KR950000924A - 복합아연 또는 아연합금 전기도금 금속판 및 그 제조 방법 - Google Patents

복합아연 또는 아연합금 전기도금 금속판 및 그 제조 방법 Download PDF

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KR950000924A
KR950000924A KR1019940014725A KR19940014725A KR950000924A KR 950000924 A KR950000924 A KR 950000924A KR 1019940014725 A KR1019940014725 A KR 1019940014725A KR 19940014725 A KR19940014725 A KR 19940014725A KR 950000924 A KR950000924 A KR 950000924A
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야스시 호소다
마사나리 기모또
신야 히끼노
쯔또무 요시다
기요유끼 후꾸이
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나까무라 다메아끼
스미또모 긴조꾸 고교 가부시끼가이샤
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
    • C23C28/32—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one pure metallic layer
    • C23C28/322—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one pure metallic layer only coatings of metal elements only
    • C23C28/3225—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one pure metallic layer only coatings of metal elements only with at least one zinc-based layer
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D15/00—Electrolytic or electrophoretic production of coatings containing embedded materials, e.g. particles, whiskers, wires
    • C25D15/02—Combined electrolytic and electrophoretic processes with charged materials
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
    • C23C28/34—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates
    • C23C28/345—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates with at least one oxide layer
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/22—Electroplating: Baths therefor from solutions of zinc
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12458—All metal or with adjacent metals having composition, density, or hardness gradient
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
    • Y10T428/12542—More than one such component
    • Y10T428/12549—Adjacent to each other
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
    • Y10T428/12556—Organic component
    • Y10T428/12569—Synthetic resin
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
    • Y10T428/12625—Free carbon containing component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12785—Group IIB metal-base component
    • Y10T428/12792—Zn-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12785—Group IIB metal-base component
    • Y10T428/12792—Zn-base component
    • Y10T428/12799—Next to Fe-base component [e.g., galvanized]

Abstract

아연 또는 아연합금 도금 금속판의 내식성을 유지하면서 성형 가공성, 도장후 내식성, 저항 스폿 용접성, 저온 내충격성을 개선한다. 이 아연계 도금 금속판은 금속판의 적어도 한쪽의 표면에 알킨류, 알키놀류, 아민류 혹은 그 염, 티오화합물, 복소환 화합물, 방향족 카르복시산류 혹은 그 염 및 테키스트린으로 형성되는 군에서 선택되는 적어도 1종의 화합물을 총 0.001∼10wt% 함유하는 도금욕중에서의 아연 또는 아연합금 전기도금에 의해 형성된 C함유량 0.001∼10wt%, 부착량 0.5∼20g/㎡의 탄소가 공석된 복합아연 또는 아연합금 도금 피막을 갖고 있다. 이 도금 피막위에 Cr 부착량 10∼200㎎/㎡의 크로메이트 피막과 그위에 0.1∼2㎛두께의 유기 수지 피막을 형성해도 좋다.

Description

복합아연 또는 아연합금 전기도금 금속판 및 그 제조 방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제 1 도는 본 발명의 복함 Zn－Ni 합금 도금 강판의 표면의 단면 방향에 있어서의 C,Zn,Fe,Ni의 각 농도 변화 프로파일의 예을 도시하는 도면.

Claims (10)

  1. 금속판의 적어도 한쪽면에 알킨류, 알키놀류, 아민류 또는 그 염, 티오화합물, 복수환 화합물 및 방향족 카르복시산류 또는 그 염으로 형성된 군에서 선택된 적어도 1종의 화합물을 총 0.001∼10wt% 함유하는 도금욕중에서 아연 또는 아연합금 전기도금을 실시하므로써 상기 적어도 한면에 C함유량 0.001∼10wt%, 부착량 0.5∼200g/㎡의 탄소가 공석된 복합아연 또는 아연합금 도금 피막을 형성하는 것을 특징으로 하는 복합아연 또는 아연합금 도금 전기 금속판의 제조 방법.
  2. 제 1 항에 있어서, 상기 아연 아연합금 전기도금을 오프 시간이 1msec∼ 1sec, 듀티비가 0.5이상의 전류파형의 펄스전류, 또는 주파수 1∼100㎐, 전류 변동폭 ±1∼±50%의 전류파형의 교류를 중첩한 직류 혹은 교류를 중첩한 펄스전류의 통전에 의해 행하는 것을 특징으로 하는 복합아연 또는 아연합금 도금 전기 금속판의 제조 방법.
  3. 제 1 항 또는 제 2 항의 방법에 의해 제조된 C함유량 0.001∼10wt%, 부착량 0.5∼200g/㎡의 탄소가 공석된 복합아연 또는 아연합금 도금 피막을 적어도 한 면에 갖는 것을 특징으로 하는 전기도금 금속판.
  4. 제 3 항에 있어서, 상기 금속판은 강판이고 상기 복합 도금 피막의 부착량은 5∼200g/㎡인 것을 특징으로 하는 전기도금 금속판.
  5. 제 3 항에 있어서, 싱기 금속판은 아연 혹은 알루미늄 또는 이들의 합금의 도금 피막을 갖는 도금 강판이고, 상기 도금 강판의 도금 피막위에 형성된 상기 복합 도금 피막의 부착량 0.5∼20g/㎡인 것을 특징으로 하는 전기도금 금속판.
  6. 제 3 항 내지 제 5 항중 어는 한 항의 전기도금 금속판의 복합아연 또는 아연합금 도금 피막 위에, Cr부착량 10∼200㎎/㎡의 크로메이트 피막과 그위에 0.1∼2㎛ 두께의 유기슈지 피막을 갖는 유기 복합 피복 금속판.
  7. 금속판의 적어도 한면에, C함유량 0.001∼10wt%, 부착량 0.5∼200g/㎡의 금속 합계량에 대해서 0.2wt% 이상의 합금 원소를 함유하고, 탄소가 공석된 복합아연 합금 도금 피막을 갖고, 상기 복합 도금 피막의 표층에 두께 0.1㎛ 이상, 10㎛ 이하의 C농화층을 가지며, 상기 표층 C농화층이 도금 피막의 두께의 5∼50%를 점유하는 것을 특징으로 하는 복합아연 합금 전기도금 금속판.
  8. 금속판의 적어도 한면 위에, C함유량 0.001∼10wt%, 부착량 0.5∼200g/㎡의 금속 합계량에 대해서 0.2∼10wt%의 합금 원소를 함유하고, 탄소가 공석된 복합아연 합금 도금 피막을 갖고, 상기 도금 피막중의 η상의 (00.2)면의 배향성 지수가 0.8이하, (10.1)면의 배향성 지수가 0.2이상인 것을 특징으로 하는 복합아연 합금 전기도금 금속판.
  9. 제 7 항의 전기도금 금속판의 복합아연 합금 도금 피막 위에, Cr 부착량 10∼200㎎/㎡의 크로메이트 피막과, 그위에 0.1∼2㎛ 두께의 유기수지 피막을 갖는 것을 특징으로 하는 유기 복합 피복 금속판.
  10. 제 8 항의 전기도금 금속판의 복합아연 합금 도금 피막 위에, Cr 부착량 10∼200㎎/㎡의 크로메이트 피막과, 그위에 0.1∼2㎛ 두께의 유기수지 피막을 갖는 것을 특징으로 하는 유기 복합 피복 금속판.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019940014725A 1993-06-23 1994-06-23 복합아연 또는 아연합금 전기도금 금속판 및 그 제조방법 KR0166607B1 (ko)

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US5618634A (en) 1997-04-08
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