KR950018628A - 코발트를 기초로한 합금으로 된 마그네트론 캐소드 스퍼터링(magnetron cathode sputtering) 장치용 타켓 - Google Patents
코발트를 기초로한 합금으로 된 마그네트론 캐소드 스퍼터링(magnetron cathode sputtering) 장치용 타켓 Download PDFInfo
- Publication number
- KR950018628A KR950018628A KR1019940035181A KR19940035181A KR950018628A KR 950018628 A KR950018628 A KR 950018628A KR 1019940035181 A KR1019940035181 A KR 1019940035181A KR 19940035181 A KR19940035181 A KR 19940035181A KR 950018628 A KR950018628 A KR 950018628A
- Authority
- KR
- South Korea
- Prior art keywords
- cobalt
- target
- cathode sputtering
- alloy
- marknetron
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
- 238000004544 sputter deposition Methods 0.000 title claims abstract 8
- 229910000531 Co alloy Inorganic materials 0.000 title claims abstract 6
- 229910017052 cobalt Inorganic materials 0.000 claims abstract 6
- 239000010941 cobalt Substances 0.000 claims abstract 6
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims abstract 6
- 229910045601 alloy Inorganic materials 0.000 claims abstract 5
- 239000000956 alloy Substances 0.000 claims abstract 5
- 229910052751 metal Inorganic materials 0.000 claims abstract 4
- 239000002184 metal Substances 0.000 claims abstract 4
- 238000000034 method Methods 0.000 claims abstract 3
- 239000007787 solid Substances 0.000 claims 3
- 239000013078 crystal Substances 0.000 claims 2
- 239000000203 mixture Substances 0.000 claims 2
- 238000002441 X-ray diffraction Methods 0.000 claims 1
- 238000000137 annealing Methods 0.000 claims 1
- 229910052796 boron Inorganic materials 0.000 claims 1
- 238000005266 casting Methods 0.000 claims 1
- 238000006243 chemical reaction Methods 0.000 claims 1
- 229910052804 chromium Inorganic materials 0.000 claims 1
- 238000013500 data storage Methods 0.000 claims 1
- 229910052735 hafnium Inorganic materials 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 claims 1
- 239000011159 matrix material Substances 0.000 claims 1
- 229910052750 molybdenum Inorganic materials 0.000 claims 1
- 229910052759 nickel Inorganic materials 0.000 claims 1
- 229910052758 niobium Inorganic materials 0.000 claims 1
- 229910052763 palladium Inorganic materials 0.000 claims 1
- 229910052697 platinum Inorganic materials 0.000 claims 1
- 229910052715 tantalum Inorganic materials 0.000 claims 1
- 239000010409 thin film Substances 0.000 claims 1
- 229910052723 transition metal Inorganic materials 0.000 claims 1
- 150000003624 transition metals Chemical class 0.000 claims 1
- 229910052721 tungsten Inorganic materials 0.000 claims 1
- 229910052720 vanadium Inorganic materials 0.000 claims 1
- 238000006482 condensation reaction Methods 0.000 abstract 1
- 238000010587 phase diagram Methods 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
- C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C19/00—Alloys based on nickel or cobalt
- C22C19/07—Alloys based on nickel or cobalt based on cobalt
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physical Vapour Deposition (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE4343440 | 1993-12-20 | ||
| DEP4343440.1 | 1993-12-20 | ||
| DE4410114A DE4410114A1 (de) | 1993-12-20 | 1994-03-24 | Target für Magnetron-Kathodenzerstäubungsanlage aus einer Kobalt-Basislegierung |
| DEP4410114.7 | 1994-03-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR950018628A true KR950018628A (ko) | 1995-07-22 |
Family
ID=6505507
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019940035181A Ceased KR950018628A (ko) | 1993-12-20 | 1994-12-19 | 코발트를 기초로한 합금으로 된 마그네트론 캐소드 스퍼터링(magnetron cathode sputtering) 장치용 타켓 |
Country Status (4)
| Country | Link |
|---|---|
| KR (1) | KR950018628A (cs) |
| DE (2) | DE4410114A1 (cs) |
| MY (1) | MY111460A (cs) |
| TW (1) | TW275131B (cs) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20230024750A (ko) * | 2021-08-12 | 2023-02-21 | 한국과학기술연구원 | 배선 재료용 저저항 필름의 제조 방법 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10017414A1 (de) * | 2000-04-07 | 2001-10-11 | Unaxis Materials Deutschland G | Sputtertarget auf der Basis eines Metalls oder einer Metalllegierung und Verfahren zu dessen Herstellung |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5282946A (en) * | 1991-08-30 | 1994-02-01 | Mitsubishi Materials Corporation | Platinum-cobalt alloy sputtering target and method for manufacturing same |
-
1994
- 1994-03-24 DE DE4410114A patent/DE4410114A1/de not_active Withdrawn
- 1994-08-08 DE DE59405713T patent/DE59405713D1/de not_active Expired - Lifetime
- 1994-10-22 TW TW083109819A patent/TW275131B/zh not_active IP Right Cessation
- 1994-12-19 KR KR1019940035181A patent/KR950018628A/ko not_active Ceased
- 1994-12-20 MY MYPI94003420A patent/MY111460A/en unknown
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20230024750A (ko) * | 2021-08-12 | 2023-02-21 | 한국과학기술연구원 | 배선 재료용 저저항 필름의 제조 방법 |
Also Published As
| Publication number | Publication date |
|---|---|
| DE4410114A1 (de) | 1995-06-22 |
| MY111460A (en) | 2000-05-31 |
| DE59405713D1 (de) | 1998-05-20 |
| TW275131B (cs) | 1996-05-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0109 | Patent application |
Patent event code: PA01091R01D Comment text: Patent Application Patent event date: 19941219 |
|
| PG1501 | Laying open of application | ||
| A201 | Request for examination | ||
| PA0201 | Request for examination |
Patent event code: PA02012R01D Patent event date: 19970819 Comment text: Request for Examination of Application Patent event code: PA02011R01I Patent event date: 19941219 Comment text: Patent Application |
|
| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
Comment text: Notification of reason for refusal Patent event date: 19991115 Patent event code: PE09021S01D |
|
| E601 | Decision to refuse application | ||
| PE0601 | Decision on rejection of patent |
Patent event date: 20000525 Comment text: Decision to Refuse Application Patent event code: PE06012S01D Patent event date: 19991115 Comment text: Notification of reason for refusal Patent event code: PE06011S01I |