KR950025907A - 반도체소자의 감광막 형성방법 - Google Patents
반도체소자의 감광막 형성방법 Download PDFInfo
- Publication number
- KR950025907A KR950025907A KR1019940001941A KR19940001941A KR950025907A KR 950025907 A KR950025907 A KR 950025907A KR 1019940001941 A KR1019940001941 A KR 1019940001941A KR 19940001941 A KR19940001941 A KR 19940001941A KR 950025907 A KR950025907 A KR 950025907A
- Authority
- KR
- South Korea
- Prior art keywords
- semiconductor wafer
- photosensitive film
- semiconductor device
- photoresist film
- increased
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims abstract description 7
- 239000004065 semiconductor Substances 0.000 title claims abstract 9
- 229920002120 photoresistant polymer Polymers 0.000 title abstract 3
- 230000005484 gravity Effects 0.000 abstract 1
- 230000010354 integration Effects 0.000 abstract 1
- 230000031700 light absorption Effects 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
- G03F7/162—Coating on a rotating support, e.g. using a whirler or a spinner
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Abstract
본 발명은 반도체 소자의 감광막 형성방법에 관한 것으로서, 표면의 굴곡이 심한 반도체웨이퍼의 정면이 위로 향하도록하여 저속회전시키며 감광막을 도포한후, 상기 반도체웨이퍼의 배면이 위로향하도록 하여 고속회전시켜 회전력 및 중력에 의해 감광수지가 돌출부쪽으로 집중되어 감광막의 돌출부분과 골부분의 두께를 거의 균일하게 형성하였으므로, 후속 노광공정시 광흡수율이 균일하여 임계크기의 균일도가 증가되므로 표면의 굴곡이 심한 반도체 소자에서 신뢰성 및 공정수율이 증가되고, 반도체 소자의 고집적화가 유리하다.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제2도는 본 발명에 따른 감광막 형성방법을 설명하기 위한 개략도.
Claims (1)
- 패턴을 형성하고자 하는 반도체 웨이퍼의 정면이 위로 향하도록하여 저속회전시키며 감광막을 도포하는 공정과, 상기 반도체웨이퍼의 배면이 위로 향하도록한 후 고속회전시켜 반도체 웨이퍼 표면의 굴곡과 무관하게 균일한 두께로 감광막을 형성하는 공정을 구비하는 반도체 소자의 감광막 형성방법.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR94001941A KR970009977B1 (en) | 1994-02-03 | 1994-02-03 | Method of deposisting a photoresist in the semiconductor device |
DE19503388A DE19503388C2 (de) | 1994-02-03 | 1995-02-02 | Photolackfilm-Beschichtungsverfahren |
US08/382,756 US5498449A (en) | 1994-02-03 | 1995-02-02 | Photoresist film coating method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR94001941A KR970009977B1 (en) | 1994-02-03 | 1994-02-03 | Method of deposisting a photoresist in the semiconductor device |
Publications (2)
Publication Number | Publication Date |
---|---|
KR950025907A true KR950025907A (ko) | 1995-09-18 |
KR970009977B1 KR970009977B1 (en) | 1997-06-19 |
Family
ID=19376689
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR94001941A KR970009977B1 (en) | 1994-02-03 | 1994-02-03 | Method of deposisting a photoresist in the semiconductor device |
Country Status (3)
Country | Link |
---|---|
US (1) | US5498449A (ko) |
KR (1) | KR970009977B1 (ko) |
DE (1) | DE19503388C2 (ko) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR0171918B1 (ko) * | 1994-03-25 | 1999-03-30 | 김주용 | 감광수지 코팅 두께 조절방법 및 조절장치 |
US5677001A (en) * | 1996-08-22 | 1997-10-14 | Vanguard International Semiconductor Corporation | Striation-free coating method for high viscosity resist coating |
US6117486A (en) * | 1997-03-31 | 2000-09-12 | Tokyo Electron Limited | Photoresist coating method and apparatus |
US20050046375A1 (en) * | 2002-07-31 | 2005-03-03 | Maslov Boris A. | Software-based adaptive control system for electric motors and generators |
US20050074552A1 (en) * | 2003-10-07 | 2005-04-07 | Howard Ge | Photoresist coating process for microlithography |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3795534A (en) * | 1972-04-19 | 1974-03-05 | Rca Corp | Manufacture of video discs |
DE2816213A1 (de) * | 1977-04-18 | 1978-10-26 | Exxon Research Engineering Co | Verfahren zum schmieren von beruehrungsflaechen bei hohen temperaturen und/oder oxidationsbedingungen sowie schmiermittel zur durchfuehrung des verfahrens |
US4590094A (en) * | 1984-10-29 | 1986-05-20 | International Business Machines Corporation | Inverted apply using bubble dispense |
-
1994
- 1994-02-03 KR KR94001941A patent/KR970009977B1/ko not_active IP Right Cessation
-
1995
- 1995-02-02 DE DE19503388A patent/DE19503388C2/de not_active Expired - Fee Related
- 1995-02-02 US US08/382,756 patent/US5498449A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
DE19503388A1 (de) | 1995-08-10 |
US5498449A (en) | 1996-03-12 |
DE19503388C2 (de) | 2002-08-01 |
KR970009977B1 (en) | 1997-06-19 |
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