부품을 수납한 제1의 수납수단과, 상기 프린트 회로기판의 표면에 장착되는 표면실장형전자부품을 수납한 제2의 수납수단을 구비하고, 공급수단은, 상기 제2의 수납수단으로부터 상기 표면실장형전자부품을 흡착해서 상기 프린트회로기판의 표면의 소망위치에 장착하는 이재헤드인 것을 특징으로 하는 전자부품실장장치.
  7. 프린트회로기판을 1쌍의 안내수단에 의해 안내하면서 소정위치로 반송하는 공정과, 상기 소정위치에 도달한 상기 프린트회로기판을 위치결정하는 공정과, 위치결정된 상기 프린트회로기판에 표면실장형전자부품을 탑재하는 공정과, 상기 1쌍의 안내수단사이에 배설된 부품유지수단에, 상기 프린트회로기판의 옆부분에 장착되는 전자부품을 공급하는 공정과, 상기 부품유지수단에 의해서 상기 전자부품을 프린트회로기판의 옆부분에 장착하는 공정을 포함한 것을 특징으로 하는 전자부품의 실장방법.
  8. 프린트회로기판을 1쌍의 안내수단에 의해 안내하면서 소정위치에 반송하는 공정과, 상기 소정위치에 도달한 상기 프린트회로기판을 위치결정하는 공정과, 위치결정된 상기 프린트회로기판에 표면실장형전자부품을 탑재하는 공정과, 상기 1쌍의 안내수단사이에 배설된 부품유지수단에, 상기 프린트회로기판의 옆부분에 장착되는 전자부품을 공급하는 공정과, 상기 부품유지수단에 의해서 상기 전자부품을 프린트회로기판의 옆부분에 장착하는 공정과, 상기 표면실장형전자부품 및 상기 프린트회로기판의 옆부분에 장착된 전자부품을 이 프린터회로기판에 납땜하는 공정과, 상기 납땜된 프린트회로기판의 전기적검사를 행하는 공정을 구비한 것을 특징으로 하는 전자부품의 실장방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개되는 것임.
KR1019950009289A 1994-04-20 1995-04-20 전자부품실장장치 및 전자부품실장방법 KR0145211B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP6081530A JP2929937B2 (ja) 1994-04-20 1994-04-20 電子部品実装装置及び電子部品の実装方法
JP94-81530 1994-04-20

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KR950030759A true KR950030759A (ko) 1995-11-24
KR0145211B1 KR0145211B1 (ko) 1998-10-01

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US (1) US5682675A (ko)
JP (1) JP2929937B2 (ko)
KR (1) KR0145211B1 (ko)
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KR100254323B1 (ko) * 1997-08-01 2000-05-01 윤종용 집적회로 납땜 장치 및 방법
US5964031A (en) * 1997-09-09 1999-10-12 Mcms, Inc. Method for supporting printed circuit board assemblies
CN1700894A (zh) * 2002-10-18 2005-11-23 莫利化学医药公司 使用羊毛硫抗生素治疗干眼病的方法
WO2008102592A1 (ja) * 2007-02-22 2008-08-28 Shibaura Mechatronics Corporation 電子部品の実装装置及び実装方法
JP6467622B2 (ja) * 2014-10-20 2019-02-13 パナソニックＩｐマネジメント株式会社 部品圧着装置
KR20160048301A (ko) * 2014-10-23 2016-05-04 삼성전자주식회사 본딩 장치 및 그를 포함하는 기판 제조 설비
CN105252266B (zh) * 2015-09-22 2017-07-14 宁波神通模塑有限公司 一种油气分离器总成的精分离器装配设备
US10057989B1 (en) * 2017-04-10 2018-08-21 Tactotek Oy Multilayer structure and related method of manufacture for electronics
CN107235313B (zh) * 2017-06-12 2019-02-22 温州职业技术学院 电子接插件自动化上料流水线装备
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CN107864605B (zh) * 2017-12-21 2024-04-05 立昱电子(惠州)有限公司 一种用于反贴机防止产品掉落偏移的校正装置
CN108966527A (zh) * 2018-08-22 2018-12-07 郑州格瑞塔电子信息技术有限公司 一种电子产品生产用便于调节高度的线路板固定装置
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CN1117258A (zh) 1996-02-21
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KR0145211B1 (ko) 1998-10-01
US5682675A (en) 1997-11-04
JPH07297597A (ja) 1995-11-10

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